JPS59201331A - Contact material for vacuum breaker - Google Patents
Contact material for vacuum breakerInfo
- Publication number
- JPS59201331A JPS59201331A JP7661583A JP7661583A JPS59201331A JP S59201331 A JPS59201331 A JP S59201331A JP 7661583 A JP7661583 A JP 7661583A JP 7661583 A JP7661583 A JP 7661583A JP S59201331 A JPS59201331 A JP S59201331A
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Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
この発明は、大電流しゃ断性能に優れ、かつ耐電圧性能
の良好な真空しゃ断器用接点材料に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a contact material for a vacuum breaker that has excellent large current breaking performance and good withstand voltage performance.
真空しゃ断器は、その無保守、無公害性、優れたしゃ断
性能等の利点を持つため、適用範囲が急速に拡大して来
ている。また、それに伴い、より大きなしゃ断容量や高
い耐電圧が要求されている。Vacuum circuit breakers have advantages such as maintenance-free, non-polluting properties, and excellent breaker performance, so the range of applications of vacuum circuit breakers is rapidly expanding. Additionally, along with this, larger breaking capacity and higher withstand voltage are required.
一方、真空しゃ断器の性能は真空容器内の接点材料によ
って決定される要素がきわめて大である〇真空しゃ断器
用接点材料の満足すべき特性として、(1)シゃ断容量
が大きいこと、(2)耐電圧が高いこと、(3)接触抵
抗が小さいこと、(4)溶着力が小さいこと、(5)接
点消耗量が小さいこと、(6)さい断電流値が小さいこ
と、(7)加工性が良いこと、(8)十分な機械的強度
を有するとと、等がある。On the other hand, the performance of a vacuum breaker is determined to a large extent by the contact material inside the vacuum vessel.The characteristics that should be satisfied with the contact material for a vacuum breaker are (1) large breaking capacity; ) High withstand voltage, (3) Low contact resistance, (4) Low welding force, (5) Low contact wear, (6) Low cutting current value, (7) Processing (8) have sufficient mechanical strength; and (8) have sufficient mechanical strength.
実際の接点材料では、これらの特性を全て満足させるこ
とは、かなり困難であって、一般には用途に応じて特に
重要な特性を満足させ、他の特性をある種度犠牲にした
材料を使用しているのが実状である。In actual contact materials, it is quite difficult to satisfy all of these properties, and in general, materials that satisfy particularly important properties depending on the application and sacrifice other properties to some degree are used. The reality is that
従来、この種の接点材料として銅−ビスマス(以下0u
−Biと表示する。他の元素および元素の組み合せから
なる材料についても同様に元素記号で表示する)、0u
−Or−Bi、 0u−Co−Bi、 0u−Or等が
使用されていた。しかし、(!u−Bi等の低融点金属
を含有する接点では排気工程中の高温加熱により、その
一部が接点内から拡散、蒸発し、真空容器内の金属シー
ルドや絶縁容器に付着する。これが真空しゃ断器の耐電
圧を劣化させる大きな因子の一つになっている。また、
負荷開閉や大電流しゃ断時にも低融点金属の蒸発、飛散
が生じて耐電圧の劣化、しゃ断性能の低下が見られる。Conventionally, copper-bismuth (hereinafter referred to as 0u
-Display as Bi. Materials consisting of other elements and combinations of elements are similarly indicated with element symbols), 0u
-Or-Bi, 0u-Co-Bi, 0u-Or, etc. were used. However, in a contact containing a low melting point metal such as (!u-Bi), a portion of the metal diffuses and evaporates from within the contact due to high temperature heating during the evacuation process, and adheres to the metal shield or insulating container in the vacuum container. This is one of the major factors that deteriorate the withstand voltage of the vacuum breaker.
Evaporation and scattering of low-melting point metals occur during load switching and large current interruption, resulting in deterioration of withstand voltage and deterioration of interruption performance.
上記の欠点を除くために真空耐電圧に優れたOr、 O
oなどを添加した0u−Or−Biなどにおいても低融
点金属によると記の欠点は根本的に解決されず、高電圧
、大電流には対応できない。一方、0u−Orなどのよ
うに真空耐電圧に優れた金属(Or、 Coなど)と電
気伝導電に優れたOuとの組み合せからなる材料は耐溶
着性能に関しては低融点金属を含有する接点材料に比較
して、やや劣るが、しゃ断性能や耐電圧性能が優れてい
るため、高電圧、大軍、流域ではよく使用されている。To eliminate the above drawbacks, we use Or, O, which has excellent vacuum withstand voltage.
Even in the case of Ou-Or-Bi added with O, etc., the above drawbacks cannot be fundamentally solved by using a low melting point metal, and it cannot cope with high voltage and large current. On the other hand, materials such as 0u-Or, which are made of a combination of metals (Or, Co, etc.) with excellent vacuum withstand voltage and O, which has excellent electrical conductivity, are inferior to contact materials containing low melting point metals in terms of welding resistance. Although it is slightly inferior to , it has excellent breaking performance and withstand voltage performance, so it is often used in high voltage, large forces, and river areas.
さらに、0u−C!rなどにおいても、しゃ断性能には
限界があるために接点の形状を工夫し、接点部の電流経
路を操作することで、磁場を発生させ、この力で大電流
アークを強制駆動して、しゃ断性能を上げる努力かがさ
れていた。Furthermore, 0u-C! Since there is a limit to the breaking performance of the r, etc., by devising the shape of the contact and manipulating the current path of the contact, a magnetic field is generated, and this force forcibly drives a large current arc, which can be used to break the current. Efforts were made to improve performance.
しかし、大電流化、高電圧化への要求はさらにきびしく
、従来の接点材料では要求性能を十分満足させることが
困難となっている。父、真空しゃ断器の小型化に対して
も同様に従来の接点性能では十分でなく、より優れた性
能を持つ接点材料が求められていた。However, the demands for larger currents and higher voltages have become even more demanding, making it difficult to fully satisfy the required performance with conventional contact materials. Similarly, in order to miniaturize vacuum breakers, the performance of conventional contacts was insufficient, and there was a need for contact materials with even better performance.
この発明は上記のような従来のものの欠点を除去するた
めになされたもので、大電流しゃ断性能に優れ、かつ耐
電圧性能の良好な真空しゃ断器用接点材料を提供するこ
とを目的としている。This invention was made to eliminate the above-mentioned drawbacks of the conventional products, and an object of the present invention is to provide a contact material for a vacuum breaker that has excellent large current interrupting performance and good withstand voltage performance.
発明者等はOuに種々の金属、合金、金属間化合物を添
加した接点材料を試作し、真空スイッチ管に組み込んで
種々の実験を行なった。これまでに、先行技術(特願昭
51−192785号明細書)として、Ou、 Or、
Taから構成されている材料のしゃ断性能が従来品(
Ou−25重量%Or合金)に比較して非常如優れてい
ることを見出しているが、従来品のしゃ断容量に対して
1.5倍のしゃ断容量を得るためにはTaを5〜25重
量%の範囲添加させなければならなかった。The inventors prototyped a contact material by adding various metals, alloys, and intermetallic compounds to Ou, incorporated it into a vacuum switch tube, and conducted various experiments. So far, Ou, Or,
The breaking performance of the material composed of Ta is higher than that of conventional products (
We have found that it is extremely superior to Ou-25wt%Or alloy), but in order to obtain a breaking capacity 1.5 times that of the conventional product, it is necessary to add 5 to 25% Ta by weight. % had to be added.
そこで、この一般に高価な材料であるTaの添加量をで
きるだけ少なくして、有効にしゃ断性能を向上させるた
めに種々の実験を行なった。この結果、Cu、 (!r
、 Taを主成分として、T1を少量添加した場合にT
a量を少なくしても非常にしゃ断性能が優れ、耐電圧性
能が良好であることがわかった〇さらに、少量のT1添
加によってTa量のある範囲でT1を添加しない場合に
比べて著しく、しゃ断性能が向上することも見出した。Therefore, various experiments were conducted in order to effectively improve the blocking performance by reducing the amount of Ta, which is generally an expensive material, added as much as possible. As a result, Cu, (!r
, when Ta is the main component and a small amount of T1 is added, T
It was found that even if the amount of Ta was reduced, the blocking performance was very good and the withstand voltage performance was good.Furthermore, by adding a small amount of T1, the blocking performance was significantly improved within a certain range of Ta amount compared to when no T1 was added. It was also found that performance improved.
この発明の真空しゃ断器用接点材料は、Ou金含有ると
共に、他の成分としてOrが10〜35重量%、及びT
aが20重量%以下、T1が5重量%以下の範囲含有す
ることを特徴としている。The contact material for a vacuum breaker of the present invention contains O gold and 10 to 35% by weight of Or as other components, and T.
It is characterized by containing a in a range of 20% by weight or less and T1 in a range of 5% by weight or less.
以下、この発明の一実施例を図について説明するO
第1図は真空スイッチ管の構造図で、真空絶縁容器(1
)とこの真空絶縁容器(1)の両端を閉塞する端板(2
)および(3)とにより形成された容器内部に電極(4
)および(5)が、それぞれ電極棒(6)および(7)
の一端に、お互いが対向するよう配置されている。前記
117)は、ベローズ(8)を介して前記端板(3)に
気密を損うことなく軸方向の動作が可能なよう姉接合さ
れている。シールド(9)および00がアークにより発
生する蒸気で汚染されることがないよう、それぞれ前記
真空絶縁容器(1)の内面および前記ベローズ(8)を
覆っている。電極(5)は第2図のように、その背面で
電極棒(7)にろう材(51)を介挿してろう付されて
いる。前記電極(4)、 (5)はこの発明のCu −
0r−Ta−Ti系接点材料から成っている。Hereinafter, one embodiment of the present invention will be explained with reference to the drawings. Figure 1 is a structural diagram of a vacuum switch tube.
) and an end plate (2) that closes both ends of this vacuum insulated container (1).
) and (3).
) and (5) are electrode rods (6) and (7), respectively.
are placed facing each other at one end. 117) is integrally joined to the end plate (3) via a bellows (8) so as to be able to move in the axial direction without compromising airtightness. The shields (9) and 00 respectively cover the inner surface of the vacuum insulating container (1) and the bellows (8) so that they are not contaminated by vapor generated by the arc. As shown in FIG. 2, the electrode (5) is brazed to the electrode rod (7) with a brazing material (51) interposed on its back surface. The electrodes (4) and (5) are Cu-
It is made of 0r-Ta-Ti type contact material.
第3図は合金中のCr量を25重量%に固定し、さらに
’ra量をO,l、 5,10,45,20.25重
量96に固定した合金に添加したT1量としゃ断容量の
関係を示したものである。図の縦軸は従来品(Cu−2
50r品)のしゃ断容量を1とした場合の比率を示し、
横軸はT1の添加量を示す。図中(A)は従来品(Ou
−250r品)のしゃ断容量である。図かられかるよう
に各Ta量に対して、 Tiの添加量は0.5重量%の
とき、しゃ断容量のピークがあり、Tiの添加によって
しゃ断性能の向上が見られるが、Ta tが20重量%
以上になるとT1の効果がなくなり、むしろ、しゃ断性
能の低下が生じる。また、T1添加の効果はTa量が少
ないほど有効であV) 、Ta量が1重量%に対してT
1を0.5重量%加えた場合は従来品(0u−25重量
%Cr品)の15倍のしゃ断容量を示す。また、Ta量
が10重量%の場合にはTa量0.5重量%添加するこ
とにより、従来品の1.9倍以上のしゃ断容量が得られ
る。即ち、Ta量の比較的少ない場合にはTiが他の元
素と適度に反応して形成される合金や化合物が均一微細
に分散して、しゃ断性能を著しく上昇させ、しかもCu
惜が十分にあるので電気伝導度や熱伝導度を低下させる
こともないので、アークによる熱入力をすみやかに放散
することができる。しかしTa量が多くなると、必然的
にCu量が低下するので、そのOu、!:Tiが反応し
て形成される化合物そのものはしゃ断性能を上昇させる
要素を持っていても電気伝導度や熱伝導度を低下させる
悪影響のほうが大きくなり、Tiと他の元素の反応で生
じるしゃ断性能向上要素を打ち消してトータルとしての
しゃ断性能が向上しないためであると思われる。又同じ
Ta量ではT1が効果を示す適度な量を越えて多量にな
るとやはり電気伝導度や熱伝導度が著しく低下するので
好壕しくない。また、各Ta量に対して、しゃ断性能か
ら見るとT1は0.5重量%添加するのが最も好ましい
。なお、この実験に使用した0u−Or −Ta−Ti
合金はOu、 Or、 Ta、 Ta粉を各々必要量配
合した混合粉を成形、焼結して得られたものである。Figure 3 shows the relationship between the amount of T1 added to the alloy and the amount of T1 added to the alloy with the amount of Cr in the alloy fixed at 25% by weight and the amount of 'ra fixed at O, l, 5, 10, 45, 20.25 weight 96. This shows the relationship. The vertical axis of the figure is the conventional product (Cu-2
50r product) is shown as the ratio when the breaking capacity is 1,
The horizontal axis indicates the amount of T1 added. In the figure (A) is the conventional product (Ou
-250r product). As can be seen from the figure, for each Ta amount, the breaking capacity peaks when the added amount of Ti is 0.5% by weight, and the breaking performance is improved by adding Ti, but when Ta t is 20%, the breaking capacity peaks. weight%
If the temperature exceeds that level, the effect of T1 disappears, and rather the breaking performance deteriorates. In addition, the effect of T1 addition is more effective as the amount of Ta is smaller (V), and when the amount of Ta is 1% by weight, T
When 0.5% by weight of 1 is added, the breaking capacity is 15 times that of the conventional product (0u-25% by weight Cr product). Further, when the Ta amount is 10% by weight, by adding 0.5% by weight of Ta, a breaking capacity 1.9 times or more than that of the conventional product can be obtained. In other words, when the amount of Ta is relatively small, alloys and compounds formed by moderate reaction of Ti with other elements are uniformly and finely dispersed, significantly improving the breaking performance, and furthermore, Cu
Since there is sufficient heat resistance, there is no reduction in electrical conductivity or thermal conductivity, so that the heat input by the arc can be quickly dissipated. However, as the amount of Ta increases, the amount of Cu inevitably decreases, so the Ou,! :Although the compound formed by the reaction of Ti itself has elements that improve the breaking performance, it has a greater negative effect of reducing electrical conductivity and thermal conductivity, and the breaking performance caused by the reaction between Ti and other elements has a greater negative effect. This seems to be because the improvement factors are canceled out and the total breaking performance is not improved. Furthermore, if the amount of Ta is the same, if the amount of T1 exceeds an appropriate amount that is effective, the electrical conductivity and thermal conductivity will decrease significantly, which is not desirable. Furthermore, for each amount of Ta, it is most preferable to add 0.5% by weight of T1 in terms of blocking performance. In addition, 0u-Or -Ta-Ti used in this experiment
The alloy is obtained by molding and sintering a mixed powder containing Ou, Or, Ta, and Ta powders in required amounts.
第4図は、合金中のCr量を25重量%に固定し、さら
に、Ti量を0.0.5.1.0.1.5.3.5重量
%に固定した場合の添加したTa量としゃ断容量との関
係を示したものであり、図の縦軸は従来品(Ou−25
0r品)のしゃ断容量を1とした場合の比率を示し、横
軸はTaの添加量を示す。第4図かられかるように、T
i量が0.5重量%のときT1添加によるしゃ断容量増
大の効果が見られるのはTa量が20重量%以下である
。一方、T1添加量はTa量が非常に少ない場合C1重
量%程度)には5重量%以下の範囲で効果はあるが、3
重量%を越えると接触抵抗が増大する傾向にあり、使用
条件によっては3重量%以下が望ましい。また、Ti量
が1.0重量%のとき、効果が見られるのはTa量が5
重置%以下の範囲であり、Ti量が1.5重量%のとき
は、効果が見られるのはTa量が3重量%以下の範囲で
ある。一方T1量が2重量%を越えるとTa量が1重量
%程度のときのみ、しゃ断性能的に効果がある。これら
如対し、Ti量が0.5重量%以下の範囲ではTa量の
最も広い範囲、即ち20重量96以下の範囲に対し、し
ゃ断性能向上の効果がある。Figure 4 shows the amount of added Ta when the amount of Cr in the alloy is fixed at 25% by weight and the amount of Ti is fixed at 0.0.5.1.0.1.5.3.5% by weight. The graph shows the relationship between the amount and the breaking capacity, and the vertical axis of the figure is for the conventional product (Ou-25
The ratio is shown when the breaking capacity of 0r product) is set to 1, and the horizontal axis shows the amount of Ta added. As shown in Figure 4, T
When the amount of i is 0.5% by weight, the effect of increasing the breaking capacity due to the addition of T1 is observed when the amount of Ta is 20% by weight or less. On the other hand, when the amount of T1 added is very small (approximately 5% by weight of C1), it is effective in the range of 5% by weight or less;
If it exceeds 3% by weight, contact resistance tends to increase, and depending on the usage conditions, 3% by weight or less is desirable. Furthermore, when the Ti amount is 1.0% by weight, the effect is seen when the Ta amount is 5%.
When the amount of Ti is 1.5% by weight, the effect is observed when the amount of Ta is 3% by weight or less. On the other hand, when the amount of T1 exceeds 2% by weight, there is an effect in terms of breaking performance only when the amount of Ta is about 1% by weight. On the other hand, when the Ti content is 0.5% by weight or less, there is an effect of improving the breaking performance over the widest range of the Ta content, that is, the range of 20% by weight or less.
以上の結果からG!u−cr−Taの3元合金?(対し
て、T1を添加することによって3元合金のしゃ断性能
をより向上させるためにはT1は0.8重量%以下、T
a量は3.5〜18重量%の範囲が望ましい。さらに、
Taの添加量をできるだけ低減して、優れたしゃ断性能
を得る条件としては’ra量が15重量%以下の範囲が
望ましい。From the above results, G! A ternary alloy of u-cr-Ta? (On the other hand, in order to further improve the breaking performance of the ternary alloy by adding T1, T1 should be 0.8% by weight or less, T
The amount of a is preferably in the range of 3.5 to 18% by weight. moreover,
In order to obtain excellent breaking performance by reducing the amount of Ta added as much as possible, it is desirable that the 'ra amount be in a range of 15% by weight or less.
発明者らは第3図、第4図に示すような実験をCr量を
種々変化させて行なったが、Cr量が10〜35重量%
の範囲でT1添加によるしゃ断性能の向上が見られたが
、Cr量が10重量%より少ない範囲ではT1を添加し
ても変化はなく、逆にCr量が35重量%を越えるとし
ゃ断性能の低下も生じる。The inventors conducted experiments as shown in FIGS. 3 and 4 while varying the amount of Cr.
An improvement in the breaking performance was observed by adding T1 in the range of 10% by weight, but there was no change even if T1 was added in the range where the amount of Cr was less than 10% by weight, and conversely, when the amount of Cr exceeded 35% by weight, the breaking performance improved. A decrease also occurs.
一方、0u−Or −Ta−Ti系合金でOrを10〜
35重量%、Taを20重骨形以下、T1を5重量96
以下の範囲含有する接点材料は従来品(Ca−25ar
品)と比較して、接触抵抗も劣ることはなく、耐電圧性
能も同等に良好であることを図示しないが種々の実験で
確認している。On the other hand, in Ou-Or -Ta-Ti alloy, Or is 10~
35% by weight, Ta less than 20 heavy bones, T1 5% by weight 96
Contact materials containing the following range are conventional products (Ca-25ar
Although not shown in the figure, it has been confirmed through various experiments that the contact resistance is not inferior and the withstand voltage performance is equally good as compared to the product (product).
また、図示しないが、上記合金にBi、 Te、 Sb
。Although not shown, Bi, Te, and Sb are added to the above alloy.
.
TI!、 Pb、 Se、 Oθ及びOaのうちの少な
くとも1つの低融点金属、その合金、その金属間化合物
、並びにその酸化物のうち少なくとも1種を20重量%
以下添加した低さい断真空しゃ断器用接点においても、
前記実施例と同様にしゃ断性を上昇させる効果があるこ
とを確認している。TI! , Pb, Se, Oθ and Oa, an alloy thereof, an intermetallic compound thereof, and an oxide thereof at 20% by weight.
Even in the contacts for low-segment vacuum breaker with the following additives,
It has been confirmed that it has the effect of increasing the blocking property as in the above embodiment.
なお、低融点金属、その合金、その金属間化合物、並び
にその酸化物のうち少なくとも1種を20重量%以上添
加した場合には著しく、しゃ断性能が低下した。又、低
融点金属がCθあるいはOaの場合は若干特性が劣る。Note that when 20% by weight or more of at least one of a low melting point metal, its alloy, its intermetallic compound, and its oxide was added, the breaking performance was significantly reduced. Further, when the low melting point metal is Cθ or Oa, the properties are slightly inferior.
なお、上記実施例では、この発明をCu−0r−Ta−
Ti合金により説明したが、上記合金の各元素が単体、
囲者、三者もしくは王者の合金、囲者、王者もしくは王
者の金属間化合物又はそれらの複合体として分布してい
る場合にも所期の目的を達する。In addition, in the above-mentioned example, this invention was applied to Cu-0r-Ta-
Although the explanation has been made using a Ti alloy, each element of the above alloy is a simple substance,
The purpose of the period is also reached when the per capulars, three or king's alloys, enclosures, king or king interconnections or those complexes are distributed as a complex.
以上のように、この発明によれば、銅を含有すると共に
他の成分としてクロムが10〜35重量%、タンタルが
20重量%以下で、かつチタンが5重量%以下の範囲含
有することを特徴とするものであるので、Ta量を少な
くしても、しゃ断性能に優れ、かつ良好な耐電圧性能を
有する真空しゃ断器用接点材料が得られる効果がある。As described above, the present invention is characterized in that it contains copper and other components such as chromium in a range of 10 to 35% by weight, tantalum in a range of 20% by weight or less, and titanium in a range of 5% by weight or less. Therefore, even if the amount of Ta is reduced, it is possible to obtain a contact material for a vacuum breaker that has excellent breaking performance and good withstand voltage performance.
さらに、タンタルを3.5〜18重量%、チタンを0.
8重量%以下の範囲に限定すると、チタンを添加しない
場合よりしゃ断性能が向上する。Furthermore, 3.5 to 18% by weight of tantalum and 0.0% by weight of titanium.
When the content is limited to 8% by weight or less, the breaking performance is improved compared to the case where titanium is not added.
第1図は一般的な真空スイッチ管の構造を示す断面図、
第2図はその第1図のti部分の拡大断面図、第3図は
この発明の実施例の接点材料におけるOr量を25重槍
形に固定し、Ta量を0.1.5゜10、15.20.
25重槍形に固定した合金に対してT1添加量を変化さ
せた時のしゃ断容量の変化を示す特性図、第4図はこの
発明の実施例の接点材料におけるcrtを25重量%に
固定し、Ti量を0.0.5゜1.0.1.5.3.5
重敗%に固定した合金に対してTa量を変化させた時の
しゃ断容量の変化を示す特性図である。
図において(1)は真空絶縁容器、(21,(3)は端
板、(4)、 f5)は電極、f6> 、 (7)は電
極棒、(8)はベローズ、(9) 、 01はシールド
、(51)はろう材、(A)は従来品(Ou−250r
品)のしゃ断容量である。
代理人 大岩増雄
第1図
第2図
第3図
0 0.5 1.0 1.5
Ti 誉トカロ1E(絞量=/−)
第4図
0 10 20 30 40Ta t (
東11°ム)Figure 1 is a cross-sectional view showing the structure of a typical vacuum switch tube.
Fig. 2 is an enlarged cross-sectional view of the ti portion in Fig. 1, and Fig. 3 shows that the amount of Or in the contact material of the embodiment of this invention is fixed in a 25-layer lance shape, and the amount of Ta is 0.1.5゜10. , 15.20.
Figure 4 is a characteristic diagram showing the change in breaking capacity when the amount of T1 added is changed for an alloy fixed in a 25-layer lance shape. , Ti amount 0.0.5゜1.0.1.5.3.5
It is a characteristic diagram showing the change in the breaking capacity when the amount of Ta is changed for an alloy whose heavy failure percentage is fixed. In the figure, (1) is a vacuum insulated container, (21, (3) is an end plate, (4), f5) is an electrode, f6>, (7) is an electrode rod, (8) is a bellows, (9), 01 is the shield, (51) is the brazing material, (A) is the conventional product (Ou-250r
This is the breaking capacity of the product. Agent Masuo Oiwa Figure 1 Figure 2 Figure 3 0 0.5 1.0 1.5 Ti Homare Tokaro 1E (aperture =/-) Figure 4 0 10 20 30 40 Ta t (
11° East)
Claims (1)
が10〜35重量%、タンタルが20重量%以下で、か
つチタンが5重量%以下の範囲含有することを特徴とす
る真空しゃ断器用接点材料。 (2) チタンが3重量%以下の範囲含有することを
特徴とする特許請求の範囲第1項記載の真空しゃ断器用
接点材料。 (3)チタンが0.8重量%以下の範囲含有することを
特徴とする特許請求の範囲第1項記載の真空しゃ断器用
接点材料。 (4) タンタルが3.5〜18重量%、チタンが0
.8重量%以下の範囲含有することを特徴とする特許請
求の植囲第1項記載の真空しゃ断器用接点材料。 (5) タンタルが3.5〜15重量%、チタンが0
.8重量%以下の範囲含有することを特徴とする特許請
求の節回@1項記載の真空しゃ断器用接点材料。 (6) ビスマス、テルル、アンチモン、タリウム。 鉛、セレン、セリウム及びカルシウムのウチの少なくと
も1つの低融点金属、その合金その金属間化合物、並び
にその酸化物のうちの少なくとも1種を20重量96I
、1.下含有していることを特徴とする特許請求の範囲
第1項ないし第5項のいずれかに記載の真空しゃ断器用
接点材料。[Claims] rl) It is characterized by containing copper and, as other components, chromium in a range of 10 to 35% by weight, tantalum in a range of 20% by weight or less, and titanium in a range of 5% by weight or less. Contact material for vacuum breaker. (2) The contact material for a vacuum breaker according to claim 1, characterized in that titanium is contained in a range of 3% by weight or less. (3) The contact material for a vacuum breaker according to claim 1, which contains titanium in a range of 0.8% by weight or less. (4) Tantalum: 3.5-18% by weight, titanium: 0
.. The contact material for a vacuum breaker according to claim 1, characterized in that the contact material is contained in a range of 8% by weight or less. (5) Tantalum: 3.5-15% by weight, titanium: 0
.. A contact material for a vacuum breaker according to clause 1 of the patent claim, characterized in that the content is in a range of 8% by weight or less. (6) Bismuth, tellurium, antimony, thallium. At least one low melting point metal such as lead, selenium, cerium, and calcium, its alloy, its intermetallic compound, and its oxide at 20% by weight 96I
, 1. A contact material for a vacuum breaker according to any one of claims 1 to 5, characterized in that the contact material contains:
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7661583A JPS59201331A (en) | 1983-04-28 | 1983-04-28 | Contact material for vacuum breaker |
| US06/547,218 US4517033A (en) | 1982-11-01 | 1983-10-31 | Contact material for vacuum circuit breaker |
| DE8383110920T DE3378088D1 (en) | 1982-11-01 | 1983-11-02 | Contact material for vacuum circuit breaker |
| EP83110920A EP0110176B1 (en) | 1982-11-01 | 1983-11-02 | Contact material for vacuum circuit breaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7661583A JPS59201331A (en) | 1983-04-28 | 1983-04-28 | Contact material for vacuum breaker |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59201331A true JPS59201331A (en) | 1984-11-14 |
| JPS6336092B2 JPS6336092B2 (en) | 1988-07-19 |
Family
ID=13610248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7661583A Granted JPS59201331A (en) | 1982-11-01 | 1983-04-28 | Contact material for vacuum breaker |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59201331A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5500499A (en) * | 1993-02-02 | 1996-03-19 | Kabushiki Kaisha Toshiba | Contacts material for vacuum valve |
-
1983
- 1983-04-28 JP JP7661583A patent/JPS59201331A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5500499A (en) * | 1993-02-02 | 1996-03-19 | Kabushiki Kaisha Toshiba | Contacts material for vacuum valve |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6336092B2 (en) | 1988-07-19 |
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