JPS59142247A - Aromatic polyether amid resin composition - Google Patents

Abstract

PURPOSE:To provide an arom. polyether amide resin compsn. having excellent flow characteristics, by blending a polyorganosiloxane as a modifier. CONSTITUTION:A terminal-blocked polyorganosiloxane such as silicone oil, silicone resin or silicone rubber (e.g. SH-710, a product of Toray silicone K.K.) is used. 0.1-15pts.wt. polyorganosiloxane is blended with 100pts.wt. arom. polyether amide resin [having a viscosity of 0.2-15dl/g (in dimethylformamide, 0.2g/ dl at 30 deg.C)] having a repeating unit of the formula (wherein R1-R4 are each hydrogen, lower alkyl, lower alkoxy, chlorine, bromine, R5, R6 are each hydrogen, methyl, ethyl, trifluoromethyl, trichloromethyl; Ar is p-phenylene, m-phenylene, diphenylene ether, diphenylene sulfone, diphenylene, naphthylene).

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin composition comprising an aromatic polyetheramide resin mixed with a modifier.

General formula (II) (wherein R1-R4 represent hydrogen, lower alkyl, lower alkoxy group, chlorine or bromine, and may be the same or different from each other.Rs and R6 are hydrogen, methyl group, ethyl It is particularly advantageous to obtain an aromatic polyamide from an aromatic diamine containing an ether bond represented by a trifluoromethyl group, a trifluoromethyl group, or a trichloromethyl group, which may be the same or different from each other, and an aromatic dicarboxylic acid halide. It is known from Japanese Patent Publication No. 52-23198 and US Pat. No. 3,505,288.

By the way, aromatic polyether amide can be obtained using such a special diamine as a raw material.

Tensile strength 9 Mechanical properties such as bending strength and impact strength, thermal properties such as heat distortion temperature and thermal decomposition, and electrical properties such as arc resistance, dielectric constant, and dielectric loss.

It maintains excellent properties such as flame resistance and dimensional stability,
Therefore, it can be made by injection molding, extrusion molding, press molding, etc.1
It is expected to have a wide range of applications such as general molded products and films.

However, a drawback of this type of aromatic polyether amide is that it has poor moldability. In general, evaluation of moldability is extremely important in plastics, and even if the plastic itself has inherently excellent properties, if the moldability is poor, it may be difficult to economically manufacture the product. Not only is it difficult to produce, but also the excellent properties cannot be fully exhibited in products.

For example, when a product is made by injection molding using a polymer with a high softening temperature and high melting temperature.

High plasticization temperature, high injection pressure, high mold temperature, etc. are required, which not only causes high cost, but also high plasticization temperature induces thermal decomposition of the polymer, and high injection pressure This may cause distortion. Furthermore, if such strict conditions are not met, defects in appearance such as short shots, sink marks, and flow marks may occur, or mechanical properties may deteriorate. Therefore, it has been desired to improve the moldability of aromatic polyetheramides as well.

The present inventors have conducted intensive studies to improve the fluidity of the resin while maintaining the excellent properties of aromatic polyether amide, and as a result, have arrived at the present invention.

That is, the present invention is based on the general formula (Il (9) in formula (1), R1-& represents hydrogen, a lower alkyl group, a lower alkoxy group, chlorine or bromine.

They may be the same or different. R5 and R6 are hydrogen, a methyl group, an ethyl group, a trifluoromethyl group, or a trichloromethyl group, and may be the same or different.

ArUp-phenylene group, metaphenylene group.

Contains 100 parts by weight of an aromatic polyether amide resin having a repeating unit represented by a dienylene ether group, a diphenylene sulfone group, a diphenylene group, or a naphthylene group) and 0.1 to 15 parts by weight of polyorganosiloxane. This invention relates to aromatic polyetheramide resin compositions.

The aromatic polyetheramide resin used in the present invention is an aromatic diamine represented by the above-mentioned general formula ([1] and an aromatic dicarboxylic acid civalide represented by the following general formula (In)).

XC0-Ar-C0X (III) (wherein, Ar?d p-)22dine group 2m-ph22dine group, diphenylene ether group, diphenylene sulfone group,
It is obtained by polycondensation reaction of diphenylene group, naphthylene group, and X is chlorine or bromine.

As the aromatic diamine represented by the general formula (n), 2
．． 2-bis(4-(4-aminophenoxy)phenyl)
Propane, 2,2-bis[3-methyl-4-(4-aminophenoxy)phenyl]propane, 2,2-bis[3
-chloro-4-(4-aminophenoxy)phenyl]propane, 2-bis[3-bromo-4-(4-aminophenoxy)phenyl]furopane, 2+2-bis[3-ethyl-4-(4-amino phenoxy)phenyl]propane, 2.2-bis[3-globyl-4-(4-aminophenoxy)phenyl]propane, 2.2-bis[3-isopropyl-4-(4-aminophenoxy)phenyl]
Propane, 2゜2-bis[3-butyl-4-(4-aminophenoxy)phenyl]propane, 2+2-bis[3
-5eC--Butyl-4-(4-aminophenoxy)phenyl]propane, 2,2-bis[3-methoxy-4-
(4-aminophenoxy)phenyl]propane, 2.2
-bis[3-ethoxy-4-(4-aminophenoxy)
phenyl]propane, λ2-bis[3,5-dimethyl-
4-(4-aminophenoxy)phenyl]propane, 2
．． 2-bis[3,5-dichloro-4-(4-aminophenoxy)phenyl]propane, 2,2-bis(3,5-
Dibromo-4-(4-aminophenoxy)phenyl]propane, 2,2-bis(3,5-dimethoxy-4-(4
-aminophenoxy)phenyl]propane, 2,2-bis[3-chloro-4-(4-aminophenoxy)-5-
methylphenyl]propane, 1,1-bisC4-(4-
aminophenoxy) phenyldiethane, i, i-bis[
3-methyl-4-(4-aminophenoxy)phenyldiethane, 1.1-bis[3-chloro-4-(4-aminophenoxy)phenyldiethane, 1.1-bis[3-
Bromo-4-(4-aminophenoxy)phenyldiethane, 1.1-bis[3-ethyl-4-(4-aminophenoxy)phenyldiethane, 1.1-bis[3-propyl-4-(4 -amitunoenoxy)phenyldiethane,
1,1-bis[3-ingrovir-4-(4-aminophenoxy)phenyldiethane, 1,1-bis[3-butyl-4-(4-aminophenoxy)phenyldiethane,
1,1-bis('3-5ec-butyl-4-(4-aminophenoxy)phenyldiethane, 1,1-bis[3-
Methoxy-4-(4-aminophenoxy)phenyldiethane, 1,1-bis[3-ethoxy-4-(4-aminophenoxy)phenyldiethane, 1,1-bis(3,5
-di,7thi-4-(4-aminophenoxy)phenyldiethane, 1,1-bis[3,5-dichloro-4-(
4-amitunoenoxy)phenyldiethane, 1. l-Bis[3,5-dibromo-4-(4-amitunoenoxy)
Phenyldiethane, 1,1-bis[3,5-dimethoxy-4-(4-aminophenoxy)phenyldiethane, 1
, 1-bis[3-chloro-4-(4-aminophenoxy)phenyl-5-methylphenyl]ethane, bis[4-
(4-Aminophenoxy)phenyldimethane.

Bis(3-methyl-4-(4-aminophenoxy)phenyldimethane, bis[3-chloro-4-(4-aminophenoxy)phenyldimethane).

Bis[3-bromo-4-(4-aminophenoxy)phenyldimethane, bis[3-ethyl-4-(4-aminophenoxy)phenyldimethane.

Bis[3-propyl-4-(4-aminoenoxy)phenyldimethane, bis[3-ingrovir-4-(4-
aminophenoxy) phenyl dimethane, bis[3-butyl-4-(4-aminophenoxy) phenyl dimethane,
Bis(3-see-butyl-4-(4-aminophenoxy)phenyldimethane, bis[3-methoxy-4-(4
-aminophenoxy)phenyldimethane, bis[3-ethoxy-4-(4-aminophenoxy)phenyldimethane, bis[3,5-dimethyl-4-(4-aminophenoxy)phenyldimethane.

Bis[3,5-dibromo-4-(
4-aminophenoxy)phenyldimethane, bis[3,
5-dimethoxy-4-(4-aminophenoxy)phenyldimethane, bis[3-1'rolo-4-(4-aminophenoxy)-5=methylphenyl]methane, 1. l
, 1.3.3.3-hexafluoro-2,2-bisC
4-(4-aminophenoxy)phenyl]propane, 1
,1,1゜3,3,3-hexachloro-2,2-bis(
4-(4-aminophenoxy)phenyl]propane, 3
゜3-bis(4-(4-aminophenoxy)phenyl)
Pentane, 1.1-bis(4-(4-aminophenoxy)phenyl)propane, 1.1.1.3°3.3-hexafluoro-2,2-bis[3,5-dimethyl-4-
(4-aminophenoxy)phenyl]propane, 1.
1.1.3.3.3-hexachloro-2,2-bis[3
,5-dimethyl-4-(4-aminophenoxy)phenyl]propane, 3,5-bis[3,5-dimethyl-4-
(4-aminophenoxy)phenyl]pentane, 1.1
-bis(3,5-dimethyl-4-(4-aminoneenoxy)phenyl]propane, 1.1.1.3.3.3-
hexafluororo-2,2-bis[3,5-dibromo-
4(4-aminophenoxy)phenyl]propane, 1,
1゜1,3.3.3-hegizachloro-2,2-bis(3
,5-dibromo-4-(4-aminophenoxy)phenyl]pan, 3,3-bis[3,5-dibromo-4
-(4-aminophenoxy)phenyl]pentane, 1,
1-bis[3,5-dibromo-4-(4-aminophenoxy)phenyl]propane, 2°2-bis[4-(4-
aminophenoxy) phenylcobutane, 2+2-bis[
3-Methyl-4-(4-aminophenoxy)phenylcobutane.

2.2-bis[3,5-dimethyl-4-(4-aminophenoxy)phenylcobutane, 2,2-bis[315-
Dibromo-4-(4-aminophenoxy)phenylcobutane, 1.1.1.3.3.3-hexafluoro-2
, 2-bis[3-methyl-4-(4-aminophenoxy)phenyl]propanato.

All known aromatic dicarboxylic acid cybarides represented by the general formula (III) used in the present invention are useful. For example, terephthalic acid dichloride, terephthalic acid dibromide, isophthalic acid dichloride, isophthalic acid sifuromide, diphenyl ether dicarboxylic acid dichloride-4,4', diphenyl ether carboxylic acid sibromide-4,4', diphenylsulfone dicarboxylic acid dichlorophyte-4,4', Dienylsulfonedicarboxylic acid dibromide-4,4', diphenyldicarboxylic acid dichloride-4,4', diphenyldicarboxylic acid dibromide-4,4', naphthalenedicarboxylic acid dichloride-1,5 or naphthalenedicarboxylic acid dichloride-1,5, etc. At least one of them is used.

The blending ratio of the aromatic diamine and the aromatic dicarboxylic acid sybaride may be set within a range of 1 equivalent of the former to 0.9 to 1.2 equivalent of the latter. If it is out of the above-mentioned range, it will be difficult to obtain a high molecular weight product, and only an oligomer-like product that does not exhibit a resinous state will be obtained. The latter aromatic dicarboxylic acid cybaride is preferably in a range of 0.97 to 1.03 equivalents. In particular, in the case of the same equipment, the maximum molecular weight of the target aromatic polyetheramide resin can be obtained.

In the present invention, a part of the aromatic diamine can be replaced with other known aromatic diamines. The amount should conveniently have an upper limit of 50 molti (based on the total amount of aromatic diamine). If it exceeds 50 moles,
In particular, there is a risk of impairing moldability. Here, examples of other aromatic diamines include m-phenylenediamine, p-
Phenyl diamine, 4.4'-diaminodiphenylmethane, 4.4'-diaminodiphenyl ether, 4.4
'-diaminodiphenylsulfone,.

4,4'-diaminodiphenylpropane-2,2゜4
．． 4'-diaminodiphenyl sulfide, 1,5-diaminonaphthalene, 4,4'-diaminodiphenylethane, m-)lylenediamine, p-tolylenediamine,
3,4'-diaminobenzanilide, 1,4-diaminonaphthalene, 3,3'-dichloro-4,4'-diaminodiphenyl, pentedine.

4.4'-diaminodiphenylamine, 4.4'-diaminodiphenyl-N-methylamine, 4.4'-diaminodiphenyl-N-phenylamine, 3.3'-diaminodiphenylsulfone, 4.4'-diaminodiphenylamine Examples include ale diethylsilane and 4,4'-diaminodiphenylsilane, and at least one of these is used.

In addition, in the present invention, known aliphatic diamines such as piperazine, hexamethylene diamine, heptamethylene diamine, octamethylene diamine, nonamethylene diamine, decamethylene diamine, p-xylylene diamine, m-xylylene diamine, tetra Methylene diamine, dodecamethylene diamine, 4,4-dimethyl hebutamethylene diamine, 3-methyl hebutamethylene diamine, 2,11-diaminododecane.

1.12-diaminooctadecane and the like can also be used in combination. The combined use of aliphatic diamine has the effect of further improving the moldability of the target aromatic polyetheramide resin. However, as the amount of 7 is increased, the heat resistance gradually decreases, so the amount should be set so as not to impair the purpose of the present invention. They should be used together within the following range (based on the total amount of diamines). The aliphatic diamine may be used alone or in combination with the other aromatic diamine described above and the aromatic diamine represented by the general formula +11.

When the aforementioned various diamines are used in combination, the blending ratio of all the diamine components and the aromatic dicarboxylic acid sybaride can be set on exactly the same basis as described above.

In the present invention, for the 9 reaction, a method already used for the reaction between an amine and an acid can be directly adopted, and the conditions are not particularly limited. For example, this can be achieved by an interfacial polycondensation method, a solution polycondensation method, a solution polycondensation method, or the like. In the interfacial polycondensation reaction, a known water-soluble neutralizing agent described below is used. In addition, in the case of solution polymerization method, triethylamine,
Pyridine, tributylamine.

A known neutralizing agent consisting of a tertiary amine such as pyridine is used. In the interfacial polycondensation method and the solution polymerization method, a reaction solvent is used, and this solvent should be one that dissolves at least one of aromatic diamine reed or aromatic dicarboxylic acid civalide, preferably both. Must. A representative example of a particularly effective reaction solvent for use in the present invention is cyclohexanone. Some examples of other solvents that may be used include methylene chloride, trichlene, perchlorene, ethane dichloride, nitrobenzene, chloroform, carbon tetrachloride, and diisobutyl ketone.

Acetophenone, p-methylacetophenone.

N,N-dimethylformamide, N,N-dimethylacetamide, N,N-diethylformamide.

N,N-diethylacetamide, N,N-dimethylmethoxyacetamide, dimethylsulfoxide.

N-methyl-2-pyrrolidone, pyridine, dimethylsulfone, hexamethylphosphoramide.

Examples include tetramethylene sulfone and dimethyltetramethylene sulfone.

Two or more reaction solvents may be used in combination, if necessary, to facilitate the dissolution operation.

Furthermore, in order to obtain a product with as high a molecular weight as possible, it is preferable to use a highly dehydrated solvent for dissolving the aromatic dicarboxylic acid cybaride. Particularly when solution polycondensation is carried out using a polar solvent such as N,N-dimethylformamide, N,N-dimethylacetamide, or N-methyl-2-pyrrolidone.

5-10% by weight of lithium chloride as co-solvent.

Synthesis by adding calcium chloride, calcium rhodan, etc. is advantageous as it significantly increases solubility.

In addition to this co-solvent, all other known co-solvents as described below are effective. Furthermore, according to research conducted by the present inventors, the following effective reaction method was discovered.

That is, it is like the usual interfacial polycondensation method.

Unlike the method of dissolving diamine in alkaline aqueous solution,
Disperse diamine in alkaline aqueous solution.

This is a method in which a solution of aromatic dicarboxylic acid cybaride dissolved in an organic solvent is added to the mixture and reacted. By polymerizing in this method, the resulting halogenated aqueous solution is neutralized with a neutralizing agent and dissolved in a mixture of water and metal halide, and when the polymer is precipitated from the organic phase, the polymer is Since no agent remains, this gives favorable results to the properties of the polymer. In this case, the amount of alkali used is at least 1.3 equivalents relative to the aromatic dicarboxylic acid halide, preferably from 1.0 to 1.1 equivalents. Here, the neutralizing agent used is sodium hydroxide that dissolves in water.

Examples include, but are not limited to, potassium hydroxide, sodium carbonate, and sodium hydrogen carbonate.

Further, the amount of water is sufficient as long as the above-mentioned neutralizing agent is sufficiently dissolved at room temperature. , of course, even if more than that is used, it will not interfere with one reaction. Also, the reaction temperature is the state where water is liquid.

That is, the temperature is in the range of 0 to 100°C, preferably 5 to 60°C. The -F distribution condensation method can be carried out, for example, by the following procedure. Trench.

Dissolve the neutralizing agent in an appropriate amount of water and add the aromatic diamine to it. Furthermore, a solution of aromatic dicarboxylic acid halide dissolved in an organic solvent is added and reacted. At this time, it is preferable to carry out the reaction in a state where the aromatic diamine is dispersed in the alkaline aqueous solution by stirring. Then only the organic phase is separated.

The polymer is precipitated by pouring it into an organic solvent that does not dissolve the polymer and is easily compatible with the reaction solvent. By filtering this, an aromatic polyetheramide resin is obtained.

In the present invention, the aforementioned various aromatic diamines and aliphatic diamines can be used as neutralizing agents. In this case, the amount may be increased at a rate of 1 equivalent or less (an amount not involved in the reaction).

In addition, a known polyamide-forming reaction 9 between an amide-forming derivative other than aromatic dicarboxylic acid cybalide and an aromatic diamine represented by the general formula (II) 9 can also be used, for example, by high-temperature polycondensation using a phosphorus catalyst or transesterification method. An aromatic polyetheramide resin having repeating units represented by formula (I) can be obtained.

The aromatic polyetheramide resin of the present invention has a viscosity (concentration of 0.2 f/ltt in dimethylformamide, 3
0℃) is preferably 0.2 to 1.5 de/y-.

0.4~0.8 d7! / f-. 0.2 ct
When the ratio is less than e/1, the strength tends to decrease, and when it exceeds 1.5 dl/f, the moldability tends to be poor.

The polyorganosiloxane used in the present invention has a molecular trunk in which silicon atoms and oxygen atoms alternate, and an organic group is bonded to the silicon atoms. The type of organic group and the degree of intermolecular crosslinking determine whether the polyorganosiloxane becomes a fluid.

Decide whether it will be an elastomer or a gum. In the present invention, any of the two commonly known liquid or gummy chain-terminated polyorganosiloxanes, ie, silicone oils, may be used.

Silicone resin, silicone rubber, etc. may be used.

In the present invention, there are no particular limitations on the method of dispersing polyorganosiloxane in aromatic polyetheramide. The key is that the polyorganosiloxane is uniformly dispersed throughout the aromatic polyetheramide. In incomplete or non-uniform dispersion, agglomerates tend to form and can impair the physical properties of the composition.

The dispersion operation can be performed in a variety of known ways. For example, mixing two fluids in granular or powder form in a panburi mixer and/or roll mill, adding directly to aromatic polyetheramide resin powder, adding aromatic polyetheramide resin powder to alcohols, ketones and hydrocarbons. Dissolve or swell in low boiling point solvents such as immersion.

Stir and mix polyorganosiloxane to this.

A method of impregnating or adhering polyorganosiloxane to the aromatic polyethylamide resin powder by distilling off the solvent, a method of extruding the mixture using an extruder, etc. are used.

Regarding the amount of polyorganosiloxane added, if it is too small, the effect will not be recognized; if it is too large,
Fluidity is significantly improved, but mechanical strength is reduced. Therefore, the amount of polyorganosiloxane added is 0.00 parts by weight per 100 parts by weight of aromatic polyetheramide resin.
1 to 15 parts by weight is practical, preferably 0.1 to 10 parts by weight, more preferably 0.2 to 5 parts by weight.

Furthermore, by blending other types of polymers into the resin composition of the present invention, its properties can be improved, such as antioxidants, ultraviolet absorbers, and lubricants.

By coexisting additives such as flame retardants.

Its properties can also be improved.

Hereinafter, the present invention will be explained in more detail with reference to Examples.
It is not limited to this. Hereinafter, "chi" means "wt%".

Example 1 A 10-functional cyclohexanone solution of an acid chloride mixture with a mixing ratio of terephthalic acid dichloride and isophthalic acid dichloride of 1:1 (weight ratio) and 2,2-bis(
2 of 4-('4-aminophenoxy)phenylpropane
An aromatic polyether amide was produced by contacting and reacting a 0% cyclohexanone solution in the presence of a 10% caustic soda aqueous solution. However, the blending ratio of the acid chloride mixture and the aromatic diamine is equimolar. The reduced viscosity of this in dimethylformamide (0.2ff1di) was 0.94 di/f. Silicone oil (
8H710 made by Toray Silicone ■, viscosity 500cs, /
At 25°C, methylphenylpolysiloxypoly) was added in the amount shown in Table 1, and pelletized at 300 to 320°C using an extruder. Table 1 shows the fluidity and tensile properties of each pellet. The fluidity was measured at 300° C. and 100 edges/crn2 using a Koka type flow tester manufactured by Takasu Seisakusho.

Table 1 Example 2 Example 1 of an acid chloride mixture with a mixing ratio of terephthalic acid dichloride: inophthalic acid dichloride of 4:6 (molar ratio)
0-functional cyclohexane solution and 2,2-bis(4-(4-
From aminophenoxy)phenyl]propane, Example 1
An aromatic polyetheramide resin was produced in the same manner as above. After completing the polymerization, the resulting polymer solution was separated from the aqueous phase, washed with water, and then treated with silicone oil (Toray Silicone H, 5
H2oo.

1000C8/25°C, dimethylpolysiloxane) was added at a ratio of 2 parts by weight to 100 parts by weight of the polymer. This was concentrated and solidified to obtain a dimethylpolysiloxane-containing aromatic polyetheramide resin composition. The reduced viscosity was 0.78. This was pelletized at 300 to 310°C to form a cut piece. 300°C, 100Kg
/an2te(r) fluidity is 5,6 x 10-3cc
/ 8 + tensile strength B 20 Ky 7cm2. Elongation factor 10, tensile modulus 3. I X 1 o'Ky/c
It was m2.

Example 3 Acid chloride mixture with a mixing ratio of terephthalic acid dichloride: isophthalic acid dichloride of 1:1 (weight ratio) and λ
An aromatic polyetheramide resin having a reduced viscosity of 0.77 dl/f/- was obtained from 2-bisC4-(4-aminoneenoxy)phenyl]propane by solution polymerization using N-methylpyrrolidone as a solvent. Add silicone oil (manufactured by Toray Silicone ■, 5H) to 10 parts by weight of this polymer.
550° viscosity 125 cs/25°C, 1 part by weight of methylphenylpolysiloxane was added, and the mixture was pelletized at 300 to 310°C to form a test piece. 300'C, 100K
Fluidity in y/Cm2 Vi7. lX10s CC/S,
Tensile? Strength is 800 Kp 7cm2, extension U 1i
%, pull 9N reel modulus 3, I X I Q'Ky/
cIT12 Te Atsuta.

Example 4 107 Separable flask, stirring bar, thermometer.

Set the dropping funnel and add 171.8f of NaOH to 88% of water.
Dissolve it to 00M and put it in a flask. Then 2,2-bis(:4-(4-aminophenoxy)phenyl shift o
Han 594 P and He 4* 4'-Diamino diphenyl ether 667 was dissolved in 3.4 Kf of cyclohexanone, poured into the flask, and cooled to -2°C. On the other hand, terephthalic acid dichloride 182y- and isophthalic acid dichloride 182y- were combined with cyclohexanone 2.
Dissolve in 4Kg. This acid chloride solution is poured from the dropping funnel, making sure that the temperature of one reaction does not exceed 10°C. 3 hours after dropping, the reaction solution 9 was poured into methanol to isolate the polymer. 17. Finely mix 1 part by weight of 13 parts of silicone resin (KE550 manufactured by Shin-Etsu Chemical ■) with 10 parts by weight of the aromatic polyetheramide resin powder obtained by drying. 17. The pellets were pelletized using an extruder at 300 to 320°C to form test pieces. 300℃, 100V4/cm
The fluidity at 2 is + 5.8 x 10-3 cc/s,
Tensile strength s 14 Kg/cm2. Elongation 24%, tensile modulus 3. OX 10-'Ky 7cm2.

Example 5 An aromatic polyetheramide powder was obtained using the same equipment and method as in Example 4 using raw materials having the following composition.

Silicone oil (
Made by Toray silicone ■, 5H510, 500C3/25
℃, 2 parts by weight of methylphenylpolysiloxane) was added,
It was pelletized at 300°C and a test piece was molded. 300
℃、100KF Flowability at 7cm2 is 6.4
X 10-3cc/s, tensile strength 814Kg/C
m2° elongation 19%, tensile modulus 3. I x 10'
~/cm2.

Example 6 A polymer was obtained using the same equipment and method as in Example 4 using raw materials having the following composition.

Fluorine-modified silicone oil (manufactured by Toray Silicone ■, FS-1265,3) was added to 100 parts by weight of the obtained resin powder.
00C5/25°C) 0.5 parts by weight was added.

It was pelletized at 300°C and a test piece was molded.

Fluidity at 300℃, IQQ Kg/cm2 is 5.4 x 10-3 CC/S, tensile strength is 814
Kg 7cm2. Elongation 7 inches, tensile modulus 3.2 x
10' Kp/cm2.

Claims (1)

[Claims] 1. General formula (1) () (However, in formula (1), R1-R4 represent hydrogen, a lower alkyl group, a lower alkoxy group, chlorine or bromine, and even if they are the same as each other) and R6 are hydrogen, a methyl group, an ethyl group, a trifluoromethyl group, or a trichloromethyl group, and may be the same or different from each other. Ar is p-phenylene, methanenylene, di Phenylene ether, diphenylene sulfone,
An aromatic polyetheramide resin composition comprising 100 parts by weight of an aromatic polyetheramide resin having a repeating unit represented by diphenylene or naphthylene groups and 0.1 to 15]i parts fc of polyorganosiloxane.