JPS59140077A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS59140077A JPS59140077A JP58014212A JP1421283A JPS59140077A JP S59140077 A JPS59140077 A JP S59140077A JP 58014212 A JP58014212 A JP 58014212A JP 1421283 A JP1421283 A JP 1421283A JP S59140077 A JPS59140077 A JP S59140077A
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- substrate
- layer
- bead
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
発明の技術分野
本発明は、サーマルプリンタに用いるサーマルヘッドに
関するものである。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a thermal head used in a thermal printer.
技術的背景およびその問題点
従来のサーマルヘッドは、第１図に示すように平板状の
絶縁基板（１）に発熱体層＋２１、導体ｒ＊ （３１、
発熱体部（４）、耐摩耗層（５）全形成し、制御回路用
の半導体素子！６） ｋ取付けてボンデングワイヤー（
力により接続し、表面には放熱板（８）全接着固定して
いる。Technical Background and Problems The conventional thermal head has a flat insulating substrate (1), a heating element layer +21, a conductor r* (31,
The heating element part (4) and wear-resistant layer (5) are fully formed, and the semiconductor element for the control circuit! 6) Attach k and bonding wire (
The connection is made by force, and the heat sink (8) is fully adhesively fixed to the surface.
このようなものｒよ、放熱板（８）が存しても絶縁基板
（１）の存在によって放熱性が悪いと云う問題がある。Such a device has a problem in that even if the heat sink (8) is present, the heat dissipation performance is poor due to the presence of the insulating substrate (1).
また、もう一つの昧題は、感熱紙との接触面積が比較的
大きいために発熱体部（４）における熱効率が低く、高
い印加電圧全必要とし、寿命が短かくなると云うもので
ある。Another problem is that since the contact area with the thermal paper is relatively large, the thermal efficiency of the heating element (4) is low, requiring a high applied voltage and shortening the life.
発明の目的
本発明は、全体の放熱性がよく、かつ、発熱体部におけ
る熱効率の尚いサーマルヘッドを得ることを目的とする
。OBJECTS OF THE INVENTION It is an object of the present invention to provide a thermal head which has good overall heat dissipation and also has a thermal efficiency in the heating element portion.
発明の概要
本発明は、金属板の表面に絶縁ガラス唐金形成した基板
としたので、熱伝導性が局〈て放熱性が良好であり、ま
た、発熱体部？ビードの頂部に位置させることにより感
熱紙との接触面積を小さくして発熱体部の熱効率を高め
、これにより、＃］加電圧會低くすることができ、寿命
を延ばすことができるように構成したものである。Summary of the Invention The present invention uses a substrate in which an insulating glass metal plate is formed on the surface of a metal plate, so that thermal conductivity is localized and heat dissipation is good. By positioning it at the top of the bead, the contact area with the thermal paper is reduced and the thermal efficiency of the heating element is increased, thereby reducing the applied voltage and extending the life. It is something.
発明の実施例 本発明の一実施例を第２図に基いて説明する。Examples of the invention An embodiment of the present invention will be described based on FIG. 2.
まず、金属板（９）が設けられ、この金桶板（９）には
幅方向に長込ビードα呻が形成されているとともに他方
には前記ビードα〔と反対方向へ突出して凹部ａυが円
形に形成されている。そして、前記ビードａ１と前記凹
部ａ〃とが形成された面に絶縁ガラス層ａ２が形成され
て基板α謙が構成される。この絶縁ガラス層（２）は厚
膜印刷法、ティップ法、スピンナ法等によって形成され
るものである。このような絶縁ガラス層（１邊の表面に
は前記四部Ｕυの表面を除いて発熱体層（ｔ４）と導体
層ａ９とが順次積層され、とくに前記ビード（１１の頂
部においては導体層（１５）の一部が切欠されて発熱体
部ａＱが形成され、この表面には耐摩耗層（１７）が積
層形成されている。First, a metal plate (9) is provided, and the metal plate (9) has a long bead α formed in the width direction, and the other side has a recessed part aυ that protrudes in the opposite direction to the bead α. It is formed in a circle. Then, an insulating glass layer a2 is formed on the surface where the bead a1 and the recess a are formed, thereby forming a substrate α. This insulating glass layer (2) is formed by a thick film printing method, a tip method, a spinner method, or the like. A heating element layer (t4) and a conductor layer a9 are sequentially laminated on the surface of such an insulating glass layer (1 side) except for the surface of the four parts Uυ, and especially on the top of the bead (11), a conductor layer (15 ) is partially cut out to form a heating element part aQ, and a wear-resistant layer (17) is laminated on the surface of this part.
また、前記凹部住υ内における前記絶縁ガラス層ＯＩの
表面には制御回路用の半導体素子α樽が固定され、ボン
デングワイヤーＨＫよってその凹部ａυ内において前記
導体層ＱＳＫ接続されている。そして、前記凹部αυは
保譲用のキャップ（至）により覆われている・
このような構成において、発熱体部−は基板０３の基面
より突出した形状になっているため、印字時に感熱紙の
接触面積が小さく、これにより、発熱体部（ｌＥ９での
熱の拡散が少なくて熱効率がきわめて高い。そのため、
発熱体部（［６）への印加電圧を低減しつるため、寿命
が長くなる０
また、半導体素子（１８はその接続用のポンチングワイ
ヤー翰とともに凹部ｔｌｌ）内に埋設されるので、この
部分が突出することがなく、感熱紙に接触することがな
く、また、電気的接続状態が安定しており、故障等が発
生しない。Further, a semiconductor element α barrel for a control circuit is fixed to the surface of the insulating glass layer OI in the recess av, and is connected to the conductor layer QSK in the recess av by a bonding wire HK. The recess αυ is covered with a storage cap. In this configuration, the heating element protrudes from the base surface of the substrate 03, so the heat-sensitive paper The contact area of
Since the voltage applied to the heating element part ([6) is reduced, the lifespan is extended.0 Also, since the semiconductor element (18 is buried in the recessed part tll together with the punching wire for connecting it), this part There is no protrusion, there is no contact with thermal paper, and the electrical connection is stable, so failures and the like do not occur.
発明の効果
本発明は、上述のように基板は金属板の表面に絶縁ガラ
ス層を形成したものであるため、その基板自体の熱伝導
性が高く、これにより、放熱性を高めることができ、ま
た、発熱体部はビードの頂部に位置しているので、感熱
紙との接触面積が小さくて熱効率を高めることができ、
印加電圧？低くして寿命を延ばすことができるものであ
る。Effects of the Invention In the present invention, as mentioned above, since the substrate is formed by forming an insulating glass layer on the surface of a metal plate, the substrate itself has high thermal conductivity, thereby improving heat dissipation. In addition, since the heating element is located at the top of the bead, the contact area with the thermal paper is small, increasing thermal efficiency.
Applied voltage? It can be lowered to extend its lifespan.
第１図は従来例金示す縦断側面図、第２図は本発明の一
実施例を示す秩断側面′図である。
９・・・金属板、１０・・・ビード、１２・・・絶縁ガ
ラス層、１３・・・基板、１４・・・発熱体層、１５・
・・導体層、１６・・・発熱体部
出 願 人 東京′亀気株式会社
あ」図
３／閃FIG. 1 is a vertical cross-sectional side view showing a conventional example, and FIG. 2 is a cross-sectional side view showing an embodiment of the present invention. 9... Metal plate, 10... Bead, 12... Insulating glass layer, 13... Substrate, 14... Heating element layer, 15...
...Conductor layer, 16...Heating element part Applicant: Tokyo 'Kameki Co., Ltd.' Figure 3/Flash
Claims (1)
ることにより発熱体部音形成するようにしたものにおい
て、凸状のビードｆ有する金属板の光面に絶縁ガラス層
を形成した基板を設け、前記ビードの頂点に前記発熱体
部全位置させたことを特徴とするサーマルヘッド。In a device in which a heating element layer and a conductor layer are laminated with VC on a substrate and etched to form a heating element sound, the substrate is formed with an insulating glass layer formed on the optical surface of a metal plate having a convex bead f. A thermal head, wherein the heating element is entirely located at the apex of the bead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58014212A JPS59140077A (en) | 1983-01-31 | 1983-01-31 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58014212A JPS59140077A (en) | 1983-01-31 | 1983-01-31 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59140077A true JPS59140077A (en) | 1984-08-11 |
Family
ID=11854786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58014212A Pending JPS59140077A (en) | 1983-01-31 | 1983-01-31 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59140077A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6041249U (en) * | 1983-08-27 | 1985-03-23 | アルプス電気株式会社 | thermal head |
| JPS6098655U (en) * | 1983-12-10 | 1985-07-05 | 株式会社フジクラ | Circuit board for thermal head |
| JPS60248367A (en) * | 1984-05-25 | 1985-12-09 | Canon Inc | Thermal head |
| JPH02137943A (en) * | 1988-11-21 | 1990-05-28 | Casio Comput Co Ltd | thermal head |
-
1983
- 1983-01-31 JP JP58014212A patent/JPS59140077A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6041249U (en) * | 1983-08-27 | 1985-03-23 | アルプス電気株式会社 | thermal head |
| JPS6098655U (en) * | 1983-12-10 | 1985-07-05 | 株式会社フジクラ | Circuit board for thermal head |
| JPS60248367A (en) * | 1984-05-25 | 1985-12-09 | Canon Inc | Thermal head |
| JPH02137943A (en) * | 1988-11-21 | 1990-05-28 | Casio Comput Co Ltd | thermal head |
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