JPS5927539A - サーマルヘッド用icチップのパッド配列方法 - Google Patents
サーマルヘッド用icチップのパッド配列方法Info
- Publication number
- JPS5927539A JPS5927539A JP57136948A JP13694882A JPS5927539A JP S5927539 A JPS5927539 A JP S5927539A JP 57136948 A JP57136948 A JP 57136948A JP 13694882 A JP13694882 A JP 13694882A JP S5927539 A JPS5927539 A JP S5927539A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- pads
- along
- ground
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
Landscapes
- Wire Bonding (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57136948A JPS5927539A (ja) | 1982-08-05 | 1982-08-05 | サーマルヘッド用icチップのパッド配列方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57136948A JPS5927539A (ja) | 1982-08-05 | 1982-08-05 | サーマルヘッド用icチップのパッド配列方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2300174A Division JPH03175060A (ja) | 1990-11-05 | 1990-11-05 | Icチップ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5927539A true JPS5927539A (ja) | 1984-02-14 |
| JPH0129060B2 JPH0129060B2 (da) | 1989-06-07 |
Family
ID=15187254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57136948A Granted JPS5927539A (ja) | 1982-08-05 | 1982-08-05 | サーマルヘッド用icチップのパッド配列方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5927539A (da) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03175060A (ja) * | 1990-11-05 | 1991-07-30 | Ricoh Co Ltd | Icチップ |
| JPH05175274A (ja) * | 1991-12-26 | 1993-07-13 | Matsushita Electric Ind Co Ltd | チップ部品 |
| US5670802A (en) * | 1995-03-30 | 1997-09-23 | Nec Corporation | Semiconductor device |
| US5781220A (en) * | 1994-07-29 | 1998-07-14 | Kyocera Corporation | Thermal head |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5878786A (ja) * | 1981-11-05 | 1983-05-12 | Toshiba Corp | 感熱記録装置 |
-
1982
- 1982-08-05 JP JP57136948A patent/JPS5927539A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5878786A (ja) * | 1981-11-05 | 1983-05-12 | Toshiba Corp | 感熱記録装置 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03175060A (ja) * | 1990-11-05 | 1991-07-30 | Ricoh Co Ltd | Icチップ |
| JPH05175274A (ja) * | 1991-12-26 | 1993-07-13 | Matsushita Electric Ind Co Ltd | チップ部品 |
| US5781220A (en) * | 1994-07-29 | 1998-07-14 | Kyocera Corporation | Thermal head |
| US5670802A (en) * | 1995-03-30 | 1997-09-23 | Nec Corporation | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0129060B2 (da) | 1989-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5402255A (en) | Liquid crystal panel module and tape carrier package for liquid crystal driver IC | |
| US7335977B2 (en) | Semiconductor chip mounting arrangement | |
| MY126218A (en) | Electronic package with high density interconnect and associated methods. | |
| JPS5927539A (ja) | サーマルヘッド用icチップのパッド配列方法 | |
| DE69015847D1 (de) | Aufzeichnungsgerät und Aufzeichnungskopfsubstrat für die Verwendung darin. | |
| EP1041618A4 (en) | SEMICONDUCTOR ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF, CIRCUIT BOARD AND ELECTRONIC SYSTEM | |
| JPH03175060A (ja) | Icチップ | |
| US4516136A (en) | Thermal print head | |
| JP3914649B2 (ja) | 半導体装置 | |
| JPS5878786A (ja) | 感熱記録装置 | |
| JP2564591B2 (ja) | 電子部品駆動装置 | |
| JPS6290948A (ja) | 半導体集積回路装置 | |
| CN223486510U (zh) | 双向缓冲器的版图结构 | |
| JPS6393125A (ja) | 半導体集積回路 | |
| JPH02292064A (ja) | Ledプリントヘッド | |
| JPS6124995B2 (da) | ||
| JP2823031B2 (ja) | 平面実装構造 | |
| JPS6334161A (ja) | 感熱記録ヘツド駆動用ic | |
| JPH0349255A (ja) | 半導体集積回路の封止方式 | |
| KR100499152B1 (ko) | 테이프 캐리어 패키지 구조 | |
| JP3408173B2 (ja) | 多チャンネル駆動集積回路 | |
| JPS63191130A (ja) | 液晶表示素子 | |
| JPH09234897A (ja) | ヘッド駆動用ic | |
| JPS58184735A (ja) | 集積回路チツプ | |
| JPS6380622A (ja) | 半導体集積回路装置 |