JPS59136251A - Manufacture of paper base material phenol resin laminated board - Google Patents
Manufacture of paper base material phenol resin laminated boardInfo
- Publication number
- JPS59136251A JPS59136251A JP1166483A JP1166483A JPS59136251A JP S59136251 A JPS59136251 A JP S59136251A JP 1166483 A JP1166483 A JP 1166483A JP 1166483 A JP1166483 A JP 1166483A JP S59136251 A JPS59136251 A JP S59136251A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- paper base
- paper
- phenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は1紙基材フェノール樹脂積層板の製造法に係り
、その打抜き加工性の改良に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a single paper-based phenolic resin laminate, and to improving its punching processability.
近年、金・属箔張り積層板を加工して得た印刷回路板は
、その回路パターンの大形化、高密度化1部品実装工程
の自動化に伴い1寸、法精度及び密集小欠の打抜き加工
性の向上が要求されている。高度の寸法精度の要求から
1回路板の打抜き加工温度は低下し、常温で打抜かれる
。例もある。その場合、低温域で積層板が可塑化されて
いることと同時に層間密着性の強い事が必要である。In recent years, printed circuit boards obtained by processing metal/metal foil-covered laminates have become larger in circuit pattern, higher in density, and automated in the single-component mounting process. Improved workability is required. Due to the requirement for a high degree of dimensional accuracy, the punching temperature for each circuit board has been lowered and the circuit board is punched out at room temperature. There are also examples. In that case, it is necessary that the laminate is plasticized in a low temperature range and at the same time has strong interlayer adhesion.
従来、紙基材フェノール樹脂積層板は、高度の電気特性
、耐湿耐水性を得ることを目的として1紙基祠に下塗り
と上塗りの2段階で樹脂を塗工した塗工紙を積層成形す
ることが行なわれている。下塗りの樹脂は、基材への浸
透性から従来はフェノール初期縮合物が用いられ、特に
難燃性積層板を得る場合はメラミン初期締金物等が併用
されている。これらは、低分子量で、ある程度の水溶性
を持つため1紙基材の処理効果は大きいが、反応活性点
を多く持ち、硬化時の架橋密度が高いため積層板自体が
硬く、もろくなり、低温での打抜き加工ができず、上塗
り樹脂を可塑化してあっても、その効果が薄れる欠点か
あった。Conventionally, paper-based phenolic resin laminates are produced by laminating coated paper coated with resin in two stages: undercoating and topcoating, on one paper base, in order to obtain high electrical properties and moisture and water resistance. is being carried out. Conventionally, a phenol initial condensate is used as the undercoat resin due to its permeability into the base material, and especially when obtaining a flame-retardant laminate, a melamine initial fastener is also used. These have a low molecular weight and a certain degree of water solubility, so they have a great effect on treating a single paper base material. However, even if the top coat resin was plasticized, its effect would be diminished.
また、可塑化した上塗り樹脂か、多くは桐油等の天然乾
性油変性フェノール樹脂のため新油性が強くなり1紙基
材との親和性、あるいは前記下塗り樹脂との親和性が低
下し、積層板の打抜き加工時の層間密着力か低下し、穴
゛間りラック、層間剥離等の現象がしばしば発生する。In addition, plasticized topcoat resins or natural drying oil-modified phenolic resins such as tung oil in many cases have strong oil properties, reducing their affinity with the paper base material or with the undercoat resins, resulting in poor compatibility with the laminate. During the punching process, the adhesion between layers decreases, and phenomena such as hole-to-hole rack and delamination often occur.
従って、に塗り樹脂を可塑化するため、桐油等の天然乾
性油の含量を増加すれはそれだけ紙基材、下塗り樹脂と
の親和性はさらに低下する。Therefore, the more the content of natural drying oil such as tung oil is increased in order to plasticize the coating resin, the further the affinity with the paper base material and the undercoating resin decreases.
2段塗工による塗工紙を積層成形した積層板におけるこ
れらの問題を解決するためには、下塗り樹脂が紙基材処
理のための親水性と、上ケリ樹脂のための親油性を持ち
、かつ、それ自身が可塑化されている事が必要である。In order to solve these problems in a laminate made by laminating and molding coated paper using two-stage coating, the undercoat resin must have hydrophilicity for treating the paper base material and lipophilicity for the upper finishing resin. Moreover, it is necessary that the material itself be plasticized.
本発明は。The present invention is.
ポリビニルアルコール(以下PVAと略す)変性フェノ
ール樹脂を下塗り樹脂として用いることにより1紙基材
の処理効果を保持しながら。By using a polyvinyl alcohol (hereinafter abbreviated as PVA) modified phenolic resin as an undercoat resin, the processing effect of the paper base material is maintained.
それ自身め可塑化及び1塗り樹脂との親和性を図り積層
板の層間密着性の向上を打抜き加工性の改善をすること
を目的とするものである。The purpose is to improve the interlayer adhesion of the laminate and improve the punching processability by plasticizing itself and compatibility with the one-coat resin.
PVAは、従来より紙処理剤、水溶性接着剤として多く
用いられており、その分子構造中の水酸基により紙基材
との親和性が期待される。PVA has conventionally been widely used as a paper treatment agent and a water-soluble adhesive, and is expected to have affinity with paper base materials due to the hydroxyl group in its molecular structure.
また、残存酢酸基、C−C結合部の作用により界面活性
剤的効果も期待でき、上塗り用樹脂との親和性も期待で
きる。本発明は1通常のフェノール樹脂中に、PVAを
併用し、上記特性の確保と共に、系中にある程度の高分
子量のPVAを分散させる事により、低温時のフェノー
ル樹脂の可塑化を図ったものである。In addition, a surfactant effect can be expected due to the action of the residual acetate group and the C--C bond, and affinity with the top coating resin can also be expected. The present invention aims to plasticize the phenolic resin at low temperatures by using PVA in combination with a normal phenolic resin to ensure the above characteristics and by dispersing a certain amount of high molecular weight PVA in the system. be.
PVAを溶解するものは水または温水たけであり、フェ
ノール樹脂溶液とは溶解せず、PVAとフェノール樹脂
の併用は通常困難である。しかし、少ホのフェノールは
PVAに対して粘度安定剤、溶解助剤として用いられて
いる。What dissolves PVA is water or a warm water tank, and it does not dissolve in a phenol resin solution, so it is usually difficult to use PVA and phenol resin together. However, a small amount of phenol is used as a viscosity stabilizer and solubilizer for PVA.
そこでこの点に着目し、まず水とPVAを溶ジ
解させ、その後に多鼠のフェノールを投入し加熱溶解後
大社のメタノールを添加したところ。So, we focused on this point and first dissolved water and PVA, then added Tamouse's phenol, heated and dissolved it, and then added Taisha's methanol.
PVAの分離・沈殿は発生せず、均一な溶液状態を保つ
ことができた。これにホルムアルデとド、塩基性触媒を
添加して硬化反応を促進させると、均一な溶液状のPV
A変性フェノール樹脂を得ることが可能となった。塩基
性条件下で+i、PVAとホルムアルデヒドの反応は期
待されないため、PVAの添加社としては、PVA/フ
ェノール(重量比)=5/95〜20/80が望ましい
。また、PVAは系中に分散するだけであるから、ある
程度高分子伝のものか好ましいが、溶解時の粘度から実
用的には分子量1700程度が適当である。そして1.
I:塗り樹脂の特性に応し、ケン何度88〜100%の
ものが使用可能である。No separation or precipitation of PVA occurred, and a uniform solution state could be maintained. By adding formalde, do, and a basic catalyst to accelerate the curing reaction, a homogeneous solution of PV is produced.
It became possible to obtain A-modified phenol resin. Since no reaction between PVA and formaldehyde is expected under basic conditions, it is desirable to add PVA to PVA/phenol (weight ratio) of 5/95 to 20/80. Further, since PVA is only dispersed in the system, it is preferable to use a polymer with a certain degree of molecular weight, but in view of the viscosity when dissolved, a molecular weight of about 1700 is suitable for practical use. And 1.
I: Depending on the characteristics of the coating resin, those having a molecular weight of 88 to 100% can be used.
塩基性触媒としては、アンモニア、)!J)’?ルアミ
ン、ジメチルアミン等1通常フェノール樹脂に使用され
るアミン類を使用でき、必ずしも実施例に配賦したもの
のみに限定されるものではない。また、使用するフェノ
ールとホルムアルデヒドの比率も、所望の特性に応じ広
く変える事も可能である。As a basic catalyst, ammonia, )! J)'? Amines commonly used in phenolic resins such as amine, dimethylamine, etc. can be used, and are not necessarily limited to those used in the examples. Moreover, the ratio of phenol to formaldehyde used can also be varied widely depending on the desired properties.
以下実施例によって具体的に説明する。This will be specifically explained below using examples.
実施例
フラスコに水400gとケン何度8896゜分子m17
00(7)PVA100Fを投入し、撹拌する。続いて
、フェノール90(Ml’、メタノール800g、トリ
メチルアミン70jlを投入し、80℃に加熱し溶解さ
せる。溶解後8696バラホルムアルデヒド5ooIi
を投入し4時間反応させる。160℃熱板とでのゲル化
時間が3分に、なった点で脱水し、樹脂分50%に調整
する(下塗りワニスAとする)。Example: 400g of water in a flask and 8896° molecule m17
00(7) Add PVA100F and stir. Next, add phenol 90 (Ml', 800 g of methanol, and 70 jl of trimethylamine) and heat to 80°C to dissolve. After dissolving, 8696 rose formaldehyde 5ooIi
was added and allowed to react for 4 hours. When the gelation time on a 160° C. hot plate reaches 3 minutes, it is dehydrated and the resin content is adjusted to 50% (referred to as undercoat varnish A).
次に、同じくフラスコ+c桐油720 f、 m−クレ
ゾール5sop、p’rs酸0.749 ヲ投入し80
℃で1時間反応後フェノール500g!、80%パラホ
ルムアルデヒド450f。Next, add 720 f of tung oil, 5 sop of m-cresol, and 0.749 of p'rs acid to the same flask and add 80 f of tung oil.
500g of phenol after reacting at ℃ for 1 hour! , 80% paraformaldehyde 450f.
2596アンモニア水35 fを投入し80℃で反応を
進め、160℃熱板上でのゲル化時間が6分になった時
点で脱水し、後にメタノールを加え樹脂分50%に調整
し桐油変性フェノール樹脂を得た(L塗すワニスとする
)。Add 35 f of 2596 ammonia water and proceed with the reaction at 80°C, dehydrate when the gelation time on a 160°C hot plate reaches 6 minutes, then add methanol to adjust the resin content to 50% and make tung oil modified phenol. A resin was obtained (made into a varnish to be applied with L).
クラフト紙に上記下塗りワニスAを(付着樹脂量/塗工
紙重瞳=)20%付着させ、乾燥後さらに上塗りワニス
を総樹脂Q5096となる様に塗工乾燥する。この塗工
紙8枚と銅
35μ厚の接着剤付き黒箔を重ね合わせ温度160〜1
65℃、圧力100Kp/Cがの条件A乙
下で60分間加熱加圧し、 ロF坊7tB厚の銅張り積
層板を得た。20% of the above-mentioned undercoat varnish A (adhesive resin amount/coated paper weight pupil =) is applied to kraft paper, and after drying, a topcoat varnish is further applied and dried so that the total resin is Q5096. 8 sheets of this coated paper and 35 μ thick black copper foil with adhesive were layered at a temperature of 160 to 1
The product was heated and pressed for 60 minutes under the conditions of 65° C. and 100 Kp/C to obtain a copper-clad laminate with a thickness of 7 tB.
比較例
フラスコに、フェノール1000ノ、86%バラホルム
アルデヒド74011.トリメチルアミン50gを加え
、80℃で4時間反応後160℃熱板上でのゲル化時間
が3分になった点で冷却し、メタノール樹脂分5096
に調整した(下塗りワニスBとする)。In a comparative flask, phenol 1000 and 86% formaldehyde 74011 were added. After adding 50 g of trimethylamine and reacting at 80°C for 4 hours, it was cooled when the gelation time on a 160°C hot plate reached 3 minutes, and the methanol resin content was 5096.
(referred to as undercoat varnish B).
実施例と同様の方法で下塗りワニスB+クラフト紙に樹
脂m2096付着させた後、実施例におけるE塗りワニ
スを総樹脂Q 5 Q 96となるよう6乙塗工乾燥し
た。この塗工紙を用&Aで実施例と同様の積層板を得た
。After adhering resin m2096 to the undercoat varnish B+kraft paper in the same manner as in the examples, the E-coating varnish in the examples was coated six times and dried to give a total resin of Q 5 Q 96. This coated paper was used to obtain a laminate similar to that of the example.
第1表に実施例と比較例の積層板の特性を示す。Table 1 shows the characteristics of the laminates of Examples and Comparative Examples.
第1表
第1表から明らかな様に、八P V A変性フェノール
樹脂を下塗り樹脂として用Ilすること番こより積層板
の打抜き温度を低下させ、また1層間密着性の向丘によ
り低温での密集式打抜きカロエ、を可能にした点で本発
明の工業的価値6才極めて大である。Table 1 As is clear from Table 1, the use of 8PVA modified phenolic resin as an undercoat resin lowers the punching temperature of the laminate, and also improves the density at low temperatures due to the increased adhesion between layers. The industrial value of the present invention is extremely great in that it makes it possible to perform die-cutting.
Claims (1)
塗工紙を積層成形する積層板の製造法において、下塗り
樹脂としてポリビニルアルコール変性フェノール樹脂を
用いることを特徴とする紙基材フェノール樹脂積層板の
製造法。 2 ポリビニルアルコール変性フェノール樹脂が、ポリ
ビニルアルコールを水とのフェノールに溶解させた後ホ
ルムアルデヒドを添加して塩基性触媒下で反応させたも
のである特許請求の範囲第1項記載の紙基材フェノール
樹脂積層板の製造法。[Claims] 1. In a method for manufacturing a laminate in which coated paper is coated with resin on a paper base material in two stages of undercoating and L coating, a polyvinyl alcohol-modified phenol resin is used as the undercoat resin. Characteristic manufacturing method for paper-based phenolic resin laminates. 2. The paper base phenolic resin according to claim 1, wherein the polyvinyl alcohol-modified phenolic resin is obtained by dissolving polyvinyl alcohol in water and phenol, adding formaldehyde, and reacting under a basic catalyst. Method of manufacturing laminates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1166483A JPS59136251A (en) | 1983-01-27 | 1983-01-27 | Manufacture of paper base material phenol resin laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1166483A JPS59136251A (en) | 1983-01-27 | 1983-01-27 | Manufacture of paper base material phenol resin laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59136251A true JPS59136251A (en) | 1984-08-04 |
| JPH0344099B2 JPH0344099B2 (en) | 1991-07-04 |
Family
ID=11784246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1166483A Granted JPS59136251A (en) | 1983-01-27 | 1983-01-27 | Manufacture of paper base material phenol resin laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59136251A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01144427A (en) * | 1987-11-30 | 1989-06-06 | Shin Kobe Electric Mach Co Ltd | Production of laminated board of paper substrate and flame-retardant phenolic resin |
-
1983
- 1983-01-27 JP JP1166483A patent/JPS59136251A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01144427A (en) * | 1987-11-30 | 1989-06-06 | Shin Kobe Electric Mach Co Ltd | Production of laminated board of paper substrate and flame-retardant phenolic resin |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0344099B2 (en) | 1991-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6221371B2 (en) | ||
| JPH0344099B2 (en) | ||
| JPH0126374B2 (en) | ||
| JP2604846B2 (en) | Manufacturing method of laminated board | |
| JPS6049215B2 (en) | Manufacturing method of phenolic resin laminate | |
| JPS6049216B2 (en) | Manufacturing method of laminates | |
| JPS60198236A (en) | Manufacture of laminated board | |
| JPH0680859A (en) | Phenolic resin composition | |
| JPH04209647A (en) | Phenolic resin composition and copper-clad laminate | |
| JPS6128691B2 (en) | ||
| JP3302176B2 (en) | Resin composition for laminated board and laminated board using the same | |
| JPH0826167B2 (en) | Phenolic resin copper clad laminate | |
| JPH04224857A (en) | Phenol resin composition | |
| JPH10168146A (en) | Production of phenol resin | |
| JPS6230129A (en) | Production of laminated board | |
| JPS6037812B2 (en) | Method of manufacturing laminates | |
| JPH075768B2 (en) | Epoxy resin laminate | |
| JPS61183325A (en) | Laminated sheet and its production | |
| JPS61121932A (en) | Manufacture of phenolic resin laminated sheet | |
| JPS63210140A (en) | Production of laminate | |
| JPH02283753A (en) | Laminate resin composition | |
| JPS6250318A (en) | Production of modified phenolic resin for laminated sheet | |
| JPH01319562A (en) | Phenolic resin composition for laminate | |
| JPS6047291B2 (en) | Manufacturing method of laminates | |
| JPS60262644A (en) | Manufacture of phenol resin laminated board |