JPS5923593A - Heat discharging structure of submarine repeater - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a submarine repeater for a submarine cable, and particularly to its heat dissipation structure.

(21 Background of technology Submarine repeaters (hereinafter referred to as repeaters) are installed on the seabed with built-in electronic devices such as amplifiers. Therefore, maintenance and repair of repeaters installed on the seabed are It is extremely complicated and time-consuming. Therefore, in order to withstand long-term use, this type of repeater must have sufficient mechanical strength to withstand water pressure on the seabed, and the electrical functions of the built-in electronic devices. It is important that it is maintained for a long period of time without degrading.

FIG. 1 is a diagram showing the appearance of a general repeater (partially cut away). In FIG.

The cylindrical external casing JO has a watertight structure and pressure resistance t,/. A cylindrical repeater unit 1-12 is disposed inside this external casing 10 via a buffer member (mainly a spring) II. Submarine cable i3. I4 are connected to the repeater unit 12 by passing through both ends of the external housing 10, respectively.

The above-mentioned electronic device is built into this repeater unit 12.

This built-in electronic device 7j has heat generating electronic components such as ICs (integrated circuits) and semiconductors (transistors) mounted therein. These electronic components are heated by their own heat, and their temperature increases. Therefore, it is necessary to dissipate the heat generated by the electronic components so that this temperature is always kept below the function guarantee temperature of the electronic components (for example, 65° C.). In addition, in recent years, the mounting density of electronic components in this type of repeater has tended to increase due to the use of LSI (Large-Scale Integrated Circuits), etc., and as a result, the overall mounted electronic components generate heat. 11. There is also a tendency to increase. Therefore, there is a need for a repeater having a structure that provides good heat dissipation.

(3), Prior Art and Problems FIG. 2 is a 1ζth cross-sectional view illustrating the heat dissipation structure of a conventional repeater.

In FIG. 2, a buffer spring 2]? A metal cylindrical internal casing 23 that forms the entire outer wall of the repeater unit 22 is disposed therebetween. An insulating layer 2 made of polyethylene or the like is provided on the outer peripheral surface of the internal housing 23.
4 is attached.

A plate-shaped metal frame 25 is disposed inside the internal housing 23 and extends along the axial direction of the housing 23, and both end surfaces thereof are fixed to the inside mj of the housing 23. Heat dissipation blocks 26a and 26b are fixed on the upper and lower Fu1 of the metal frame 25, respectively, and the heat dissipation block 26a
, 26b are fixed to circuit boards 27a and 27b, respectively. On these circuit boards 27a and 27b, a plurality of 7L heat generating electronic components 23a and 28b are mounted 21.
ing.

The heat dissipation blocks 26a, 26b and the metal frame 25 are often made of brass. Now, the heat generated by the heat generating electronic components 28a, 28b is transferred sequentially from the electronic components 28a, 28b to the circuit board 27.
a + 27 bb heat dissipation block 26a.

26b and the metal frame 25 to conduct heat to the internal casing 23, and a path that conducts heat to the internal casing 23 via gas (often air) inside the internal casing 23. Heat is radiated to the outside of 23. However, as shown in the figure, the contact area between the metal frame 25 and the internal cylindrical body 23 is small, and the length of the heat radiation path is also long, so that there is little heat radiation due to heat conduction through the metal frame. Therefore, most of the heat radiation depends on heat transfer through the internal gas. The first problem is that the heat dissipation structure of this repeater does not have a good heat dissipation effect.

(4) 1 Objective of the Invention In view of the problems of the prior art, an object of the present invention is to improve and effectively utilize the heat dissipation block to expand the heat conduction area, thereby achieving a good heat dissipation effect. The object of the present invention is to provide a heat dissipation structure for a submarine repeater having the following features.

(5) Structure of the Invention And to achieve this objective, according to the present invention,
a cylindrical internal casing disposed inside the cylindrical external casing; a plate-shaped frame arranged and fixed along the axial direction inside the cylindrical external casing; and a heat dissipation block disposed on the upper and lower surfaces of the frame; ■
1. A heat dissipation structure for a submarine repeater comprising a circuit board loaded with electronic components and disposed on the heat dissipation block, wherein the heat dissipation block has a shape H that is the same as the external shape of the internal casing;
At the same time, it is cut along the axial direction, divided into a plurality of pieces, and integrally joined L7, and the divided blocks V are provided with mutually opposing recesses gold plated on the opposing joining surfaces, respectively, and the recesses are A circuit board is placed on the bottom of the board, and electronic components with studs are mounted on the board, and pressure is applied so that the studs penetrate through the board and are implanted and fixed to the heat dissipation block below the board. ¥! A heat dissipation structure for a submarine repeater is provided.

(6λ Embodiments of the Invention Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

FIG. 3 is a sectional view (h) of the heat dissipation structure of the repeater according to the present invention.

In FIG. 3, a repeater unit 32 is disposed inside a cylindrical external casing 3o via a buffer spring 31. The outer button of the repeater unit 32 is coated with an insulating layer 34 made of polyethylene or the like, as in the prior art example (FIG. 1). Code 35°36.37 and 38 are external dimensions (
Conventional cylindrical internal housing 2 with the above-mentioned outer diameter and length dimensions
3 (1st Showa 1) and is cut along the axial direction to be divided into four parts. These heat dissipation blocks 35, 36, 37, 38 are integrally connected by poles 1-39K. The mutually opposing joining surfaces of the heat dissipation blocks 35 and 36 are opposite to each other and f
Recesses 35a and 36a are provided which extend in the ill line direction. The recesses 35a and 36a cooperate to form a tunnel-like space 1, and recesses 3 facing each other also on the joint surfaces of the heat dissipation blocks 37 and 38 in the same way as the recesses 35a and 36a.
7a and 38a are provided, respectively. Recess 35 a
* 36 a + Circuit boards 40.41° and 42.43 are fixed on the bottom surfaces of 37a and 38a, respectively. The stud 44a of the studded electronic component 44 penetrates the circuit board 40 and is implanted onto the heat dissipation pin 35 in the recess 35a and fixed with screws. In addition, this stud 44
A may be fixed by soldering or the like. Other electronic components with studs 45, 4 (i.

47 also have their respective studs 45a, 46a, 47a, each heat dissipation block 36,
It is implanted and fixed at 37 and 38 respectively. Although brass is generally used as the material for the heat dissipation blocks 35, 36, 37, and 38, lightweight materials such as aluminum can be used since forming the blocks into such a block structure eliminates strength problems. You can use it all.

According to this embodiment, the heat dissipation block is 35.36°37.
38 cooperate to form a kind of cylindrical housing metal, which is similar to the internal housing 23 and the gold I4 frame 2 in the prior art example (FIG. 1).
It also serves as number 5. Stud-mounted electronic components are used, and the studs are directly implanted and fixed into the heat dissipation block (Z). Therefore, electronic components 44, 45, 46
．． Most of the heat generated by the studs 44a and 47 is generated by the studs 44a and 47, respectively.
The heat dissipation block 35.45a, 46a, +47a.
The heat is conducted to 36.37°38, and the heat is efficiently radiated directly to the outside from the entire outer circumference m1 of the heat radiation block. In addition, heat dissipation due to heat transfer through recesses (often air)
Electronic component 4 = 1.45, 46.47 is heat radiation block 35
, 36, 37, and 38, it works well. In this way, by expanding the heat conduction area and shortening the heat radiation path of the generated heat to form the heat radiation structure, the heat radiation effect is greatly improved. For example, η↓The number of electronic components mounted is
If the water temperature outside the repeater is 30°C, the temperature of the heat-generating electronic components can be lowered by 25 to 6°C. That is, in the conventional example, the temperature of the child component was 71°C and was 65 to 6 (i
℃, according to the heat dissipation of the present invention) 60℃
It can be lowered to a lower position. This means that it is possible to increase the packaging density of electronic components.
It means. Furthermore, the heat dissipation block 35.36°37
．． Since 38 is formed to surround the circuit board, it also plays the role of protecting the electronic device.

It should be noted that the present invention is not limited to the above-mentioned embodiments, but can be easily applied to repeaters having a rectangular cross-sectional shape or other shapes. As explained in Rev. This has the effect of improving the long-term reliability of electronic attachment.

[Brief explanation of the drawing]

Fig. 1 U is a partially cutaway external view of a general submarine repeater, Fig. 2 is a cross-sectional view of the heat dissipation structure of a conventional submarine repeater, and Fig. 3 is a cross-sectional view of the heat dissipation structure of the submarine repeater of the present invention. FIG. 30...Tubular external casing, 31...Loose spring, 32...Relay unit l-,, 34...
...Insulating layer, 35°3G, 37.38...
Heat dissipation blocks, 35a, 36a. 37a, 38a... recess, 4υ, 4J, 42° 43... wiring board, 44.45.46.47...
...Electronic parts with nutanod, 44p-, 45a, 46
a. 47a... Nutad. Patent application ＼ BENJUTSU CO., LTD. Tokusukei, Representative Patent Attorney Office Otsu Ro Patent Attorney Nishi Tae Kazu 2 Patent Attorney Yen 1) Shin Man: fP Yudoyama D $

Claims (1)

[Claims] 1. A cylindrical internal casing disposed inside the cylindrical external casing, a plate-shaped frame arranged and fixed inside the internal casing along the axial direction, and a heat radiation disposed on the upper and lower surfaces of the frame. A heat dissipation structure for a submarine repeater comprising a block and a circuit board mounted with electronic components and disposed on the heat dissipation block,
The heat dissipation block is formed to have the same shape as the outer shape of the internal casing, is cut along the axial direction to be divided into a plurality of pieces, and is integrally supplied, and each of the divided blocks has a bonding surface that faces each other. Recesses facing each other are provided, a circuit board is disposed on the bottom surface of the recess, and electronic components are mounted on the board, and the studs penetrate through the board 2 to form a heat dissipation block below the board. Has it been planted and fixed? Features a heat dissipation structure for submarine repeaters.