JPS59123773A - Stripping liquid for tin or tin alloy - Google Patents
Stripping liquid for tin or tin alloyInfo
- Publication number
- JPS59123773A JPS59123773A JP22750482A JP22750482A JPS59123773A JP S59123773 A JPS59123773 A JP S59123773A JP 22750482 A JP22750482 A JP 22750482A JP 22750482 A JP22750482 A JP 22750482A JP S59123773 A JPS59123773 A JP S59123773A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- ion
- stripping
- contg
- tin alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 229910001128 Sn alloy Inorganic materials 0.000 title claims abstract description 21
- 239000007788 liquid Substances 0.000 title abstract 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 12
- 239000011737 fluorine Substances 0.000 claims description 12
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 10
- -1 silicon ion Chemical class 0.000 claims description 10
- 150000002500 ions Chemical class 0.000 claims description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 150000002391 heterocyclic compounds Chemical class 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 3
- 125000004434 sulfur atom Chemical group 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 230000002378 acidificating effect Effects 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 17
- 229910052802 copper Inorganic materials 0.000 abstract description 17
- 239000010949 copper Substances 0.000 abstract description 17
- 239000011521 glass Substances 0.000 abstract description 17
- 239000000758 substrate Substances 0.000 abstract description 16
- 239000002244 precipitate Substances 0.000 abstract description 13
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 abstract description 8
- 230000015572 biosynthetic process Effects 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 7
- 238000005260 corrosion Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 5
- 238000007654 immersion Methods 0.000 abstract description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004202 carbamide Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 239000003381 stabilizer Substances 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 36
- 229910000679 solder Inorganic materials 0.000 description 15
- 230000000694 effects Effects 0.000 description 10
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 9
- 239000004744 fabric Substances 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 239000003112 inhibitor Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 150000003377 silicon compounds Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 229910001432 tin ion Inorganic materials 0.000 description 2
- RPAJSBKBKSSMLJ-DFWYDOINSA-N (2s)-2-aminopentanedioic acid;hydrochloride Chemical class Cl.OC(=O)[C@@H](N)CCC(O)=O RPAJSBKBKSSMLJ-DFWYDOINSA-N 0.000 description 1
- 241000663858 Corixidae Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 235000019988 mead Nutrition 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000375 suspending agent Substances 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は錫又は錫合金の剥離液に関するものであり、更
に詳細に述べれば銅基質からその基質を損傷する事なし
に浸漬溶解法又はスプレィ法で錫又は錫合金を選択的に
短時間で剥離し、且つ白色沈澱の生成及びプリント配線
板製造に於ける錫又は錫合金の剥離の際にしばしば見ら
れるミーズリングをも防止することのできる錫又は錫合
金の剥離液に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a stripping solution for tin or tin alloys, and more particularly to a stripping solution for tin or tin alloys, which removes tin or tin alloys from a copper substrate by dip melting or spraying without damaging the substrate. A stripping solution for tin or tin alloys that selectively strips in a short time and can also prevent the formation of white precipitates and measling that is often seen when stripping tin or tin alloys in printed wiring board manufacturing. It is related to.
従来、銅基質例えばプリント配線板に於いて銅メツキ上
に更に電解ハンダメッキで付着した半田は、例えば硼フ
ッ化水素酸と過酸化水素とを含む水浴液を用いて、これ
に銅基質を浸漬する事によシ除去されているが、このよ
うな剥離液では酸の作用によυ銅の溶解量も少なくない
のでプリント配線板上のハンダ剥離には適しない。又、
過酸化水素と酸との混合水溶液は銅基質から錫又は錫合
金を剥離する事に利用されているが、この剥離液で処理
すると錫又は錫合金が剥離された後、錫が再び鋼上に析
出して被膜状の白色沈澱を生成する傾向がある。このた
め、再付着した被膜状の白色沈澱物を除去するにはブラ
シかけ等の追加的剥離操作を要し、剥離工程が煩雑にな
る欠点がある。Conventionally, solder deposited on copper substrates, such as printed wiring boards, by electrolytic solder plating on copper plating has been produced by immersing the copper substrate in a water bath solution containing, for example, borohydrofluoric acid and hydrogen peroxide. However, such a stripping solution is not suitable for stripping solder on printed wiring boards because the amount of dissolved copper is not small due to the action of the acid. or,
A mixed aqueous solution of hydrogen peroxide and acid is used to strip tin or tin alloy from a copper substrate, but when treated with this stripping solution, after the tin or tin alloy is stripped, the tin reappears on the steel. It has a tendency to precipitate and form a film-like white precipitate. Therefore, in order to remove the redeposited white precipitate, an additional peeling operation such as brushing is required, resulting in a disadvantage that the peeling process becomes complicated.
又、長期にわたる操業では多量の白色沈澱物を生成する
。又、この白色沈澱物の生成を防止するためフッ化物を
配合した剥離液も使用されているが、フッ化物は一般に
ガラスの腐蝕も大きく、特に、プリント配線板製造の分
野に於いてこの剥離液で銅基板を処理すると、エポキシ
−ガラス布基材が著しく損傷されミーズリングの原因と
もなっている、
その他の剥駐液成分にはクロム酸盾も使用されているが
、とｎらの成分は有毎物質を発生し公害防止のだめに多
大の設備と費用を要し、又、環境衛生上好ましくない。In addition, a large amount of white precipitate is produced during long-term operation. Also, to prevent the formation of this white precipitate, stripping solutions containing fluoride are used, but fluorides generally corrode glass, so this stripping solution is particularly difficult to use in the field of printed wiring board manufacturing. When copper substrates are treated with epoxy glass, the epoxy-glass cloth substrate is severely damaged and may cause measling. This method generates various substances, requires a large amount of equipment and costs to prevent pollution, and is unfavorable in terms of environmental hygiene.
不発明による剥離液は通當の無機酸及び／又は有機酸を
主ルー分としているので買切の操業により元生ずる沈諷
生成を防止し、また硅素化合物を添加する！ｙにより従
来のフッ素イオンを含有した剥離液に起因するミーズリ
ング、ガラスの腐蝕等の欠点が改善され、且つ、錫又は
錫合金の溶解が迅速に行なわれる。父、イオウ原子を含
有しておらず環構成員として−ＮＨ又は＝１寸の形で窒
素原子を含有している複素環式化合物が含まれていて、
この化合物が銅表面に吸着されて銅の溶解と錫イオンの
銅表面への再付着を防止する事ができ、又銅の酸化が防
止される効果が得られる。Since the stripping solution according to the invention is mainly composed of common inorganic acids and/or organic acids, it prevents the formation of deposits that originally occur due to bulk operation, and also contains silicon compounds! By using y, defects such as measling and glass corrosion caused by conventional stripping solutions containing fluorine ions are improved, and tin or tin alloy can be rapidly dissolved. Father, heterocyclic compounds containing no sulfur atom but containing a nitrogen atom in the form of -NH or =1 as a ring member,
This compound is adsorbed on the copper surface and can prevent dissolution of copper and redeposition of tin ions to the copper surface, and also has the effect of preventing copper oxidation.
本発明は以上の如〈従来の欠点を改善し、銅基質からそ
の基質を損傷する事なしに錫又は錫合金を剥離するのに
適しｆＣ酸性剥離液である。The present invention is an fC acid stripping solution which improves the drawbacks of the prior art and is suitable for stripping tin or tin alloys from a copper substrate without damaging the substrate.
本発明の剥離液は以下の成分から構成される。The stripping solution of the present invention is composed of the following components.
本発明の剥離液の第一成分はフッ素含有錯イオンであり
、例えば硼フッ化水素酸イオＪＢＦ４−） 。The first component of the stripping solution of the present invention is a fluorine-containing complex ion, such as borohydrofluoride ion JBF4-).
フン化チタン酸イオン（ＴｔＦ６）、フン化硅酸イオン
（Ｓ乙Ｆ６”−）＋ フッ化アルミン酸イオン（ＡＡ
！Ｆ６” ）等である。Fluorinated titanate ion (TtF6), fluorinated silicate ion (S F6”-) + fluorinated aluminate ion (AA
! F6”) etc.
フッ素含有錯イオンは溶解錫イオンを安定化し、また酸
との相剰作用によυ錫又は錫合金を迅速に剥離する。錫
又は錫合金は酸性浴液のみでも溶解するが、その反応は
極めて遅く実用にはならない。The fluorine-containing complex ion stabilizes the dissolved tin ion and rapidly strips the tin or tin alloy due to the interaction with the acid. Tin or tin alloys can be dissolved in an acid bath alone, but the reaction is extremely slow and is not of practical use.
フッ素含有錯イオンの濃度はフッ素量にして好ましくは
０．１〜３５０９−Ａ、より好ましくは６〜２５０Ｙｉ
ｌｊの濃度範囲で使用する。フッ素含有錯イオンをＯ，
’ｌ／Ａ！以下で使用した場合には上記の効果が期待で
きず、又、６５０ Ｖｌ１以上ではそれ以上の大きな効
果が期待できない。The concentration of the fluorine-containing complex ion is preferably 0.1 to 3509-A, more preferably 6 to 250Yi in terms of fluorine amount.
It is used within the concentration range of lj. Fluorine-containing complex ion is O,
'l/A! If it is used below, the above effect cannot be expected, and if it is over 650 Vl1, no greater effect can be expected.
本発明の剥離液に於ける第二成分は沈澱防止剤としての
フッ化物或いはその塩である。フッ素含有錯“イオンの
みでも沈澱防止効果は多少あるが、その効果は充分満足
できるものではない。The second component in the stripping solution of the present invention is a fluoride or a salt thereof as a suspending agent. Although fluorine-containing complex ions alone have some effect on preventing precipitation, the effect is not fully satisfactory.
第二成分の添加濃度の効果はフッ素量にして００５〜１
５０ ’？Ａで白色沈澱の生成が著しく防止される事が
わかった。０．０５ ’ｉ／ｌ以下では白色沈澱防（Ｅ
効果が認められず、父、ｉ ５０ ｙＡ以上ではそれ以
上の犬さな効果が期待できず実用上不経済でもあり、股
１１ｍ、装置などの腐蝕、或いは作業環境の悪化等の問
題も生じる。従って沈１寸防止添加剤であるフッ化物或
いは、その塩の’ｆＡ Ｌは０．０５〜１５０ ＶＪ力
）好ましい。The effect of the addition concentration of the second component is 005 to 1 in terms of fluorine amount.
50'? It was found that A significantly prevented the formation of white precipitate. Below 0.05'i/l, white sedimentation prevention (E
No effect has been observed, and if it exceeds i 50 yA, no further effects can be expected and it is practically uneconomical, and problems such as corrosion of the crotch 11 m, equipment, etc., and deterioration of the working environment occur. Therefore, it is preferable that the fluoride or its salt, which is an anti-settling additive, has an fAL of 0.05 to 150 VJ.
本発明の剥冴液に於ける第三成分（１ミーズリング或い
（１ガラスの１λ蝕防止剤としての硅酸化合物であり、
例えば硅酸及びその塩、ヘキサフルオロ硅酸及びその塩
等である。The third component in the stripping solution of the present invention (1 measling or (1 glass 1λ) is a silicic acid compound as a corrosion inhibitor,
Examples include silicic acid and its salts, hexafluorosilicic acid and its salts, and the like.
第三成分の添加濃度は硅素量にしてｏ、ｏ ｏ ｉ ｖ
ｉ以上、より好ましくは０．０１〜５０５’／りの濃度
範囲である。０．００１ Ｐ／ｌ以下で使用した場合に
は上記の効果が期待できず、又、５０１２以上では、そ
れ以上の大きな効果が期待でさす実用上不経済でもあり
、逆に白色沈澱の生成が増大してくるので不適当である
。The concentration of the third component added is o, o o i v based on the amount of silicon.
The concentration range is at least i, more preferably from 0.01 to 505'/liter. If it is used at less than 0.001 P/l, the above effect cannot be expected, and if it is used at more than 5012, an even greater effect is expected, but it is uneconomical in practice, and on the contrary, the formation of white precipitate may occur. This is inappropriate as it increases.
本発明の剥離液に於ける醒としては、例えば塩酸、硝酸
、硫酸等の無機酸及び蓚酸、スルファミン酸、クエン酸
等の有機酸が享けられるが、錫又は錫合金を溶解して浴
液を作る酸か、又は、一旦溶液を形成した後、沈澱を生
じるような酸のいづれかであれは艮い。又、酸の濃度は
０．１規定以下では錫又は錫合金の浴解力が実用的に期
待できず、１０規定を越えると逆に溶解が減じてくる。In the stripping solution of the present invention, for example, inorganic acids such as hydrochloric acid, nitric acid, and sulfuric acid, and organic acids such as oxalic acid, sulfamic acid, and citric acid can be used. It does not matter if the acid is either one that produces a solution or one that, once a solution has been formed, produces a precipitate. Furthermore, if the acid concentration is less than 0.1N, it cannot be practically expected to dissolve the tin or tin alloy in the bath, and if it exceeds 10N, the dissolution will decrease.
不発明の剥離液に於ける銅インヒビターとしての成分は
−ＮＨ又はモＮの形で窒素原子を含有している複素環式
化合物で、イオウ原子を含有せず酸性溶液に溶解可能な
ものであり、例えば、ピラゾール、イミダゾール、トリ
アゾール及びこれらの誘導体が挙げられる。The component as a copper inhibitor in the stripping solution of the invention is a heterocyclic compound containing a nitrogen atom in the form of -NH or monoN, which does not contain a sulfur atom and is soluble in an acidic solution. Examples include pyrazole, imidazole, triazole and derivatives thereof.
本発明の剥離液は以上の成分を組み合わせだ組成を有す
るものであるが、上記の成分の蔭かに他の物質を添加す
る事ができる。例えば、過酸化水素や過酸イオン及びこ
れらの安定化剤として尿素。The stripping solution of the present invention has a composition that is a combination of the above components, but other substances can be added in addition to the above components. For example, hydrogen peroxide or peroxide ions and urea as a stabilizer for these.
アルコール等を添加する事かできる。It is possible to add alcohol etc.
以上述べたことから明らかなように、本発明の剥離液は
沈澱の生成及びミーズリンク或いはガラスの腐蝕を防止
し、且つ錫又は錫合金の灼ｊ離を長期にわたって円滑に
行なえるようにしだものである。また本うｃ明に於ける
剥離液は錫又は錫合金を除去できるならばどのような方
法で使用しても良く、例えば従来から一般的に用いられ
る浸漬法の他にスプレィ法などの方法を用する事ができ
る。As is clear from the above description, the stripping solution of the present invention prevents the formation of precipitates and corrosion of meads link or glass, and also enables smooth removal of tin or tin alloy over a long period of time. It is. In addition, the stripping solution in this invention may be used in any manner as long as tin or tin alloy can be removed; for example, in addition to the commonly used immersion method, a spray method may be used. can be used.
次に本発明の実施例を示す。Next, examples of the present invention will be shown.
実施例
）硝酸 ｉ ｏ ｏ ｙｙ
’ｉ■
１硼フツ化水素酸 ろ００インヒビ
ター（例えはイミダゾール）１０１水
船方：か１１になるまで添〃目する。Example) Nitric acid i o o yy
'i■ 1 Hydrofluoric acid Ro00 Inhibitor (e.g. imidazole) 101 Water
Boatman: I'll stick with you until I reach 11.
（
銅でパターン形成されたエポキシ−ガラス布基材に錫６
０％及び鉛４０％を含む半田でメッキした板（半田厚１
０μ）を４０Ｃで、上記の組成からなる剥離液に浸漬し
たところ、半田が２分間で板から完全に除去された。半
田を板から除去した後、このパターン形成されたエポキ
シ−ガラス布基板を剥離液に更に１０分間浸漬し続けた
。剥離液から基板をとシだし検査した結果、その銅表面
は光沢があり、エポキシ−ガラス布基Ｉにも何ら異状が
認められなかった。更に別の半１０メッキした板を上記
の組成からなる剥離液に溶解し続け、半田ｆ合戸１子量
が６５ヅｌになるまで射角・３勿、１日放置して沈澱の
有無を調べたが白色沈戯物ｄ、生成しなかった。(Tin 6 on copper patterned epoxy-glass cloth substrate)
Plate plated with solder containing 0% and 40% lead (solder thickness 1
When the solder was immersed in a stripping solution having the above composition at 40C, the solder was completely removed from the board in 2 minutes. After the solder was removed from the board, the patterned epoxy-glass cloth substrate was kept immersed in the stripper solution for an additional 10 minutes. As a result of removing the substrate from the stripping solution and inspecting it, the copper surface was shiny and no abnormality was observed in the epoxy-glass cloth base I. Further, another semi-plated plate was continued to be dissolved in the stripping solution having the above composition, and the angle of incidence was adjusted to 3.5 mm until the solder weight reached 65 ml.The plate was left for 1 day and examined for precipitation. However, no white sediment was formed.
これに対し、硅酸無添加の剥離液を使用した時は半田溶
解量が６５ガになるまで溶解しても白色沈澱は生成しな
かったが、ミーズリングが認められた。On the other hand, when a stripping solution containing no silicic acid was used, no white precipitate was formed even when the amount of solder dissolved reached 65 ga, but measling was observed.
又、ガラスの腐蝕をみるだめ、５０ ｘ １００ ｘ
１．４（７１ｍ）の大きさのガラス板（１４，７５０ｙ
−） を実施例１の剥離液に４０Ｕで１時間浸漬し、
水洗、乾燥後その重量を測定した。Also, to see the corrosion of the glass, 50 x 100 x
A glass plate (14,750y) with a size of 1.4 (71m)
-) was immersed in the stripping solution of Example 1 at 40 U for 1 hour,
After washing with water and drying, the weight was measured.
その結果、ガラス板の重量は１４．７３７５’となり、
わずかに０．０１３５’−腐蝕されていた。As a result, the weight of the glass plate is 14.7375',
It was slightly corroded by 0.0135'.
これに対し、同一のガラス板（１５，２００！ｉ’）
を実施例１の剥離液の硅酸無添加の組成のもので同条
件で処理した後、重量を測定した結果は／１．ｊ′ノ７
ノであり、浸漬により０．８０ろＬｉ−腐蝕されている
事がわかった。On the other hand, the same glass plate (15,200!i')
was treated with the stripping solution of Example 1 without the addition of silicic acid under the same conditions, and the weight was measured and the result was /1. j′ノ7
It was found that 0.80% of Li was corroded by immersion.
実施例
；）酸 ２５０ Ｐ／ｌ；硼
フッ化水素散 ２０ロ硅フツ化水禦酸
７０□
ｌインヒビター（ψ１」えはイミダゾール）
１０一つ化水素 、。Examples;) Acid 250 P/l; borohydrogen fluoride powder 20 silica fluoride water silicic acid 70□ l inhibitor (ψ1" imidazole)
10 Hydrogen monocide,.
１４０％フッ化水素 ５０Ｌ水
総量が１１になるまで添刀口する。140% hydrogen fluoride 50L water
Add the sword until the total amount reaches 11.
実施例１と同条件でメッキされた半田板を４０Ｃで上記
剥離液に浸漬したところ、半田は１分６０秒で板から完
全に除去された。半田を板から除去しだ後、このエポキ
シ−ガラス布基板を剥離液に更に１０分間浸漬し続けた
。剥離液から基板をとシだし検査した結果、その銅表面
は光沢があり、エポキシ−ガラス布基材にも何ら異状が
認められなかった。更に半田メッキした板を実施例２の
組成からなる剥離液に溶解し続け、半田溶解量が６０９
ｉｉになるまで溶解後、１日放置しても白色沈澱は生成
しなかった。When a solder plate plated under the same conditions as in Example 1 was immersed in the stripping solution at 40C, the solder was completely removed from the plate in 1 minute and 60 seconds. After the solder was removed from the board, the epoxy-glass cloth substrate was continued to soak in the stripping solution for an additional 10 minutes. When the substrate was removed from the stripping solution and inspected, the copper surface was shiny and no abnormality was observed in the epoxy-glass cloth base material. Further, the solder-plated plate was continued to be dissolved in the stripping solution having the composition of Example 2, and the amount of solder dissolved was 609.
After dissolving the solution until it reached ii, no white precipitate was formed even if it was left for one day.
これに対し、硅フッ化水素酸無添加の時は半田溶解量が
６０ ’７１１！になるまで溶解しても白色沈澱は生成
しなかつだが、ミーズリングが認められた。In contrast, when no hydrofluoric acid was added, the amount of solder melted was 60'711! Although no white precipitate was formed even after the solution was dissolved until the solution was dissolved, measling was observed.
以上の事より硅素化合物の添加がガラスの腐蝕を著しく
抑制し、ミーズリング防止に充分効果の代理人 弁理士
（８１０７）佐々木清隆（ほか３名）Based on the above, the addition of silicon compounds significantly suppresses the corrosion of glass and is sufficiently effective in preventing measling.Patent Attorney (8107) Kiyotaka Sasaki (and 3 others)
Claims (1)
してそれぞれ０．１〜．Ｓ ５０ Ｖ１！及ヒ０．０５
〜１５０Ｖ′ｌ、 及び硅素イオンを硅素量にして０
．００１ Ｖｉ以上含む錫又は錫合金の酸性剥離液。 ２）フッ素含有錯イオン及びフッ素イオンをフッ素量に
してそれぞれ０．１〜３５０ Ｖｌ及び０．０５〜１５
０ｙ；／１．及び硅素イオンを硅素量にして０．００１
￥−／１以上含む酸性浴液に、イオウ原子を含有して
り・らず環構成員とじて−ＮＨ又は三Ｎの形で窒素原子
を含有している複素環式化合吻を添加した錫又は錫合金
の酸性剥離液。[Claims] ) The fluorine content of the 7-containing complex ion and the fluorine ion is 0.1 to 0.1, respectively. S50V1! 0.05
〜150V'l, and silicon ion to silicon amount 0
．． Acidic stripping solution for tin or tin alloy containing 001 Vi or more. 2) Fluorine-containing complex ions and fluorine ions have a fluorine content of 0.1 to 350 Vl and 0.05 to 15, respectively.
0y;/1. and silicon ion as silicon amount 0.001
￥-/1 or more tin containing a heterocyclic compound containing a nitrogen atom in the form of -NH or triN as a ring member, to an acidic bath solution containing 1 or more sulfur atoms. Or tin alloy acid stripper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22750482A JPS6020470B2 (en) | 1982-12-28 | 1982-12-28 | Tin or tin alloy stripper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22750482A JPS6020470B2 (en) | 1982-12-28 | 1982-12-28 | Tin or tin alloy stripper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59123773A true JPS59123773A (en) | 1984-07-17 |
| JPS6020470B2 JPS6020470B2 (en) | 1985-05-22 |
Family
ID=16861925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22750482A Expired JPS6020470B2 (en) | 1982-12-28 | 1982-12-28 | Tin or tin alloy stripper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6020470B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102641346B1 (en) * | 2022-10-14 | 2024-02-27 | 주식회사 에어스메디컬 | Vessel detection method and computer program performing the same |
-
1982
- 1982-12-28 JP JP22750482A patent/JPS6020470B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6020470B2 (en) | 1985-05-22 |
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