JPS59114845A - 諸特性の改善された容器を用いた半導体装置 - Google Patents

諸特性の改善された容器を用いた半導体装置

Info

Publication number
JPS59114845A
JPS59114845A JP57224704A JP22470482A JPS59114845A JP S59114845 A JPS59114845 A JP S59114845A JP 57224704 A JP57224704 A JP 57224704A JP 22470482 A JP22470482 A JP 22470482A JP S59114845 A JPS59114845 A JP S59114845A
Authority
JP
Japan
Prior art keywords
ceramic
semiconductor device
substrate
copper
alumina
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57224704A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6331940B2 (2
Inventor
Manabu Bonshihara
學 盆子原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57224704A priority Critical patent/JPS59114845A/ja
Publication of JPS59114845A publication Critical patent/JPS59114845A/ja
Publication of JPS6331940B2 publication Critical patent/JPS6331940B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base

Landscapes

  • Die Bonding (AREA)
JP57224704A 1982-12-21 1982-12-21 諸特性の改善された容器を用いた半導体装置 Granted JPS59114845A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57224704A JPS59114845A (ja) 1982-12-21 1982-12-21 諸特性の改善された容器を用いた半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57224704A JPS59114845A (ja) 1982-12-21 1982-12-21 諸特性の改善された容器を用いた半導体装置

Publications (2)

Publication Number Publication Date
JPS59114845A true JPS59114845A (ja) 1984-07-03
JPS6331940B2 JPS6331940B2 (2) 1988-06-27

Family

ID=16817932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57224704A Granted JPS59114845A (ja) 1982-12-21 1982-12-21 諸特性の改善された容器を用いた半導体装置

Country Status (1)

Country Link
JP (1) JPS59114845A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5631807A (en) * 1995-01-20 1997-05-20 Minnesota Mining And Manufacturing Company Electronic circuit structure with aperture suspended component
US5703397A (en) * 1991-11-28 1997-12-30 Tokyo Shibaura Electric Co Semiconductor package having an aluminum nitride substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921032A (ja) * 1982-07-26 1984-02-02 Sumitomo Electric Ind Ltd 半導体装置用基板
JPS5946050A (ja) * 1982-09-09 1984-03-15 Narumi China Corp 半導体用セラミツクパツケ−ジ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921032A (ja) * 1982-07-26 1984-02-02 Sumitomo Electric Ind Ltd 半導体装置用基板
JPS5946050A (ja) * 1982-09-09 1984-03-15 Narumi China Corp 半導体用セラミツクパツケ−ジ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5703397A (en) * 1991-11-28 1997-12-30 Tokyo Shibaura Electric Co Semiconductor package having an aluminum nitride substrate
US5631807A (en) * 1995-01-20 1997-05-20 Minnesota Mining And Manufacturing Company Electronic circuit structure with aperture suspended component
US5689600A (en) * 1995-01-20 1997-11-18 Minnesota Mining And Manufacturing Company Electronic circuit structure

Also Published As

Publication number Publication date
JPS6331940B2 (2) 1988-06-27

Similar Documents

Publication Publication Date Title
US5981085A (en) Composite substrate for heat-generating semiconductor device and semiconductor apparatus using the same
US5111277A (en) Surface mount device with high thermal conductivity
KR910000336B1 (ko) 전자기기 장치
US5188985A (en) Surface mount device with high thermal conductivity
JPWO2000034539A1 (ja) 複合材料及びその用途
JPH06296084A (ja) 高熱伝導体及びこれを備えた配線基板とこれらの製造方法
US5821617A (en) Surface mount package with low coefficient of thermal expansion
JPS6318648A (ja) 窒化アルミニウム回路基板
RU192952U1 (ru) Металлокерамический корпус
JPS59114845A (ja) 諸特性の改善された容器を用いた半導体装置
JPH10270613A (ja) 傾斜機能材料を用いた半導体回路基板
JP4014248B2 (ja) 傾斜機能材料の製造方法
JP2517024B2 (ja) セラミックパッケ―ジとその製造方法
JP2967065B2 (ja) 半導体モジュール
JP3426827B2 (ja) 半導体装置
JPH0613494A (ja) 半導体装置用基板
JPH0748180A (ja) セラミックス−金属接合体
JP3180100B2 (ja) 半導体モジュール
JPH04348062A (ja) 半導体搭載用放熱基板の製造法と該基板を用いた半導体用パッケージ
JPH06196585A (ja) 回路基板
JPS6370545A (ja) 半導体パツケ−ジ
JPH02226749A (ja) 高出力回路部品用ヒートシンク
JP2001284509A (ja) Ａｌ−ＳｉＣ複合体
JPH0997865A (ja) 放熱部品
JP2509428B2 (ja) 超小型電子パッケ―ジ