JPS59189686A - Display device - Google Patents

Display device

Info

Publication number
JPS59189686A
JPS59189686A JP58066168A JP6616883A JPS59189686A JP S59189686 A JPS59189686 A JP S59189686A JP 58066168 A JP58066168 A JP 58066168A JP 6616883 A JP6616883 A JP 6616883A JP S59189686 A JPS59189686 A JP S59189686A
Authority
JP
Japan
Prior art keywords
reflector
reflecting
pieces
led chips
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58066168A
Other languages
Japanese (ja)
Other versions
JPH0316794B2 (en
Inventor
Kiyoharu Nakamura
清春 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP58066168A priority Critical patent/JPS59189686A/en
Publication of JPS59189686A publication Critical patent/JPS59189686A/en
Publication of JPH0316794B2 publication Critical patent/JPH0316794B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE:To improve reflection effect, to prevent decrease in reliability of bonding, and to obtain a display device with good productivity, by constituting a reflector by combining two or more reflecting pieces, whose reflecting surfaces facing the peripheral side surface parts and the back surface parts of light emitting diode chips are formed as a unitary body. CONSTITUTION:LED chips 8A, 8B,... are provided on a lead frame 2, and wires are connected. The lead frame 2 is held by reflecting pieces 12A and 12B. At this time, a protruded part 24 of the reflecting piece 12A is inserted into recess parts 30A and 30B of the reflecting piece 12B. Both reflecting pieces are combined as a unitary body. The peripheral side surface parts and the back surface parts of the LED chips 8A, 8B,... are covered by reflecting surfaces 14, 16, 20, and 26. A lens 34, which covers the surfaces of the LED chips 8A, 8B,... is formed by a synthetic resin such as epoxy at the opening part of a reflector 12. The resin is infiltrated into the junction plane of the reflecting pieces 12A and 12B and fixed so as to combine them as a unitary body. Light beams (a)-(d) emitted from the LED chips 8A, 8B,... are reflected by the reflecting surfaces 14, 16, 20, and 26 of the reflector 12 by way of the lens 34 directly, and outputted to the outside. Thus, reflction efficiency is improved.

Description

【発明の詳細な説明】 この発明は表示装置に係り、特に発光ダイオードを用い
た表示装置の反射器の改良に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a display device, and more particularly to an improvement in a reflector of a display device using light emitting diodes.

従来、発光ダイオードで形成される表示装置には、開口
部を円錐面に形成して反射面とした円筒状の反射器に、
リードフレームに設置された発光ダイオードを臨ませた
ものがある。このような表示装置は、発光ダイオードの
背面部から光が洩れ、反射器の反射効率が低い欠点があ
る。Conventionally, display devices made of light emitting diodes include a cylindrical reflector with a conical opening and a reflective surface.
There is one that features a light emitting diode installed on a lead frame. Such a display device has the disadvantage that light leaks from the back surface of the light emitting diode and the reflection efficiency of the reflector is low.

そこで、発光ダイオードチップを設置するリードフレー
ムの背面部を被う反射部を持つ反射器を、熱可塑性樹脂
でインサート成形して反射器を形成した後、発光ダイオ
ードとリードフレームとをボンディングするもの、或い
は、前記反射器に発光グイオートの周側面を被う反射器
キャップを取付けたものが提案されている。Therefore, a reflector having a reflective part that covers the back side of the lead frame on which the light emitting diode chip is installed is insert molded with thermoplastic resin to form the reflector, and then the light emitting diode and the lead frame are bonded. Alternatively, it has been proposed that a reflector cap is attached to the reflector to cover the circumferential side of the light emitting guide.

しかしながら、熱可塑性樹脂でインサート成形後のワイ
ヤホンディングは、加熱に制限を受け、ボンディングの
信頼性が低くなるとともに、インサート成形はリードフ
レーム上に樹脂ばりの形成、或いは油、離型剤等の不純
物が付着し、成形後にこれを撤去する後処理を必要とし
、手数を要する。However, wire bonding after insert molding with thermoplastic resin is limited by heating, which reduces the reliability of the bonding.Insert molding also causes the formation of resin burrs on the lead frame, or the presence of oil, mold release agents, etc. Impurities adhere to the mold, requiring post-treatment to remove them after molding, which is time-consuming.

また、反射器キャップを取付けるものは、部品点数の増
加と、取付けの手数を要する。Moreover, the one to which the reflector cap is attached requires an increase in the number of parts and a laborious installation process.

この発明は、反射効果を向上させるとともに、ボンディ
ングの信頼性の低下を防止し、生産性に優れた表示装置
の提供を目的とする。The present invention aims to provide a display device that improves the reflection effect, prevents deterioration in bonding reliability, and has excellent productivity.

この発明は、リードフレームのマウント部に設置した発
光ダイオードチップの周側面部及び背面部に臨む反射面
を一体に形成した少なくとも２つの反射器片を結合して
反射器を構成したことを特徴とする。The present invention is characterized in that the reflector is constructed by combining at least two reflector pieces each having integrally formed reflective surfaces facing the circumferential side surface and the back surface of the light emitting diode chip installed on the mount portion of the lead frame. do.

以下、この発明を図面に示した実施例を参照して詳細に
説明する。Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.

第１図ないし第３図はこの発明の表示装置の実施例を示
し、第１図はその分解斜視図、第２図は組立斜視図、第
３図は表示装置の縦断面図である。1 to 3 show an embodiment of the display device of the present invention, FIG. 1 is an exploded perspective view thereof, FIG. 2 is an assembled perspective view, and FIG. 3 is a longitudinal sectional view of the display device.

第１図において、リードフレーム２には、リート部４Ａ
、４Ｂ、４Ｃ，４Ｄ、４Ｅ及びマウント部６Ａ、６Ｂ、
６Ｃ１６Ｄが形成され、これらは導電率の高い金属板で
一体に成形する。各リート部４１４Ｂ、４Ｃ，４Ｄは、
マウント部６Ａ、６Ｂ、６Ｃ１６Ｄの先端部を直角に折
り曲げて水平に維持させ、その表面部には発光ダイオー
ドチップ８Ａ、８Ｂ、８Ｇ、８Ｄ　（以下ＬＥＤチップ
８Ａ、８Ｂ、８Ｃ，８Ｄという）がボンディングによっ
て設置されている。この実施例では、ＬＥＤチップ８Ａ
とリード部４Ｆ、、ＬＥＤチンプ８Ｂとマウント部６Ａ
、ＬＥＤチップ８ｃとマウント部５Ｄ、ＬＥＤチップ８
Ｄとリード部４Ｅば、ワイヤ１０のボンディングで、電
気的に接続されている。In FIG. 1, the lead frame 2 includes a lead portion 4A.
, 4B, 4C, 4D, 4E and mount parts 6A, 6B,
6C16D are formed, and these are integrally molded from a metal plate with high conductivity. Each REIT part 414B, 4C, 4D is
The tips of the mount parts 6A, 6B, 6C16D are bent at right angles to maintain them horizontally, and the light emitting diode chips 8A, 8B, 8G, 8D (hereinafter referred to as LED chips 8A, 8B, 8C, 8D) are bonded to the surface parts. It is installed by. In this example, LED chip 8A
and lead part 4F, LED chimp 8B and mount part 6A
, LED chip 8c and mount part 5D, LED chip 8
D and the lead portion 4E are electrically connected by bonding the wire 10.

そして、リードフレーム２上に設置されたＬＥＤチップ
８Ａ、８Ｂ、８Ｃ１８Ｄの周側面部及びその背面部を反
射面で被うため反射器１２は、２つの反射器片１２Ａ、
１２Ｂから構成されている。In order to cover the circumferential side surfaces and the back surfaces of the LED chips 8A, 8B, and 8C18D installed on the lead frame 2 with reflective surfaces, the reflector 12 includes two reflector pieces 12A,
It is composed of 12B.

反射器片１２Ａ、１２Ｂは熱可塑性樹脂を成形加工した
ものであり、円柱状体を縦方向に２分した形状を成して
いる。即ち、反射器片１２Ａ、１２Ｂにはその開口縁部
に放物面を成す第１の反射面１４が形成され、反射器片
１２Ａには円錐面からなる第２の反射面１６が形成され
、この反射面１６の縁から同径部１８を経て僅か奥に円
錐面からなる第３の反射面２０が形成され、この反射面
２０を延長する反射器片１２Ａの端面には反射器片１２
Ｂと結合するための突部２４が形成されている。また、
反射器片１２Ｂには前記第２の反射面１６に対応する第
２の反射面２６が形成され、この反射面２６には前記リ
ードフレーム２を保持するための６字形の切欠部２８が
形成され、この切欠部２８の内壁部には前記突部２４に
結合させる凹部３０Ａ、３０Ｂが形成されている。また
、反射器片１２Ａ、１２Ｂには表示装置の背面キャンプ
に結合するために、係合突部３２Ａ、３２Ｂが直径方向
に形成されている。　　　　　　□゛′ このように反射器１２を構成すれば、リードフレーム２
にＬＥＤチップ８Ａ、８Ｂ、８Ｃ，８Ｄを設置し、ワイ
ヤＩＯを接続した後、このリードフレーム２を反射器片
１’２Ａ、１２Ｂで挟み込み、第２図、に示ずように結
合させることができる。この場合、反射器片１２Ａの突
部２４は、反射器片１２−Ｂの凹部３０Ａ、３０Ｂに挿
入され、両反射器片１２．Ａ、１２Ｂは一体に結合され
、Ｉ−Ｅ　Ｄチップ８Ａ、８Ｂ、８Ｃ１８Ｄの周側面部
及びその背面部は第１、第２及び第３の反射面１４．１
６．２０．２６で被われる。The reflector pieces 12A and 12B are molded from thermoplastic resin, and have the shape of a cylindrical body divided into two in the vertical direction. That is, the reflector pieces 12A and 12B are formed with a first reflecting surface 14 that is a paraboloid at the opening edges thereof, and the reflector piece 12A is formed with a second reflecting surface 16 that is a conical surface. A third reflective surface 20 made of a conical surface is formed slightly behind the edge of this reflective surface 16 via the same diameter part 18, and a reflector piece 12A is formed on the end face of the reflector piece 12A extending this reflective surface 20.
A protrusion 24 for coupling with B is formed. Also,
A second reflective surface 26 corresponding to the second reflective surface 16 is formed on the reflector piece 12B, and a 6-shaped notch 28 for holding the lead frame 2 is formed on this reflective surface 26. , recesses 30A and 30B are formed in the inner wall of the notch 28 to be coupled to the protrusion 24. In addition, engagement protrusions 32A, 32B are formed in the reflector pieces 12A, 12B in the diametrical direction for coupling to the rear camp of the display device. □゛' If the reflector 12 is configured in this way, the lead frame 2
After installing the LED chips 8A, 8B, 8C, 8D and connecting the wires IO, the lead frame 2 can be sandwiched between the reflector pieces 1' 2A, 12B and combined as shown in FIG. can. In this case, the protrusion 24 of the reflector piece 12A is inserted into the recesses 30A and 30B of the reflector piece 12-B, and both reflector pieces 12. A, 12B are integrally coupled, and the circumferential side surfaces and back surfaces of the I-E D chips 8A, 8B, 8C18D are connected to the first, second and third reflective surfaces 14.1.
Covered on 6.20.26.

そして、第３図に示すように、反射器１２の開口部ニハ
、ＬＥＤチップ８Ａ、８Ｂ、８Ｃ，８Ｄの表面を被うレ
ンズ３４をエポキシ等の透明、半透明又は着色合成樹脂
で形成する。この場合、レンズ３４の成形時、その合成
樹脂が反射器片１２Ａ、１２Ｂの接合面に浸透し、その
同化により一体に結合される。Then, as shown in FIG. 3, a lens 34 covering the opening of the reflector 12 and the surfaces of the LED chips 8A, 8B, 8C, and 8D is formed of transparent, translucent, or colored synthetic resin such as epoxy. In this case, when the lens 34 is molded, the synthetic resin permeates the joint surfaces of the reflector pieces 12A and 12B, and the reflector pieces 12A and 12B are joined together by assimilation.

このような構成によれば、第４図に示すように、ＬＥＤ
チップ８Ａ、８Ｂ、８Ｃ，８Ｄ等から出た光ａ、ｂＸｃ
、ｄは、直接レンズ３４を経て外部に出るとともに、反
射器１２の第１、第２及び第３の反射面１４．１６．２
０．２６で反射して外部に出る。このため、反射効率が
向上する。According to such a configuration, as shown in FIG.
Light a, bXc emitted from chips 8A, 8B, 8C, 8D, etc.
, d exit directly to the outside through the lens 34 and to the first, second and third reflective surfaces 14.16.2 of the reflector 12.
It is reflected at 0.26 and goes outside. Therefore, reflection efficiency is improved.

また、反射器１２を所望の形に別に形成し、リードフレ
ーム２へのＬＥＤチップ８Ａないし８Ｄの搭載及びワイ
ヤボンディングを行った後、反射器片１２Ａ、１２Ｂを
結合できるため、ボンディングに反射器１２の材質等を
考慮して行う必要がなく、温度を高くできるとともに、
インザート成形後の不純物の撤去等の後処理が不要とな
り、ホンディングの信頼性を高めることができる。Further, the reflector pieces 12A and 12B can be combined after the reflector 12 is separately formed in a desired shape and the LED chips 8A to 8D are mounted on the lead frame 2 and wire bonded. There is no need to consider the material etc., and the temperature can be raised,
Post-processing such as removing impurities after insert molding is no longer necessary, and the reliability of honding can be improved.

さらに、反射器１２は反射器片１２Ａ、１２Ｂの結合か
らなり、ＬＥＤチップ８Ａないし８Ｄの背面を被う反射
面を形成できるため、反射効率を向上させることができ
、また、この反射器片１２Ａ、１２Ｂの形成は、熱可塑
性樹脂のみで成形加工することができるため、インサー
ト成形に比較して容易であるとともに、安価になる。こ
のため、明るいランプ、ディスプレイ等の表示装置を安
価に製造することができる。Furthermore, the reflector 12 is made up of a combination of reflector pieces 12A and 12B, and can form a reflective surface that covers the back surfaces of the LED chips 8A to 8D, so that the reflection efficiency can be improved. , 12B can be formed using only thermoplastic resin, which is easier and cheaper than insert molding. Therefore, display devices such as bright lamps and displays can be manufactured at low cost.

なお、実施例では、反射器を２分割した形の反射器片を
例に取って説明したが、３以上に分割したもの、或いは
、一方の反射器を広角度の範囲とし、他方の反射器片を
狭角度の範囲として両者を結合してもこの発明を同様に
適用できる。In addition, in the embodiment, explanation was given using a reflector piece in which the reflector is divided into two parts, but one in which the reflector is divided into three or more parts, or one reflector having a wide angle range and the other reflector being divided into two parts is used as an example. The present invention can be similarly applied even if the two pieces are combined with each other in a narrow angle range.

以上説明したようにこの発明によれば、ボンディングの
信頼性を高め、反射効率を向上させることができ、生産
性を高めることにより、表示装置を安価に提供すること
ができる。As explained above, according to the present invention, the reliability of bonding can be improved, the reflection efficiency can be improved, and the display device can be provided at low cost by increasing productivity.

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの発明の表示装置の実施例を示す分解斜視図
、第２図はその組立斜視図、第３図はその縦断面図、第
４図は光の反射状況を示す説明図である。 ２・・・リードフレーム、６Ａ、６Ｂ、６Ｃ１６Ｄ・・
・マウント部、８Ａ、８Ｂ、８Ｃ，８Ｄ・・・発光ダイ
オードチップ、１２・・・反射器、１２Ａ、１２Ｂ・・
・反射器片。 第２図 第３図 第４図Fig. 1 is an exploded perspective view showing an embodiment of the display device of the present invention, Fig. 2 is an assembled perspective view thereof, Fig. 3 is a vertical sectional view thereof, and Fig. 4 is an explanatory diagram showing the state of light reflection. . 2...Lead frame, 6A, 6B, 6C16D...
・Mount part, 8A, 8B, 8C, 8D... Light emitting diode chip, 12... Reflector, 12A, 12B...
・Reflector piece. Figure 2 Figure 3 Figure 4

Claims (1)

【特許請求の範囲】[Claims] リードフレームのマウント部に設置した発光ダイオード
チップの周側面部及び背面部に臨む反射面を一体に形成
した少なくとも２つの反射器片を結合して反射器を構成
したことを特徴とする表示装置。A display device characterized in that a reflector is constructed by combining at least two reflector pieces each having integrally formed reflective surfaces facing the circumferential side surface and rear surface of a light emitting diode chip installed on a mount portion of a lead frame.
JP58066168A 1983-04-13 1983-04-13 Display device Granted JPS59189686A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58066168A JPS59189686A (en) 1983-04-13 1983-04-13 Display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58066168A JPS59189686A (en) 1983-04-13 1983-04-13 Display device

Publications (2)

Publication Number Publication Date
JPS59189686A true JPS59189686A (en) 1984-10-27
JPH0316794B2 JPH0316794B2 (en) 1991-03-06

Family

ID=13308048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58066168A Granted JPS59189686A (en) 1983-04-13 1983-04-13 Display device

Country Status (1)

Country Link
JP (1) JPS59189686A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6168440A (en) * 1984-09-12 1986-04-08 Mitsui Toatsu Chem Inc Production of methylglyoxal
JPH02114954U (en) * 1989-03-01 1990-09-14
FR2658344A1 (en) * 1990-02-09 1991-08-16 Neiman Sa REMOTE CONTROL SYSTEM, PARTICULARLY FOR LOCKING / UNLOCKING DOORS FOR MOTOR VEHICLES.
JPH0690029A (en) * 1992-09-08 1994-03-29 Stanley Electric Co Ltd Semiconductor element
WO2001013437A1 (en) * 1999-08-12 2001-02-22 Rohm Co., Ltd. Chip semiconductor light-emitting device
CN103594603A (en) * 2013-10-30 2014-02-19 王定锋 Novel SMD-LED support, paster type LED, manufacturing method of paster type LED and manufacturing method of SMD-LED support
CN103904191A (en) * 2012-12-26 2014-07-02 中微光电子(潍坊)有限公司 LED packaging substrate and LED packaging structure

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6168440A (en) * 1984-09-12 1986-04-08 Mitsui Toatsu Chem Inc Production of methylglyoxal
JPH02114954U (en) * 1989-03-01 1990-09-14
FR2658344A1 (en) * 1990-02-09 1991-08-16 Neiman Sa REMOTE CONTROL SYSTEM, PARTICULARLY FOR LOCKING / UNLOCKING DOORS FOR MOTOR VEHICLES.
US5266946A (en) * 1990-02-09 1993-11-30 Valeo Neiman Remote control system, in particular for locking and unlocking the doors of motor vehicles with two axially offset light emitters
JPH0690029A (en) * 1992-09-08 1994-03-29 Stanley Electric Co Ltd Semiconductor element
WO2001013437A1 (en) * 1999-08-12 2001-02-22 Rohm Co., Ltd. Chip semiconductor light-emitting device
CN103904191A (en) * 2012-12-26 2014-07-02 中微光电子(潍坊)有限公司 LED packaging substrate and LED packaging structure
CN103594603A (en) * 2013-10-30 2014-02-19 王定锋 Novel SMD-LED support, paster type LED, manufacturing method of paster type LED and manufacturing method of SMD-LED support

Also Published As

Publication number Publication date
JPH0316794B2 (en) 1991-03-06

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