JPS61267363A - Image sensor - Google Patents

Abstract

PURPOSE:To obtain good optical characteristics by providing a groove on the step surface of the recess of an enclosure, at a position nearer the chip, thereby preventing the adhesive from being forced out inwardly. CONSTITUTION:An image sensor chip 13 is provided on the central bottom surface of the recess 12 of an enclosure 11, a frame-like groove 15 is provided in the step surface 14 of the recess 12 at a position nearer the chip 13, and an optical glass plate 17 is airtightly provided on the step surface 14 of the recess 12 through an adhesive layer 16. In attaching the optical glass plate 17 to the enclosure 11 through the adhesive layer 16, the adhesive layer 16 is forced to flow inwardly because of pressure, but it flows into the groove 15 and can be prevented from further flowing inwardly of the enclosure. With this, the adhesive layer 16 is kept from mounting on the chip 13 owing to a strong shock, so that good optical characteristics can be maintained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor device, and particularly to an image sensor having an improved envelope to which an optical glass plate is bonded.

[Technical background of the invention and its problems]

2. Description of the Related Art Conventionally, image sensors shown in FIGS. 3 and 4 are known. Here, FIG. 3 shows the state before the optical glass plate is integrated with the envelope, and FIG. 4 shows the state after the integration.

1 in the figure is an envelope having a stepped recess (window) 2 at the top. An image sensor chip (hereinafter referred to as a chip) 3 is provided approximately at the center of the recess 2 of the envelope 1. An optical glass plate 6 is airtightly provided on the step surface 4 of the recess 2 of the envelope 1 via an adhesive layer 5. This optical glass plate 6 allows light to be taken in from the outside.

[Problems with background technology]

However, according to the conventional image sensor, since the optical glass root 6 is pressed and sealed against the envelope 1, the adhesive layer 5 between the envelopes 1 of the optical glass plate 6 is inside the envelope 1. Flowing towards.

It will harden eventually (7 in the diagram indicates the hardened adhesive layer)
. If a strong impact is applied to the image sensor, the adhesive layer 7 may peel off and land on the chip 3. This gives an adverse effect I# on the optical properties, leading to the production of products with defective properties.

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an image sensor with good optical characteristics that completely prevents the adhesive layer from protruding inward of the envelope.

[Summary of the invention]

The present invention includes an envelope having a step-like recessed portion 'ftw in the upper part;
In an image sensor that is fully equipped with a chip provided on the bottom surface of the recess in the envelope and an optical glass plate provided on the stepped surface of the recess in the envelope via an adhesive layer, The main idea is that by providing a groove on the step surface of the concave portion closer to the chip, the excess adhesive generated when bonding the optical glass plate to the envelope is received and the optical characteristics are maintained.

[Embodiments of the invention]

j Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 1 and 2.
This will be explained with reference to the figures. Here, FIG. 1 is a sectional view of the image sensor, and FIG. 2 is a plan view showing FIG. 1 in a reduced size. That is, when cut along the line X--X in FIG. 2, the result is shown in FIG.

Reference numeral 11 in the figure is an envelope having a stepped recess (window) 12 at the top. An image sensor chip 13 is provided approximately at the center bottom of the recess 12 of the envelope 1 .

A chip 13 is provided on the step surface 14 of the recess 12 of the envelope 1.
A frame-shaped groove 15 is provided on the side. Optical glass @ 17 is airtightly provided on the step surface 14 of the recess 12 of the envelope 1 with an adhesive layer 16 interposed therebetween.

Here, the adhesive layer 16 is attached to the groove 15 as shown in FIG.
It is applied on the step surface 14 located on the outside of the workpiece V. The optical glass plate 17 is formed by melting the adhesive layer 16 at a bonding temperature of about 4()0°C.
It is attached via adhesive @16.

According to the present invention, the frame-shaped groove 15 is formed on the stepped surface 14 of the recess 12 of the envelope 1, rather than the adhesive layer 16.
Since the structure is such that the optical glass V1175 is installed closer to the outer wall 1, when the outer shell 11VC is attached via the adhesive layer 16 of the optical glass V1175, the adhesive layer 16 is swept inward of the outer shell 1 due to the pressure. However, this flows into the groove 15 and can be prevented from flowing further into the envelope 11. Therefore, the adhesive layer 16 does not get on the chip 13 due to strong impact as in the conventional case, and good optical characteristics can be maintained.

In the above embodiment, a groove is provided on the stepped surface of the recessed portion of the envelope, but the present invention is not limited to this, and it is also possible to provide a groove at a predetermined position on the back surface of the optical glass plate. However, since the thickness of the optical glass plate is generally not sufficient, the strength of the groove portion may be insufficient. Therefore, it is desirable to provide it on the envelope side.

〔Effect of the invention〕

As described in detail above, according to the present invention, it is possible to provide an image sensor with good optical characteristics in which the adhesive layer is prevented from protruding inward of the envelope.

[Brief explanation of drawings]

Fig. 1 is a cross-sectional view of an image sensor according to an embodiment of the present invention, Fig. 2 is a plan view showing a scaled-down version of Fig. 1, and Fig. 3 is a cross-sectional view of a conventional image sensor before an optical glass plate is attached. FIG. 4 is a sectional view of the same image sensor after an optical glass plate is attached. DESCRIPTION OF SYMBOLS 11... Envelope, 12... Recessed part, 13... Image sensor chip, 14... Step surface, 15... Groove, 1
6... Adhesive layer, 17... Optical glass plate.

Claims (1)

[Claims] An envelope having a stepped recess at the top, a chip provided on the bottom surface of the recess of the envelope, and an optical chip provided on the stepped surface of the recess of the envelope via an adhesive layer. 1. An image sensor comprising a glass plate, characterized in that a groove is provided on a stepped surface of a recessed portion of an envelope closer to a chip.