JPS5923363B2 - 自動膜厚分析器 - Google Patents

自動膜厚分析器

Info

Publication number: JPS5923363B2
Authority: JP; Japan
Prior art keywords: current; voltage; holding; display; film thickness
Prior art date: 1978-07-19
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP53104312A

Other languages

English (en)

Japanese (ja)

Other versions

JPS5517489A (en

Inventor

ルドルフ・ジエイ・ゼブリスキイ

ラデイ・ジエイ・トンプソン

ウイリアム・ビイ・タツカ−

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kollmorgen Technologies Corp

Original Assignee

Kollmorgen Technologies Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-07-19

Filing date

1978-08-25

Publication date

1984-06-01

1978-08-25 Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp

1980-02-06 Publication of JPS5517489A publication Critical patent/JPS5517489A/ja

1984-06-01 Publication of JPS5923363B2 publication Critical patent/JPS5923363B2/ja

Status Expired legal-status Critical Current

Links

238000012360 testing method Methods 0.000 claims description 59
239000002184 metal Substances 0.000 claims description 25
229910052751 metal Inorganic materials 0.000 claims description 25
238000005070 sampling Methods 0.000 claims description 25
239000003990 capacitor Substances 0.000 claims description 18
238000004146 energy storage Methods 0.000 claims description 7
230000004044 response Effects 0.000 claims description 6
230000007246 mechanism Effects 0.000 claims description 5
239000000463 material Substances 0.000 claims description 4
238000001514 detection method Methods 0.000 claims 5
238000007599 discharging Methods 0.000 claims 2
239000012528 membrane Substances 0.000 claims 1
238000000034 method Methods 0.000 description 20
239000010408 film Substances 0.000 description 17
238000007747 plating Methods 0.000 description 17
229910052802 copper Inorganic materials 0.000 description 15
239000010949 copper Substances 0.000 description 15
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
239000004020 conductor Substances 0.000 description 11
239000000758 substrate Substances 0.000 description 11
238000004519 manufacturing process Methods 0.000 description 10
238000007772 electroless plating Methods 0.000 description 9
238000007667 floating Methods 0.000 description 9
230000008569 process Effects 0.000 description 9
230000007935 neutral effect Effects 0.000 description 6
230000007547 defect Effects 0.000 description 5
239000010409 thin film Substances 0.000 description 5
238000005259 measurement Methods 0.000 description 4
238000010586 diagram Methods 0.000 description 3
230000001105 regulatory effect Effects 0.000 description 3
230000005250 beta ray Effects 0.000 description 2
230000000903 blocking effect Effects 0.000 description 2
238000000576 coating method Methods 0.000 description 2
238000007796 conventional method Methods 0.000 description 2
238000000840 electrochemical analysis Methods 0.000 description 2
238000009713 electroplating Methods 0.000 description 2
238000005530 etching Methods 0.000 description 2
238000000691 measurement method Methods 0.000 description 2
238000002844 melting Methods 0.000 description 2
230000008018 melting Effects 0.000 description 2
239000007769 metal material Substances 0.000 description 2
238000003825 pressing Methods 0.000 description 2
239000000523 sample Substances 0.000 description 2
241001417527 Pempheridae Species 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
239000010953 base metal Substances 0.000 description 1
230000008859 change Effects 0.000 description 1
238000010276 construction Methods 0.000 description 1
230000001276 controlling effect Effects 0.000 description 1
150000001879 copper Chemical class 0.000 description 1
238000000354 decomposition reaction Methods 0.000 description 1
230000002950 deficient Effects 0.000 description 1
230000003111 delayed effect Effects 0.000 description 1
238000000151 deposition Methods 0.000 description 1
230000014759 maintenance of location Effects 0.000 description 1
239000000155 melt Substances 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
238000003908 quality control method Methods 0.000 description 1
230000000630 rising effect Effects 0.000 description 1
230000001629 suppression Effects 0.000 description 1
230000001052 transient effect Effects 0.000 description 1

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Measurement Of Resistance Or Impedance (AREA)
Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
Length Measuring Devices By Optical Means (AREA)

JP53104312A 1978-07-19 1978-08-25 自動膜厚分析器 Expired JPS5923363B2 (ja)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US92607478A	1978-07-19	1978-07-19
US000000926074		1978-07-19

Publications (2)

Publication Number	Publication Date
JPS5517489A JPS5517489A (en)	1980-02-06
JPS5923363B2 true JPS5923363B2 (ja)	1984-06-01

Family

ID=25452709

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP53104312A Expired JPS5923363B2 (ja)	1978-07-19	1978-08-25	自動膜厚分析器

Country Status (11)

Country	Link
JP (1)	JPS5923363B2 (de)
AT (1)	AT377885B (de)
AU (1)	AU3884378A (de)
BR (1)	BR7805509A (de)
CH (1)	CH640343A5 (de)
DE (1)	DE2929567C2 (de)
FR (1)	FR2431679A1 (de)
GB (1)	GB2027212B (de)
IT (1)	IT7949804A0 (de)
NL (1)	NL7904876A (de)
SE (1)	SE448784B (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5691648A (en) *	1992-11-10	1997-11-25	Cheng; David	Method and apparatus for measuring sheet resistance and thickness of thin films and substrates
US5495178A (en) *	1992-11-10	1996-02-27	Cheng; David	Method and apparatus for measuring film thickness
CN108712830B (zh) *	2018-05-30	2021-02-26	广东天承科技股份有限公司	一种电路板的无钯化学镀铜工艺

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3365663A (en) *	1962-06-29	1968-01-23	Shin Mitsubishi Jukogyo Kk	Thickness measuring instrument for electro-conductive objects and associated methods
US4042880A (en) *	1974-01-07	1977-08-16	Unit Process Assemblies, Inc.	Electrode assembly for measuring the effective thickness of thru-hole plating circuit board workpieces
JPS5262045A (en) *	1975-11-17	1977-05-23	Oki Electric Ind Co Ltd	Measuring thickness of non-electrolytic copper plating of through-hole substrate

1978
- 1978-08-11 AU AU38843/78A patent/AU3884378A/en active Pending
- 1978-08-24 BR BR7805509A patent/BR7805509A/pt unknown
- 1978-08-25 JP JP53104312A patent/JPS5923363B2/ja not_active Expired
1979
- 1979-06-21 NL NL7904876A patent/NL7904876A/nl not_active Application Discontinuation
- 1979-07-16 SE SE7906144A patent/SE448784B/sv not_active IP Right Cessation
- 1979-07-16 GB GB7924748A patent/GB2027212B/en not_active Expired
- 1979-07-18 AT AT0497279A patent/AT377885B/de active
- 1979-07-18 FR FR7918577A patent/FR2431679A1/fr active Granted
- 1979-07-18 CH CH670379A patent/CH640343A5/de not_active IP Right Cessation
- 1979-07-19 IT IT7949804A patent/IT7949804A0/it unknown
- 1979-07-19 DE DE2929567A patent/DE2929567C2/de not_active Expired

Also Published As

Publication number	Publication date
SE7906144L (sv)	1980-01-20
JPS5517489A (en)	1980-02-06
DE2929567C2 (de)	1983-10-13
AT377885B (de)	1985-05-10
CH640343A5 (de)	1983-12-30
FR2431679A1 (fr)	1980-02-15
GB2027212B (en)	1983-05-05
DE2929567A1 (de)	1980-01-31
FR2431679B1 (de)	1983-06-17
ATA497279A (de)	1984-09-15
SE448784B (sv)	1987-03-16
NL7904876A (nl)	1980-01-22
GB2027212A (en)	1980-02-13
IT7949804A0 (it)	1979-07-19
AU3884378A (en)	1980-02-14
BR7805509A (pt)	1980-03-11

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US4743847A (en)	1988-05-10	Printed circuit conductor test system
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KR100349084B1 (ko)	2002-08-14	커패시터의 검사 방법
GB1580229A (en)	1980-11-26	Method and means for determining the immersed surface area of an electrode of an electrochemical bath
JPH0611530A (ja)	1994-01-21	電子部品の絶縁信頼性寿命の評価方法及びその装置
JP2014029311A (ja)	2014-02-13	プリント基板の絶縁検査装置及び絶縁検査方法
JPH11211684A (ja)	1999-08-06	マイグレーション検査装置
JPH0749327A (ja)	1995-02-21	電解質中の構造物の真の電気化学ポテンシャルを測定する方法及び装置
US3855527A (en)	1974-12-17	Method and system for determining the resistance of the dielectric in a capacitor
JPS62123367A (ja)	1987-06-04	容量素子の充電電流測定方法
GB2027212A (en)	1980-02-13	Measuring the thickness of metallic films on insulating substrates
JP2009258099A (ja)	2009-11-05	コンデンサの絶縁性の検査方法
JP3390906B2 (ja)	2003-03-31	二次電池の試験方法及び試験装置
JP4259692B2 (ja)	2009-04-30	回路基板検査装置
JPH05133997A (ja)	1993-05-28	Ｉｃ試験装置の較正方法
JP2866965B2 (ja)	1999-03-08	回路基板検査装置における最良測定条件データの生成方法
JPS5817377A (ja)	1983-02-01	フラットケ−ブルの導通検査装置
KR102690177B1 (ko)	2024-08-05	Ai를 이용한 기판 검사 장치
JP2007315981A (ja)	2007-12-06	測定装置および検査装置
SU1767589A1 (ru)	1992-10-07	Способ определени электроемкости химического источника тока