JPS59198731A - Container carrier of semiconductor wafer - Google Patents

Abstract

PURPOSE:To prevent wafers from being damaged and reacting by processing chemical solution to be provided with the strength required for supplying, containing and storing themselves by a method wherein core materials made of rigid body is buried in a box unit injection-molded by copolymer resin of tetrafluoroethylene and perfluoroalcoxyethylene. CONSTITUTION:A pair of side walls 2, 2 facing to each other are provided to be connected forming into one body by connecting rods 3 while on the inner surface of the side walls 2, gooves 4 are extendedly provided in the longitudinal direction corresponding to the numbers of semiconductor wafers 1 to be contained and each groove 4 is provided by means of protruding groove walls 9. The side walls 2 are made of copolymer resin of tetrafluoroethylene and perfluoroalcoxyethylene while core materials 5 are buried inside a flat part 10 and the groove walls 9 connected with each other. The core materials 5 may be made of almost all kind of metals such as aluminum, statinless steel, aluminum alloy and titanium etc. Besides the core materials 5 may be provided with multiple perforations at specified intervals to improve the adhesion with resin making itself lightweighted.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a storage jig (carrier) used for transporting, storing, or supplying a plurality of semiconductor wafers to various manufacturing processes in bulk.

[Technical background of the invention and its problems]

2. Description of the Related Art In the manufacturing process of semiconductor devices, hanging storage carriers are used to transport and store a plurality of semiconductor wafers in bulk when supplying semiconductor wafers to various processing steps. Furthermore, storage carriers with a capacity of 1 m % or more are currently used depending on the process of the destination.

For example, the storage carrier not shown in FIG. 1A is a storage carrier used in a so-called single-wafer automatic machine that takes in and out semiconductor wafers one by one.

This storage carrier stores a plurality of semiconductor wafers 1. of.

A pair of side wall parts 2, 2 each having a groove 4 on the inner surface so as to be inserted vertically and stored in parallel are integrated by a connecting rod 3. The side wall portion 2 and the connecting rod 3 are made of aluminum and made of ethylene tetrachloride (CF20F2).
0roalkoxyethylene (CF2C1"CORf)
copolymer resin (trade name: Teflon PFA)
It is formed by coating.

On the other hand, the storage carrier shown in FIG. 1 (1) is integrally molded from the copolymer resin by injection molding, and grooves 4 are similarly formed on the inner surfaces of the side wall portions 2, respectively. This storage carrier is used not only for transportation and storage, but also for immersion treatments such as cleaning and chemical treatment.

Conventionally, storage carriers of different types and structures are used depending on the process, but this means that semiconductor wafers need to be transferred between each other depending on the manufacturing process, and the number of transfers depends on the process. Since it is proportional to the number, it will be a considerable number of times. Such work is disadvantageous in that it prevents the formation of a large amount of dust when forming fine patterns, which are characteristic of semiconductor devices, and is inefficient.

In order to solve the above-mentioned inconvenience, it is conceivable to use either one of the above-mentioned storage carriers in a unified manner, but there are problems in the following five points. In other words, in the case of the storage carrier shown in Fig. 1(b), +1 distortion occurs in the shape of the storage carrier itself due to distortion during molding and various stresses applied during the use process. It is unsuitable for use in automatic machines that take in and out.

On the other hand, in the case of the storage carrier shown in Figure 1(a),
Structurally, there is no problem in terms of strength compared to the one shown in FIG. 1(b). However, the coating resin is 40 to 70% per coat.
Since the limit is about μm, it is not possible to make it very thick.In addition, since the storage carrier has a complicated groove shape, there will be variations in the thickness between each two parts, and there will be pinholes due to the thinness. This may cause the coating resin to peel off when the semiconductor wafer is taken in and out repeatedly, or the aluminum base metal may become exposed (contamination may occur), and the shock absorbing ability of the semiconductor wafer may deteriorate. In addition, the storage carrier itself needs to be cleaned several times during use to remove contamination and dust, but due to pinholes and fraying, chemical solution Effectivel by;
There were problems such as C cleaning becoming impossible.

[Purpose of the invention]

Therefore, the present invention provides a storage carrier that does not damage semiconductor wafers or cause chemical reactions to processing chemicals, has the strength necessary for supplying, housing, and storing semiconductor wafers, and is designed to prevent deformation. The purpose is to

[Summary of the invention]

In order to achieve the above object, the storage carrier according to the present invention consists of a box body with at least one side opened, and an end of a semiconductor wafer can be engaged with each of the inner surfaces of a pair of opposing side walls. In a storage carrier for semiconductor wafers in which a plurality of grooves are provided in correspondence with each other, the box body is made of injection molded copolymer resin of tetra7ethylene (CF2CF2) and perfluoroalkoxyethylene (CF20FCOR, f), It is also characterized in that a core material made of a rigid body is embedded within the box body.

[Embodiments of the invention]

Hereinafter, embodiments illustrating the present invention will be described in detail.

One side of the storage carrier according to the present invention is shown in FIGS. 2 to 4, and another example is shown in FIG. 5. In these embodiments, the same parts as in FIG. 1 are given the same reference numerals and will be described below.

f. The external structure of the storage carrier in this example is the first one.
Since it is the same as Figure (a), Figure (a) will be used as is. That is, a pair of side wall parts 2, 2 are provided facing each other, and the connecting rod 3 is connected and integrated between them.

FIG. 2 is a cross-sectional view showing the structure of the side wall portion 2. FIG.

A number of grooves 4 corresponding to the number of semiconductor wafers 1 accommodated are provided on the inner surface of the side wall portion 2 and extend in the vertical direction. Each groove 4 is provided by protruding groove walls 9, respectively. The side wall portion 2 having the above shape is made of a copolymer resin of tetrafluoroethylene (CF2CF2) doper-fluoroalkoxyethylene (CF20FCORf),
Inside the flat portion 10 and the groove wall 9, mutually connected core members 5 are embedded. As the core material 5, it is possible to use almost any metal such as aluminum, stainless steel, aluminum alloy (duralumin), titanium, etc., and it is also possible to use a non-metallic rigid material such as ceramic. However, it goes without saying that a certain level of strength is required. Further, the core material 5 is provided with a plurality of through holes at predetermined intervals in order to improve adhesion to the resin and to reduce the weight.

Injection molding is performed when forming the side wall portion 2 described above, but in order to maintain the core material 5 at a predetermined level, it is convenient to use the fixing hole 11 of the connecting rod 3. That is, the third
As shown in the figure, the pin 6 may be inserted in advance into a hole 12 made at the end of the core material 5, and removed after the resin has solidified. There is a risk that the inner circumferential portion of the hole 12 of the core material 5 may come out into the insert 11 after being pulled out, but in order to prevent this, as shown in Figure @4, bushings 7 and This problem can be solved by fitting the collar 8 and welding the joint. The effect obtained by doing this is that the entire storage carrier can be immersed in the chemical solution. That is, 1. of the metal part. (Prevents contamination of semiconductor wafers.)

Incidentally, the connecting rod 3 is also made of a core material embedded in the glue draw similar to the above. For identification with the side wall portion 2, screws or the like made of the same resin may be used.

Next, in FIG. 5, unlike the above-mentioned embodiment, the side wall portion 2 and the connecting rod l are not made separately and assembled, but in FIG.
This shows an example in which the core material 5 is embedded inside when integrally molded by injection I11:l molding as in b).

〔Effect of the invention〕

As described above, according to the present invention, the following effects can be obtained.

That is, the box body is made of tetrafluoroethylene (CF20F2) dopar-70roalkoxyethylene (cF2cFCORf
), it can be immersed in a chemical solution together with a semiconductor wafer, and it can be injection molded with a core material embedded inside it to provide sufficient strength, making it possible to It is necessary to make a storage carrier according to the process, such as 7, and it can be used as a toy for all processes. This means that there are fewer transfers of semiconductor wafers, which are frequently carried out during, for example, single-wafer processing of semiconductor wafers, ion implantation, dry etching, and vapor deposition processes for forming electrodes. In comparison with the conventional method, there is no need to transfer Sekiguchi.

As a result, it is possible to improve dustproofness and productivity.

[Brief explanation of drawings]

Figures 1 (a) and (b) are perspective views showing the external appearance of a conventional storage carrier, Figure 2 is a cross-sectional view showing the structure of the four side parts of the storage carrier according to the present invention, and Figure 3 is a core material end. FIG. 4 is a partially enlarged cross-sectional view showing the structure of the end of the side wall, and FIG. 5 is a vertical cross-sectional view showing another embodiment. 1...Semiconductor wafer 2...Side wall portion 3...Connecting rod 4...Groove portion 5...Core material 6... ... Pin 7 ... Bush 8 ... Collar 9 ... Flat part 10 ... Groove wall Applicant's agent Kiyoshi Inomata Figure 2 Figure 3 Figure 4 Figure 5

Claims (1)

[Claims] 1. A box body with at least one side open, and a plurality of grooves on the inner surfaces of a pair of opposing side walls, each of which can be engaged with an end of a semiconductor wafer. In a storage carrier for semiconductor wafers, the box body contains tetra7ethylene chloride (CF2CF2) and a bar 7.
A storage carrier for a semiconductor wafer, which is formed by injection molding of a copolymer resin of 0-roalkoxyethylene (0F2CFCOR[), and has a core material made of a rigid body embedded in the box. 2. The storage carrier for semiconductor wafers as set forth in claim 1, wherein the core material is a metal material. 3. The semiconductor wafer storage carrier according to claim 1, wherein the core material is a non-metallic rigid material. 4. In the storage carrier according to claim 1, 2, or 3, the core material is embedded in the flat part of the side wall part and the wall part of the groove in a mutually connected state. A semiconductor wafer storage carrier characterized by: 5. Claims 1, 2, 3, or 4
3. The semiconductor wafer storage carrier according to item 1, wherein the core material is provided with a plurality of through holes.