JPS59198680A - Method of producing filmlike electrode connector - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a fillem-shaped electrode,
The purpose is to provide a method for accurately and inexpensively manufacturing a film-like electrode connector in which a fine conductive circuit pattern is provided on a flexible insulating substrate film surface.

Conventionally, methods for manufacturing this kind of film-like electrode connector include, for example: (1) laminating a large number of thin plates of conductive rubber and thin plates of insulating rubber while adhering them alternately in a direction that intersects the surface of the thin plates; (2) A method of obtaining thin plate-like electrode connectors by cutting thin conductor wires into flexible polymeric insulating materials. (3) A method of mixing conductor particles such as metal powder with an insulating elastic material such as silicone rubber and molding the mixture into a sheet to obtain a flexible film-like electrode connector; (4)
An electrode circuit pattern was printed on the insulating substrate film by screen printing using a conductive paste, and a heat-melting adhesive layer was printed on the other parts of the circuit pattern in the same register by screen printing. There are methods for obtaining film-like electrode connectors.

However, in the methods (1) and (2) above, fine patterns can be formed with high precision, but the manufacturing process is complicated and costly, and in the method (3), there are problems such as irregularities in the conductor particles. If there are variations in conductivity or low reliability, or if method (4) is used, screen printing
Each of the above-mentioned methods has drawbacks, such as the fact that it is difficult to accurately obtain fine, precise patterns because the film is formed by registering the colored inks.

The present inventor conducted various research and improvements in view of the above-mentioned drawbacks of the prior art. First, as a first improvement measure, a carbon conductor layer was printed on Polyvarnish RT Refi I Rem using a screen printing method to form a fine pattern layer, and after drying, a hot melt adhesive was applied to the entire surface including the carbon conductor layer. After forming the layer, it is easy to form a fine pattern of carbon conductor on the film substrate, but since the entire surface of the fine pattern of the conductor is covered with an adhesive layer, it is difficult to connect with the mating electrode. When bonding, the insulating film of the adhesive layer is interposed between the electrodes to be bonded and the conductor in the fIkfif[l pattern, which causes a problem of poor conduction.

Therefore, as a second improvement measure, a fine pattern of the carbon conductor was formed on the polyvarnish 7'/refipm by applying the adhesive of holatome/l/) on the entire surface in advance. However, in this case, there were problems with the non-uniformity of the hot melt adhesive layer thickness and the printability of the carbon paste, as well as the dimensional stability of the carbon conductor layer when thermocompression bonding to the mating electrode. Problems such as poor sex arose.

Therefore, as an eighth improvement means, a fine pattern of carbon paste is accurately printed on a polyester film using a screen printing method and dried, so that the surface of the carbon conductor layer formed at this time has a low surface energy. Silicon or a fluorine compound was blended into the carbon paste in advance. Next, hot melt adhesive was applied to the entire surface of the carbon conductor layer formed on the polyvarnish 7-/I/ film, including the fine pattern, and the hot melt adhesive was applied to the surface of the carbon conductor layer. It was discovered that the hot melt adhesive was applied only to areas other than the carbon conductor layer without being repelled, and the present invention was completed based on this knowledge.

That is, the present invention provides a conductive connector circuit pattern layer on a flammable insulating substrate film, the surface of which has a property of repelling a hot melt adhesive solution or melt, and a low surface energy forming agent. A conductive paste is printed on the conductive connector 41 which is kneaded and contains the conductive connector, and then a solution or melt of a hot melt adhesive is printed or applied on the entire surface of the conductive connector and dried. This method of manufacturing a film-like electrode connector is characterized in that a hot-melt adhesive layer is formed only on a portion where a circuit pattern layer is not provided.

Next, the present invention will be explained in detail based on the drawings.

As shown in FIG. 1A, the insulating base film 1 made of flammable material includes, for example, paper, synthetic paper, coated paper, cellophane, polyester film, polypropylene film, polyethylene film, nylon film, acetate film, hinyl chloride film, Single or composite films such as polycarbonate film, polystyrene vinyl, polyvinylidene chloride film, etc., which have flexibility and electrical insulating properties, or sheets can be used as they are or their surfaces can be coated with corona. Products activated by surface treatment such as electrical discharge treatment, flame treatment, chemical treatment, etc., or materials such as polyester resin, epoxy resin, acrylic resin, or V-tan on the back side of the film to prevent curling or stretching. A back coating layer 4 made of a thermoplastic or thermosetting polymer film is formed by printing or coating using a polymer solution such as a resin (see Figure 1 A'), and a conductive layer is used on top of this. For example, screen printing method, gravure printing method, letterpress printing method,
A conductive connector circuit pattern layer 2 having an arbitrary shape is formed by various printing methods such as lithographic printing and flexographic printing. The formed conductive connector circuit pattern layer 2 needs to have at least the property of repelling the solution or melt of the hot-melt adhesive on its surface.
As the conductive paste, it is necessary to use, for example, a conductive carbon paste, silver paste, etc., which is kneaded with a low surface energy forming agent such as silicon or a fluorine compound. Further, the shape of the conductive connector circuit pattern layer 2 formed here may be selected to have an appropriate shape and size corresponding to the shape of the polarization to be connected, but as described in iii. In order to have a sufficient effect of repelling the hot-melt adhesive provided on its surface, it is preferable to use a net wire shape with a scarf width of 1 μ or less, for example. This is because if the line width becomes too large, the surface area for wetting becomes large and the repelling effect is weakened.

Next, the entire surface of the insulating substrate film 1 including the conductive connector circuit pattern layer 2 thus formed is coated with a solution or melt of a hot-melt adhesive by various printing means, coating means, etc., and dried. Since the surface of the conductive connector circuit pattern layer 2 has a low surface energy, the coating liquid is repelled and exposed, so as shown in FIG. A hot melt adhesive layer 3 can be formed.

When the line [1] in this case was confirmed by experiment, it was found that a line with a fine line width of about O61 could be formed with the highest accuracy and a suitable result was obtained.

The above-mentioned hot-melt adhesive used here includes, for example,
Vinyl acetate-ethylene copolymer resin, polyolefin resin,
General hot-melt adhesives such as polyamide resins and synthetic rubbers can be used, but among them, it is preferable to select and use those that form a solidified film with high electrical insulation properties.

To make these hot-melt adhesives into a solution, you can use an appropriate solvent, and to make them into a molten liquid, you can use a general holatome coater equipped with a heatable ink pan. good.

A method of forming a hot-melt adhesive layer only on areas other than where the conductive connector circuit pattern layer is provided.
Therefore, in addition to the above, it is also possible to use a method using, for example, a lipophilic conductive paste and a hydrophilic hot-melt adhesive, and even with this method, a similar structure can be easily obtained. .

When using the film-shaped electrode connector lid obtained as described above, the conductive connector circuit pattern layer 2 is formed on a glass substrate 6, for example, as shown in FIG. 2A. If the transparent electrodes 5 and 5 are stacked facing each other in positions corresponding to each other, and a heat press is applied from above, the upper insulating substrate film 1 and the lower glass substrate 6 will become heat-fusible, as shown in FIG. 2B. Adhesive layer 3
The conductive connector circuit pattern layer 7 layer 2 and the transparent electrode 5 are connected to each other by the melt adhesive action of the conductive connector circuit pattern 7, thereby achieving the effect of a connector.

The present invention has the above configuration, and utilizes a printing means on a combustible insulating substrate film, a conductive paste, and a repelling action of a hot-melt adhesive on the surface of the conductive paste. Since the circuit pattern of the connector is formed by using this method, there is no need for registration at the time of printing, and therefore, it is possible to form extremely fine patterns with high precision, and the process is simple and extremely economical. It has great practical value.

Examples of the present invention will be described below.

Example 1 A conductive paste having the following composition was printed on a 70 μm thick Borien ether film using a screen printing machine with a line width αl fiM, pitch Q, and 5Q with a pitch of 2JII11.
A conductive connector circuit pattern in the form of vertical stripes having the size of the fl angle was printed and dried.

After applying the conductor paste, use polyamide resin 1 as a hot melt adhesive.
50 parts, 10 parts of nitrocellulose resin and 4 parts of petroleum solvent
A solution composition consisting of 0 parts of A film-like electrode connector was obtained in which conductive connector circuit pattern layers and hot-melt adhesive layers were alternately formed with high precision.

Example 2 Using a 25 μm polyester film whose back surface was resin-coated using a transparent ink composition containing melamine resin as the main component, a screen printing machine was used to coat the surface with a conductive paste having a composition of FE. The line width is 0.
A conductive connector circuit pattern in the form of vertical stripes was printed and dried to a size of 125 mm, pitch of 0.25 mm, and 50 normal angles.

After that, a hot melt adhesive (vinyl acetate-ethylene copolymer resin) is heated and coated on the entire surface with a coater, resulting in a conductive connector circuit pattern layer with particularly excellent pitch accuracy and a hot melt adhesive layer on the film. A film-like electrode connector was obtained in which the electrodes were alternately formed.

conductive paste

[Brief explanation of the drawing]

FIGS. 1p, 1, A' and B are enlarged sectional explanatory views relating to the manufacturing process of the present invention, where A' shows the case where a back coating is applied, and B shows the state where a hot melt adhesive layer is applied. Second
Figures K and B are enlarged cross-sectional explanatory views when using the film-like electrode connector obtained by the present invention. In the figure, 1... Insulating substrate layer 2... Conductive connector circuit pattern layer 3... Hot melt adhesive layer 4... Back coat layer 5... Transparent electrode
6.--Glass substrate patent applicant Nissha Printing Co., Ltd. $ba $2 Figure procedure box formal text (method) % formula % 1. Indication of incident 1982 Patent Application No. 72712 2. Name of invention Film form Method of Manufacturing Electrode Connector 36 Person making the amendment July 6, 1980 (Delivery date: July 26 of the same year) 5. Subject of amendment (1) "Detailed Description of the Invention" column of the specification (2) Specification Column 6 of "Brief explanation of drawings" of the document, content of amendment (1) Column of "Detailed description of the invention" of the specification will be amended as follows. ■The text "Figure 1 A" on page 7, line 9 of the specification will be corrected to "Figure 1." ■In the statement box page 8, lines 6 to 7, we will correct the text ``Figure 1 A'J'' to ``Figure 2.'' ■In the 14th line of page 9 of the specification, replace "Figure 1 B" with "
We will correct it to Figure 3. ■We will correct "Figure 2 A" on page 10, line 19 of the specification to "Figure 4." ■In the 3rd line of page 11 of the specification, replace "Figure 2 B" with "
We will correct it to Figure 5. (2) The "Brief explanation of drawings" column of the specification will be amended as follows. [Figures 1, 2, and 3 are enlarged cross-sectional views related to the manufacturing process of the present invention, Figure 2 is an enlarged cross-sectional view when a back coat is applied, and Figure 3 is an enlarged cross-sectional view of the manufacturing process of the present invention. An enlarged cross-sectional view of a state in which the agent layer is applied is shown. FIGS. 4 and 5 are enlarged cross-sectional views when using the film-like electrode connector obtained by the present invention. In the figure, i ---- Insulating substrate film 2 ----
1. Conductive connector circuit pattern layer 3-1 to 4. Back coat layer 5. 1. Transparent electrode 6. 1.Glass substrate (3) Drawing attached. We will correct it as follows. that's all

Claims (6)

[Claims] (1) On a flammable insulating substrate film, a conductive connector circuit pattern layer whose surface has a property of repelling a solution or melt of J agent after being heat-melted, is coated with a low surface energy forming agent. The conductive connector circuit is formed by printing a conductive paste containing cross-wires, and then printing or applying a hot-melt adhesive solution or melt on the entire surface, and drying it. A method for manufacturing a film non-electrode connector, characterized in that four heat-melt adhesive layers are formed only in areas where the pattern layer is not present. (2) A method for manufacturing a film-like electrode connector according to claim 1, characterized in that a plastic film whose surface has been activated is used as the combustible insulating substrate film. (3) Filmem according to claim 1 or 2, characterized in that a conductive carbon paste containing silicon or a fluorine compound is used as the metamorphic paste kneaded and containing a low surface energy forming agent. A method of manufacturing a shaped electrode. (4) As a conductive connector circuit pattern layer, the line width is 1
4. A method of manufacturing a film-like electrode connector according to claim 1, wherein the film-like electrode connector is formed with a pattern of vertical stripes having a thickness of less than 100 cm. (5) A method for producing a film-like electrode connector according to any one of claims 1 to 4, characterized in that the hot-melt adhesive is one that forms a solidified film with high electrical insulation properties. (6) Claim 1, wherein the insulating substrate film is provided with a back coating layer made of a thermoplastic or thermosetting polymer film as a curling and expansion prevention layer on the back surface thereof. 6. A method for manufacturing a film-like electrode connector according to item 5.