JPS5925251A - Ceramic substrate - Google Patents

Abstract

PURPOSE:To prevent crackings and breakings due to the mutual collisions of the ceramic substrates by forming projecting sections, angle sections thereof are curve-formed so that stepped differences are formed in the end surfaces of the outer circumferences of the ceramic substrates. CONSTITUTION:The projecting section 3 is formed so that the stepped difference 4 is formed in the end surface in the thickness direction in the ceramic substrate 2. The angle section 5 of the projecting section 3 is formed curvedly as a round- shaped protrudent section. The nose of the projecting section 3 is positioned at the center of the end surface in the thickness direction. When the substrates 2 in which such projecting sections are formed in the end surfaces in the thickness directions collide mutually, the application of impact force to corner sections in which cracking, breaking, etc. are liable to be generated can be avoided because the end surfaces 3, 3' of the outer circumferences of the substrates 2, 2 collide mutually.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a ceramic substrate, and more particularly to a ceramic substrate suitable for use as a pathogage board or a printed wiring board on which a semi-solid integrated circuit element is mounted and housed. .

As is well known in the past, ceramics and ceramics have excellent insulating properties, wear resistance, chemical stability, high hardness, and low coefficient of thermal expansion. It is extremely excellent as a monthly feed for river substrates and is widely used.

However, ceramic has the disadvantage of being weak in impact resistance, so when the end surfaces 1 are flat, as in the case of the ceramic substrate shown in FIG. 1, for example, when the ceramic substrates 1 collide with each other, End face 1' or one t
S + opposite +rli, 1 side 1 and other board: 1-na part R
Cracks, cracks, chips, etc. are extremely likely to occur in these ceramic substrates 1 due to each 1ffij collision.

'1. '1°, semiconductor integrated circuit elements will be handled on a 1-1-1 basis; the mounting process of semiconductor elements, including many tasks such as mounting and wire bonding, will be automated and carried out on a saw assembly line. In such a case, when moving the two ceramic plates 1 one after another on the line, do not let them fall down the slope under their own weight, or blow 1 mouth of air; In order to
As the comrades repeatedly collided violently, cracks and cracks occurred frequently in the plate 1 of these ceramic screws, resulting in major problems such as lowering the yield and reliability of the product.

The causes of 1) rubbing and chipping &J caused by such 11 bumps between ceramic substrates are: (1) difference in compression ratio between the upper and lower sides in the case of press molding; (2) 1.
7. The following factors are involved: degree conditions, (3) outer surface roughness, and (4) raw material particle size and compounding ratio.As a result of various experiments, the present inventors found that the ceramic substrate Even if 0111 faces 1 of 1 collide head-on, cracking or chipping is unlikely to occur, but if they collide in an elongated shape, that is, the end face 1' of the ceramic substrate that is stationary in front of the ceramic substrate that follows It has been found that when a corner R of a JJS plate collides, cracks, cracks, and chips frequently occur in the corner R. Based on this result, by adjusting the shape of the outer end surface of the ceramic substrate, cracks,
It has been found that cracking and chipping can be prevented.

It is an object of the present invention to provide a ceramic substrate having a tj (l: based on the above-mentioned knowledge), which is formed in a manner that prevents cracks, cracks, and chips to the maximum extent possible.

The Ceramic and Mink substrates of the present invention are characterized by the fact that the protrusions are formed on the outer peripheral end surface of the substrate without forming any steps, and the ridges of the protrusions are formed in a curved shape. It is something to do.

The present invention relates to a flat ceramic substrate on which a semiconductor integrated circuit element is mounted.
Cracks, cracks, and chips in the substrate such as C sintered integrated ceramic substrates and other single-layer or multi-IPI ceramic substrates for printed wiring, etc., may occur due to the product. It is applied to 21) which is a fatal flaw in terms of reliability.

Hereinafter, the present invention will be described based on the embodiments shown in the attached drawings.
111 will explain.

The 21st No. 1 Ceramic Socket & Board is a semiconductor integrated circuit element.
An example of a ceramic substrate for two sides is shown,
A protrusion 3 is formed so as to form a step 4 on the +11i1 surface of the plate 2 in the jv direction.

The bulge f of this protrusion 3 eyes 9 shapes 1)! Like lX,
It is sufficient that the ridge portion 5 is formed in a curved shape.

The tip of the protruding part 3 that is inserted into the second part Ig: □1 is I￥c
7j direction, and the protruding height 1] is the jv of the cutting board 2.
It is also related to the thickness T, and when the thickness 'r = 1.52 mm, the protrusion i1'li D = 0. [At about 12~01 open-
``= 0.013 to 0.0 (ifi) was determined by experiment''. In other words, A in the diagram? In order to make it easier to understand, the protruding part is shown stretched by n1, but in reality, the protruding height is approximately 1υ to 100 cm thick.
It was found that the first objective was achieved.

When the substrates 2 having such protrusions formed on the thicker end faces collide with each other, for example, as shown in FIG.
By colliding the protrusions 3.3 on the outer peripheral end surface of 7.2.2 with each other, it is possible to avoid applying an impact force to the corner ql (where brakes, chips, etc. are likely to occur).

Furthermore, even if the collision occurs in a somewhat inclined manner, the protrusion 3.3' is provided so as to form a step 4, and ■ one edge! '! l!
5 is formed in a curved shape, it is possible to reduce the impact force on the edge of the substrate that causes cracks and chips, and effectively prevent cracks, chips, and chips on the ceramic substrate 2.2'. Prevented. In addition, as shown in No. 3 and 1, the corner part Ra of the substrate 2.2 is Q, and the curvature of 3 mm culm degree is 4.
If you make it a curved surface with a diameter, this 9" fruit 1. ! The number of people will be increased.

Next, the present invention will be explained with reference to experimental examples.

- 24 having a cross-sectional shape as shown in FIG.
．． hm x 24, hm rectangular shape, thickness e'j = 1, 52+u+, radius of curvature of corner 11a 0.
A protrusion 3 with a 3111m corner (in terms of different protrusions 1fli I) was formed - Ceraminoku! , (1 counter and
Cerami Nokuno from 1jfl, whose 0111 side is flat,
(A collision test was conducted on one roll, and the results are shown in Table 1. The conditions for this collision test are 27, which is the length 1
00cm, 1tLi470'tray's second part 50c+
1 group 20+11 as a test loop in n intervals
Each of the i+ boards is arranged in a flat plane and placed 1111 below the tray by its own weight. This kind of suspension was repeated 10 times, but cracks, 71 cracks, and chips appeared when lifting 9 times.
) A new fortune-telling (replaces the board,
△Leather I's Tess I Group's 10th lt') Buy 1&
c, 2 IHLJ A] Cracks, cracks, and chips occurred on 20 boards of the first 1υ1 (the factor was set to 41iW1).

” It is clear from the test results that 1. When the thickness of the ceramic foil plate is 1.52 mF,! By forming a second protrusion with a protrusion height of 0.02n+m or more on the end surface of the board, cracks due to tiI bumps between boards, P) scratches, chips, etc. It is possible to significantly reduce f1 compared to the case.

Note that the thickness I' = 1, . In the case of a 52 mm ceramic substrate, the protrusion i1'li l) is 0.1. mm or more”
2, the effect of preventing cracks, separation, chips, etc. becomes rather large, and depending on the conditions of use of the board, Q, 1 mi or more.
Two protrusions may be formed. However, the protrusion ll′TI
As I) becomes larger, the shape of one surface becomes deformed from the regular rectangular shape, and as the shape of the substrate becomes larger, There is a direction.

The molding method of such a substrate made of ceramic is green (
41U) After molding by the punching method or other extrusion method from sorting, +II+, molding a protrusion on one side, or after sintering, grinding and machining the protrusion "(1), etc. The most suitable method may be used for each.

As described above, according to the ceramic substrate of the present invention, even when ceramic substrates collide with each other, it is possible to significantly reduce the occurrence of cracks, cracks, chips, etc. Yield can be significantly improved even under harsh conditions such as assembly lines, etc.
Since quality and reliability can be improved by combining, it is suitably used for semiconductor devices and the like.

[Brief explanation of drawings]

1(a) and 1(b) are a plan view and a side view of a conventional ceramic substrate, FIG. 2 is a partial lvi side view of a ceramic substrate according to an embodiment of the present invention, and FIG. 3 is a collision of a ceramic substrate according to the present invention. FIG. 3 is a diagram for explaining an example of an embodiment. 1.2.2' - Ceramic base 3.3': Projection fl (4; Step patent applicant: Kyocera Corporation Representative: Kazuo Inamori (I)

Claims (1)

[Claims] A protrusion is formed to form a step on the outer periphery ζlit surface of a substrate made of ceramic, and the ridge Q of the protrusion is
A ceramic substrate characterized in that i is formed in a curved shape.