JPS5929052U - 集積回路装置 - Google Patents

集積回路装置

Info

Publication number
JPS5929052U
JPS5929052U JP1982124762U JP12476282U JPS5929052U JP S5929052 U JPS5929052 U JP S5929052U JP 1982124762 U JP1982124762 U JP 1982124762U JP 12476282 U JP12476282 U JP 12476282U JP S5929052 U JPS5929052 U JP S5929052U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
chips
case
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982124762U
Other languages
English (en)
Inventor
竹森　清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1982124762U priority Critical patent/JPS5929052U/ja
Publication of JPS5929052U publication Critical patent/JPS5929052U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来方式の１ケース１チツプ構造の大規模集積
回路装置を示す図であり、第２図は本考案の実施例によ
る１ケース２チツプの例の構造を示す図である。

Claims (2)

    【実用新案登録請求の範囲】
  1. （１）　　予め用意された下地に配線処理を加えて作る
    マスタースライス方式の集積回路装置において、１個の
    ケースに複数個のチップを収容することを特徴とする集
    積回路装置。
  2. （２）各々の前記チップ同じで回路上接続される部分を
    、ケース内で各々の前記チップの外部接続用バット同し
    で接続することを特徴とする実用新案登録請求の範囲第
    （１）項記載の集積回路装置。
JP1982124762U 1982-08-18 1982-08-18 集積回路装置 Pending JPS5929052U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982124762U JPS5929052U (ja) 1982-08-18 1982-08-18 集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982124762U JPS5929052U (ja) 1982-08-18 1982-08-18 集積回路装置

Publications (1)

Publication Number Publication Date
JPS5929052U true JPS5929052U (ja) 1984-02-23

Family

ID=30284286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982124762U Pending JPS5929052U (ja) 1982-08-18 1982-08-18 集積回路装置

Country Status (1)

Country Link
JP (1) JPS5929052U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63103154A (ja) * 1986-10-17 1988-05-07 元旦ビユーティ工業株式会社 横葺き屋根の葺き上げ方法
JPH06136886A (ja) * 1992-10-23 1994-05-17 Misawa Homes Co Ltd 屋根の施工方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63103154A (ja) * 1986-10-17 1988-05-07 元旦ビユーティ工業株式会社 横葺き屋根の葺き上げ方法
JPH06136886A (ja) * 1992-10-23 1994-05-17 Misawa Homes Co Ltd 屋根の施工方法

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