JPS59103473U - Chip component wiring body - Google Patents
Chip component wiring bodyInfo
- Publication number
- JPS59103473U JPS59103473U JP20038182U JP20038182U JPS59103473U JP S59103473 U JPS59103473 U JP S59103473U JP 20038182 U JP20038182 U JP 20038182U JP 20038182 U JP20038182 U JP 20038182U JP S59103473 U JPS59103473 U JP S59103473U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- chip
- wiring body
- temporarily fixed
- component wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のチップ部品配線体の部分断面図、第２図
は第１図の回路図、第３図は本考案に係るチップ部品配
線体の要部断面図、及び第４図は第３図は配線体の組み
込み時の分解斜視図である。
１０・・・チップ部品配線体、１１・・・プリント基板
、１２・・・第１チップ部品（角形チップ抵抗）、１３
・・・第２チップ部品（円筒形チップコンデンサ）、１
４・・・接着剤、１５．１６・・・導電ランド、１７゜
１８・・・電極、１９・・・半田。FIG. 1 is a partial sectional view of a conventional chip component wiring body, FIG. 2 is a circuit diagram of FIG. 1, FIG. 3 is a sectional view of a main part of a chip component wiring body according to the present invention, and FIG. FIG. 3 is an exploded perspective view of the wiring body when it is assembled. 10... Chip component wiring body, 11... Printed circuit board, 12... First chip component (square chip resistor), 13
...Second chip component (cylindrical chip capacitor), 1
4... Adhesive, 15.16... Conductive land, 17°18... Electrode, 19... Solder.
Claims (2)
所定位置に第１チップ部品を接着剤により仮固定し、こ
の仮固定した第１チップ部品上に第２チップ部品を接着
剤により仮固定してこれらチップ部品を一括して半田処
理したことを特徴とするチップ部品配線体。(1) A first chip component is temporarily fixed with an adhesive to a predetermined position of a printed circuit board on which a conductive land pattern is formed, and a second chip component is temporarily fixed with an adhesive onto the temporarily fixed first chip component. A chip component wiring body characterized in that these chip components are collectively soldered.
記第２チップ部品が円筒形チップコンデンサである実用
新案登録請求の範囲第１項に記載のチップ部品配線体。(2) The chip component wiring body according to claim 1, wherein the first chip component is a square chip resistor and the second chip component is a cylindrical chip capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20038182U JPS59103473U (en) | 1982-12-27 | 1982-12-27 | Chip component wiring body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20038182U JPS59103473U (en) | 1982-12-27 | 1982-12-27 | Chip component wiring body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59103473U true JPS59103473U (en) | 1984-07-12 |
Family
ID=30425910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20038182U Pending JPS59103473U (en) | 1982-12-27 | 1982-12-27 | Chip component wiring body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59103473U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57130495A (en) * | 1981-02-04 | 1982-08-12 | Matsushita Electric Industrial Co Ltd | Method of producing electric part mounting substrate |
-
1982
- 1982-12-27 JP JP20038182U patent/JPS59103473U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57130495A (en) * | 1981-02-04 | 1982-08-12 | Matsushita Electric Industrial Co Ltd | Method of producing electric part mounting substrate |
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