JPH0449799B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a submarine repeater for a submarine cable, and particularly to its heat dissipation structure.

(2) Background of the technology Submarine repeaters (hereinafter referred to as repeaters) are installed on the ocean floor and contain electronic devices such as amplifiers. For this reason, the installation and repair of repeaters installed on the seabed is extremely complicated and time-consuming. Therefore, this type of repeater can withstand long-term use, has sufficient mechanical strength to withstand water pressure on the seabed, and can be maintained for a long period of time without degrading the electrical function of the built-in electronic device. It is very important to.

FIG. 1 is a diagram showing the appearance of a general repeater (partially cut away). In FIG. 1, a cylindrical external housing 10 is formed to have a watertight structure and a pressure-resistant structure. A cylindrical repeater unit 12 is disposed inside this external casing 10 with a buffer member (mainly a spring) 11 in between. The submarine cables 13 and 14 are each connected to an external housing 10.
and is connected to the repeater unit 12 through both ends of the line. This repeater unit 12 contains the above-mentioned electronic device.

This built-in electronic device includes an IC (integrated circuit)
Heat-generating electronic components such as semiconductors and semiconductors (transistors) are mounted. These electronic components are heated by the heat generated by themselves, and their temperature increases. Therefore, it is necessary to dissipate the heat generated by the electronic components so that this temperature is always kept below the functional guarantee temperature of the electronic components (for example, 65° C.). Also, in recent years,
This type of repeater also uses LSI (Large-Scale Integrated Circuit)
Due to the use of electronic components, the packaging density of electronic components tends to increase, and therefore the amount of heat generated by the entire mounted electronic components also tends to increase. Therefore, there is a need for a repeater having a structure that provides good heat dissipation.

(3) Prior Art and Problems FIG. 2 is a diagram for explaining the heat dissipation structure of a conventional repeater, and is a cross-sectional view thereof.

In FIG. 2, a repeater unit 22 is installed inside a cylindrical external casing 20 via a buffer spring 21.
A metal cylindrical internal casing 23 forming an outer wall is provided. An insulating layer 24 made of polyethylene or the like is adhered to the outer peripheral surface of the internal casing 23 . A plate-shaped metal frame 25 is disposed inside the internal housing 23 and extends along the axial direction of the housing 23, and both end surfaces thereof are fixed to the inner surface of the housing 23. Heat dissipation blocks 26a and 26b are fixed on the upper and lower surfaces of the metal frame 25, respectively, and circuit boards 27a and 27b are fixed on the heat dissipation blocks 26a and 26b, respectively. A plurality of heat generating electronic components 28a and 28b are mounted on these circuit boards 27a and 27b, respectively. The heat radiation blocks 26a, 26b and the metal frame 25 are often made of brass.

Now, the heat generated by the heat generating electronic components 28a and 28b is transferred from the electronic components 28a and 28b to the circuit boards 27a and 27b and the heat dissipation block 26, respectively.
a, 26b and the metal frame 25 to conduct heat to the internal casing 23, and the internal casing 23 via a gas (often air) in the internal casing 23.
Heat is radiated to the outside of the internal casing 23 through a heat transfer path. However, as shown in the figure, the contact area between the metal frame 25 and the internal casing 23 is small;
Furthermore, since the length of the heat radiation path is long, the amount of heat radiation due to heat conduction through the metal frame is small. Therefore, most of the heat dissipation depends on heat transfer through the internal gas. Therefore, the heat dissipation structure of this repeater has a problem in that the heat dissipation effect is not good.

(4) Purpose of the Invention In view of the problems of the prior art, the purpose of the present invention is to improve and effectively utilize the heat dissipation block.
The object of the present invention is to provide a heat dissipation structure for a submarine repeater that has a good heat dissipation effect by enlarging the heat conduction area.

(5) Structure of the Invention In order to achieve this object, the present invention includes a cylindrical external casing, a circuit board housed in the external casing, and a heat dissipation block for the circuit board. In the heat dissipation structure of the submarine repeater, the heat dissipation block has a cylindrical outer circumference;
The cylindrical shape is divided into a plurality of parts along a plane parallel to the axis, and a recessed part is provided in a required division face to accommodate a circuit board, and the divided parts are bolted to the original shape. A heat dissipation structure for a submarine repeater is provided.

(6) Embodiments of the invention Hereinafter, embodiments of the invention will be described in detail based on the drawings.

FIG. 3 is a cross-sectional view of the heat dissipation structure of the repeater according to the present invention.

In FIG. 3, a repeater unit 32 is disposed inside a cylindrical external casing 30 with a buffer spring 31 interposed therebetween. An insulating layer 34 made of polyethylene or the like is adhered to the outer periphery of the repeater unit 32, as in the prior art example described above (FIG. 1). Code 35,
36, 37, and 38 are external dimensions (outer diameter and length dimensions) of the cylindrical internal housing 23 (first
The heat dissipation block shown in FIG. These heat dissipation blocks are shown respectively. These heat dissipation blocks 35, 36, 37, and 38 are integrally connected by bolts 39. Recesses 35a and 36 are formed in opposing joint surfaces of the heat dissipation blocks 35 and 36 and extend in the axial direction.
A is provided. And recesses 35a and 36
a cooperate to form a tunnel-like space.
Similarly, the joint surfaces of the heat radiation blocks 37 and 38 are also provided with mutually opposing recesses 37a and 38a, respectively. Recesses 35a, 36a, 38
Circuit boards 40, 41, 4 are placed on the bottom surfaces of a and 38a.
2, 43, are fixed respectively. The electronic component 44 with a stud is either the stud 44a or the circuit board 40.
The heat dissipation block 35 is fixed by a screw inserted through the recess 35a and placed on the heat dissipation block 35. Note that this stud 44a may be fixed by soldering or the like. Other electronic parts with studs 45, 46, 47
Similarly to the electronic component 44, each stud 45a, 46a, 47a is connected to each heat radiation block 3.
6, 37, and 38, respectively.
Although brass is generally used as the material for the heat dissipation blocks 35, 36, 37, and 38, lightweight materials such as aluminum can be used since forming them into such a block structure eliminates strength problems. You can also.

According to this embodiment, the heat radiation blocks 35, 3
6, 37, and 38 cooperate to form a kind of cylindrical casing, which also serves as the internal casing 23 and metal frame 25 in the prior art example (FIG. 2).
An electronic component with a stud is used, and the stud is directly implanted and fixed to the heat radiation block. Therefore, most of the heat generated by the electronic components 44, 45, 46, 47 is generated by the studs 44a, 4, respectively.
Heat dissipation block 3 via 5a, 46a, 47a
5, 36, 37, and 38, and is efficiently radiated directly to the outside from the entire outer periphery of the heat radiating block. In addition, heat radiation due to heat transfer through the internal gas (often air) in the space formed by the cooperation of the recesses 35a and 36a and the space formed by the cooperation of the recesses 37a and 38a is also 44,45,4
6, 47 are heat radiation blocks 35, 36, 37, 38
This works well because it is surrounded by By configuring a heat dissipation structure in which the heat conduction area is expanded and the heat dissipation path of the generated heat is shortened in this manner, the heat dissipation effect is greatly improved. For example, the number of electronic components mounted is
If the water temperature outside the repeater is 30°C, the temperature of the heat-generating electronic components can be lowered by 5 to 6°C. In other words, in the conventional example, the temperature of electronic components is 65
~66℃, according to the heat dissipation structure of the present invention, 60℃
It can be lowered to about ℃. This means that it is possible to increase the packaging density of electronic components. Furthermore, heat dissipation block 3
Since 5, 36, 37, and 38 are formed to surround the circuit board, they also serve to protect the electronic device.

It should be noted that the present invention is not limited to the above-mentioned embodiments, and can be easily applied to repeaters having a rectangular cross-sectional shape or other shapes, for example.

(7) Effects of the Invention As explained above in detail, the heat dissipation structure of the submarine repeater of the present invention has an extremely good heat dissipation effect and protects the built-in electronic devices, thereby achieving
This has the effect of increasing the packaging density of electronic components and improving the long-term reliability of electronic devices.

[Brief explanation of the drawing]

Figure 1 is a partially cutaway external view of a typical submarine repeater, Figure 2 is a cross-sectional view of the heat dissipation structure of a conventional submarine repeater, and Figure 3 is a cross-sectional view of the heat dissipation structure of the submarine repeater of the present invention. It is a front view. 30... Cylindrical external casing, 31... Buffer spring, 3
2...Repeater unit, 34...Insulating layer, 35,
36, 37, 38... Heat radiation block, 35a, 3
6a, 37a, 38a... recess, 40, 41, 4
2, 43...Wiring board, 44, 45, 46, 47
...Electronic parts with studs, 44a, 45a, 46
a, 47a...Stud.

Claims (1)

[Claims] 1. A heat radiation structure for a submarine repeater comprising a cylindrical external casing, a circuit board housed in the external casing, and a heat radiation block for the circuit board, wherein the heat radiation block has a circular outer periphery. is columnar and is divided into a plurality of pieces along a plane parallel to the cylindrical axis,
1. A heat dissipation structure for a submarine repeater, characterized in that a recessed portion for accommodating a circuit board is provided in a required divided surface, and the divided portions are further bolted to the original shape.