JPS6331940B2 - - Google Patents

Info

Publication number
JPS6331940B2
JPS6331940B2 JP57224704A JP22470482A JPS6331940B2 JP S6331940 B2 JPS6331940 B2 JP S6331940B2 JP 57224704 A JP57224704 A JP 57224704A JP 22470482 A JP22470482 A JP 22470482A JP S6331940 B2 JPS6331940 B2 JP S6331940B2
Authority
JP
Japan
Prior art keywords
ceramic
tungsten
semiconductor device
container
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57224704A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59114845A (ja
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP57224704A priority Critical patent/JPS59114845A/ja
Publication of JPS59114845A publication Critical patent/JPS59114845A/ja
Publication of JPS6331940B2 publication Critical patent/JPS6331940B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/13Containers comprising a conductive base serving as an interconnection
    • H10W76/134Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base

Landscapes

  • Die Bonding (AREA)
JP57224704A 1982-12-21 1982-12-21 諸特性の改善された容器を用いた半導体装置 Granted JPS59114845A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57224704A JPS59114845A (ja) 1982-12-21 1982-12-21 諸特性の改善された容器を用いた半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57224704A JPS59114845A (ja) 1982-12-21 1982-12-21 諸特性の改善された容器を用いた半導体装置

Publications (2)

Publication Number Publication Date
JPS59114845A JPS59114845A (ja) 1984-07-03
JPS6331940B2 true JPS6331940B2 (2) 1988-06-27

Family

ID=16817932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57224704A Granted JPS59114845A (ja) 1982-12-21 1982-12-21 諸特性の改善された容器を用いた半導体装置

Country Status (1)

Country Link
JP (1) JPS59114845A (2)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69232912T2 (de) * 1991-11-28 2003-12-24 Kabushiki Kaisha Toshiba, Kawasaki Halbleitergehäuse
US5631807A (en) * 1995-01-20 1997-05-20 Minnesota Mining And Manufacturing Company Electronic circuit structure with aperture suspended component

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921032A (ja) * 1982-07-26 1984-02-02 Sumitomo Electric Ind Ltd 半導体装置用基板
JPS5946050A (ja) * 1982-09-09 1984-03-15 Narumi China Corp 半導体用セラミツクパツケ−ジ

Also Published As

Publication number Publication date
JPS59114845A (ja) 1984-07-03

Similar Documents

Publication Publication Date Title
US5111277A (en) Surface mount device with high thermal conductivity
US5188985A (en) Surface mount device with high thermal conductivity
JPH06296084A (ja) 高熱伝導体及びこれを備えた配線基板とこれらの製造方法
JPH022836B2 (2)
JPS6331940B2 (2)
JPS617647A (ja) 回路基板
JPH10270613A (ja) 傾斜機能材料を用いた半導体回路基板
JP2517024B2 (ja) セラミックパッケ―ジとその製造方法
JPH0748180A (ja) セラミックス−金属接合体
JPH0613494A (ja) 半導体装置用基板
JP3180100B2 (ja) 半導体モジュール
JP2000340716A (ja) 配線基板
JPH0427172Y2 (2)
JP2000236034A (ja) 電子部品用パッケージ
JPH04348062A (ja) 半導体搭載用放熱基板の製造法と該基板を用いた半導体用パッケージ
JPH11289037A (ja) 放熱用金属板およびそれを用いた電子部品用パッケージ
JPH06196585A (ja) 回路基板
JP2000114441A (ja) 多層金属板およびその製造方法
JP3559457B2 (ja) ロウ材
JPH11297909A (ja) 放熱用金属板およびそれを用いた電子部品用パッケージ
JP2764340B2 (ja) 半導体素子収納用パッケージ
JPH02226749A (ja) 高出力回路部品用ヒートシンク
JPH05326762A (ja) 半導体素子搭載装置用放熱板
JP2000349098A (ja) セラミック基板と半導体素子の接合体及びその製造方法
JPS63229843A (ja) 複合セラミツクス基板