JPS59152190A - Abrasion-resisting substrate for hopper - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wear-resistant member for the inner wall surface of a hopper used as an input port for ore, etc.

Conventionally, hoppers used as input ports for ores, etc., are usually made of iron plates, etc., but they suffer from severe wear due to friction when loading ores, etc., and often have to be repaired or replaced. During this time, equipment was stopped and maintenance required manpower, resulting in inconveniences such as reduced work efficiency and increased repair costs.

As a method to prevent this wear, methods such as welding special steel to the parts subject to wear have been considered, but it has not been possible to greatly extend the service life considering the price.

Another possible method is to metalize ceramics using the molybdenum manganese method, etc., and bond this to a metal substrate by silver brazing, etc., and then weld or bolt the plate to the worn part of the hopper, but in this case, Metallization cannot be achieved due to high temperatures, and equipment costs are high and it requires a lot of work.

The cost will be high. Furthermore, in the case of a hopper, etc., the shape is large, so it is preferable to make each metal substrate itself large because it reduces the number of pieces to be installed, but metallization bonding of a large metal substrate and ceramics at high temperature Prevents cracks in ceramics due to differences in thermal expansion of the substrate,
This makes metallization bonding difficult, and even if it can be done, it is highly difficult and expensive, making it impractical.

The present invention solves these disadvantages and provides a wear-resistant substrate for a hopper that is extremely economical and satisfies usage needs.

As shown in FIG. When ultrasonic vibration is applied to the vibrator 2, the contact surface between the ceramic 3 and the molten alloy 1 is cavitated, which promotes the liquid phase-biphase interface reaction, and the contact surface between the ceramic 3 and the molten alloy 1 is metallized. .

In this case, an optimal Zn alloy, Pb alloy, etc. may be used depending on the required strength of metallization and usage conditions.

For example 7. When using n-alloy, it can withstand relatively high temperatures2
It is possible to obtain metallization with considerably high mechanical strength.1 Mechanical strength that is sufficient to support commonly used hoppers.
Temperature strength can be obtained.

Next, as shown in FIG. 2, for example, a metal substrate 5 having mounting bolts 4 on the bottom surface is preheated to near the melting point of the molten alloy 1, and the metallized surface 6 of the ceramics 3 described above is placed on it in a still molten state. and join them all at once. In this case, if necessary, 7lux can be used on the joint surface to facilitate the joining.Also, the metal substrate 5 can be hot-dip galvanized in advance, and the ceramic 3 ultrasonically metalized with the above-mentioned Shida Zη alloy can be joined. Not only does it provide very good bonding, it can be used in most types of hoppers in terms of temperature and mechanical strength, and it also provides rust prevention.

Unlike conventional metallization using a high-temperature furnace,9 in the case of the present invention, whether Zn alloy or Pb alloy is used, metallization is performed at a relatively low temperature, so the difference in thermal expansion is small, and the metallization Because the alloy is soft, it absorbs thermal expansion differences to a certain extent, so cracks do not occur even when metallizing a large ceramic and metal substrate. Therefore, even when attaching a wear-resistant substrate to a hopper of the same size, Since fewer pieces need to be installed, the amount of installation work can be reduced accordingly.

In order to attach the wear-resistant substrate for hopper of the present invention to the hopper, it is sufficient to line up the wear-resistant substrate for hopper of the present invention with bolts on the parts of the hopper inner wall that are subject to severe wear, and in this way, the wear-resistant substrate for hopper of the present invention can be attached to the hopper. By laying the substrates 1 and 2 together, the inner wall surface of the hopper is protected by abrasion-resistant ceramics, so the service life can be greatly extended. It can be installed and used in the same way.

The present invention uses ultrasonic vibration for metallization.
Especially high-temperature furnaces and gas snow open-air furnaces.

Because it does not require a vacuum furnace, equipment costs are low, and it can be used for both small and large products, and metallization and bonding can be done in one low-temperature heating process.

It is economical because it can be used for a long time. Furthermore, since the tutarized bonding is performed at a relatively low temperature, the residual stress of the ceramics 3 is also slightly low, so that it can be applied to various types of ceramics as required.

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[Brief explanation of drawings]

FIGS. 1 and 2 are explanatory diagrams of metallized bonding of the wear-resistant substrate for hora-ku of the present invention. 1 is a molten alloy for metallization, 2 is an ultrasonic vibrator, 3 is ceramics, 4 is a mounting bolt, 5 is a metal substrate, and 6 is a metallized surface. Patent applicant Kawaso Denzai Kogyo Co., Ltd. Representative Miki Osamu Kawamoto-4~

Claims (1)

[Claims] A ceramic plate subjected to ultrasonic vibration is immersed in a molten alloy, and immediately after the immersed surface is metallized, the metallized surface is preheated to a temperature close to the melting point of the molten alloy, and a mounting portion is provided on the back surface. on a metal substrate. A wear-resistant substrate for hoppers characterized by bonding, metallizing, and bonding in one process.