JPS5911260B2 - semiconductor rectifier - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION 15 This invention relates to a semiconductor rectifier, and particularly to a semiconductor element stack of a power converter using semiconductor elements.

FIG. 1 explains a semiconductor element stack in a conventional rectifier. In the figure, reference numeral 1 indicates a 20-piece semiconductor element;
It is fixed to the main conductor 2, and one end thereof is connected to the fuse 3 via a lead wire.

The other end of the fuse 3 is connected to a main conductor 5 via a fuse attachment conductor 4, and the conductor 5 is connected to a conductor 6. In a semiconductor stack configured as 25 or more, the current flowing from the conductor 6 flows through the main conductor 5, the fuse attachment conductor 4, the fuse 3, the semiconductor element 1, and the main conductor 2.

When a large current is to flow, the number of semiconductor elements 1 may be increased. 30 In the conventional structure described above, when a large current flows, the number of parallel semiconductor elements increases, and the volume occupied by the fuse increases, so the length of the main conductor 2 becomes longer and the entire device becomes larger. There were flaws.

35 An object of the present invention is to provide a semiconductor rectifier that can reduce the overall size of the device.

According to the present invention, the above object is achieved by arranging the fuses on both sides of the main conductor and by using the conductors for attaching the fuses as current paths for other elements. Hereinafter, details of the present invention will be explained in conjunction with embodiments shown in the drawings.

FIG. 2 and subsequent figures illustrate one embodiment of the present invention, in which the same parts as in FIG. 1 are designated by the same reference numerals.

In this embodiment, the fuse 3 is arranged on both sides of the main conductors 2 and 5, and is attached to both sides of the main conductors 2 and 5 with the fuse mounting conductor 4 and the conductor 10 sandwiching the fuse 3 at the top and bottom. There is. One end of two flexible conductors 7 is connected to one end of the fuse attachment conductor 4 and one end of the conductor 10, respectively, and a heat radiation conductor 8 is fixed to the other end of these flexible conductors 1. On the other hand, as is clear from FIG. 3, the fuse mounting conductors 4 are on the same plane, but the conductor 10
are in planes at different levels above and below.

A heat dissipating conductor 8 is attached to the ends of one fuse mounting conductor 4 and the other conductor 10 via a flexible conductor 7,
A flat semiconductor element 1 is fixed between each of the heat dissipating conductors 8 and 8 in the center, and an insulating plate 9 is disposed between the heat dissipating conductors 8 and 8 that are in contact with each other in the center.
is inserted.

Figures 1 and 8 show a three-dimensional wiring diagram and an expanded connection diagram of the embodiment shown in Figure 2, and Figure 9 shows an expanded connection diagram of two other embodiments, and the same parts in each figure are the same. It is shown with a symbol. The present embodiment is constructed as described above, and since a flat type semiconductor element 1 is used, a fuse can be connected only to the lead side 5 of the element in the case of a conventional stud type element. , it can be connected to either the anode or cathode side of the device.

Therefore, in a semiconductor device stack in which devices are connected in parallel, if the fuse 3 of one device is on the left side as shown in Figure 3, then the fuse for another current path is placed on the right side. Therefore, wasted space can be reduced. By the way, the current flowing from the conductor 6 to the main conductor 5 flows in two ways; one is the fuse-attached conductor 4, the fuse 3, the conductor 10, the flexible conductor r1, and the heat dissipation conductor 8.
, semiconductor element 1, heat dissipation conductor 8, flexible conductor r1, fuse mounting conductor 4, and the other path flows from main conductor 5 through fuse conductor 4 to flexible conductor 1.
, the heat dissipation conductor 8, the semiconductor element 1, the heat dissipation conductor 8, the flexible conductor 7, the conductor 10, the fuse 3, the fuse attachment conductor 4, and the main conductor 2.

As is clear from the above description, the present invention has the following effects.

(1) Since the fuses are distributed and arranged on both sides of the main conductors 2 and 5, the stack structure can be made smaller.

(2) Since the fuse mounting conductor is used as the current path for other elements, the number of parts and welding points are reduced.
Improves workability.

(3) In a stack composed of parallel units of two semiconductor devices, the length of the main conductor is short, so the inductance in the main conductor is reduced, and the current balance of the entire stack is improved.

(4) Since the length of the main conductor can be shortened, material can be saved and loss in the conductor can be reduced.

(5) Manufacturing costs can be reduced by reducing the number of parts and saving materials.

[Brief explanation of drawings]

The figures illustrate a conventional example and an embodiment of the present invention.
Identical parts in each figure are designated by the same reference numerals; FIG. 1 is a perspective view of a conventional structure, FIG. 2 is a perspective view of an embodiment of the present invention, and FIG. 3 is taken from A-A in FIG. 4. Line sectional view, Figure 4 is the left side view of Figure 2, Figure 5 is the right side view of Figure 2, and Figure 6 is the left side view of Figure 2.
7 is a three-dimensional wiring diagram, FIG. 8 is an expanded circuit diagram, and FIG. 9 is an expanded circuit diagram showing another example of the circuit of the present invention, in which 1 is a semiconductor element, 2 and 5 are Main conductor, 3 is fuse,
4 is a fuse mounting conductor, 6 and 10 are conductors, r is a flexible conductor, 8 is a heat radiation conductor, and 9 is an insulating plate.

Claims (1)

[Claims] 1. A semiconductor rectifier using a unit in which each semiconductor element of a semiconductor element stack and a fuse are connected in series, with a first main conductor 5 and a second main conductor 2, and a semiconductor rectifier on both sides of these main conductors. At least two sets of fuses 3 distributed and arranged, at least two flat semiconductor elements 1 arranged in front of both main conductors, and two fuses electrically connected to each main conductor on the same level plane. Fuse mounting conductor 4
and a conductor 10 that holds each set of fuses from below or above together with each fuse mounting conductor, one of the two flat semiconductor elements having a fuse mounting conductor connected to the first main conductor. and the other clamping conductor are electrically connected to form a first series circuit by a flexible conductor 7 connected to these conductors and a heat dissipation conductor 8 fixed to these flexible conductors, and said two The other of the flat semiconductor elements has a flexible conductor connected to these conductors between one of the sandwiching conductors and a fuse mounting conductor connected to the second main conductor, and a heat dissipation conductor fixed to these flexible conductors. A semiconductor rectifier, characterized in that the semiconductor rectifier is electrically connected to form a second series circuit. 2. The semiconductor rectifier according to claim 1, wherein each set of fuses comprises a plurality of fuses arranged in parallel between the fuse mounting conductor and the clamping conductor. 3. The semiconductor rectifier according to claim 1 or 2, wherein each unit of the semiconductor element stack comprises a parallel connection of a first series circuit and a second series circuit. 4. The semiconductor rectifier according to claim 1 or 2, wherein each unit is configured by a parallel connection of a second series circuit of one unit and a first series circuit of the next unit.