JPS5929072U - Housing for optical transceiver module - Google Patents

Housing for optical transceiver module

Info

Publication number
JPS5929072U
JPS5929072U JP12264982U JP12264982U JPS5929072U JP S5929072 U JPS5929072 U JP S5929072U JP 12264982 U JP12264982 U JP 12264982U JP 12264982 U JP12264982 U JP 12264982U JP S5929072 U JPS5929072 U JP S5929072U
Authority
JP
Japan
Prior art keywords
transceiver module
optical transceiver
case
housing
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12264982U
Other languages
Japanese (ja)
Inventor
敏夫 深堀
康一 阿部
樟山　裕幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP12264982U priority Critical patent/JPS5929072U/en
Publication of JPS5929072U publication Critical patent/JPS5929072U/en
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例の光送受信モジュール用筐体
の正断面図、第２図は同じく第１図の筐体に変形を生じ
た場合の説明図である。 １：レセプタクル、２：筐体、３：送受信素子、４：セ
ラミック基板、５：ヒートシンク板、６：接合支持部、
７１Ｊ−ド線。FIG. 1 is a front sectional view of a housing for an optical transceiver module according to an embodiment of the present invention, and FIG. 2 is an explanatory view of the housing shown in FIG. 1 when deformed. 1: Receptacle, 2: Housing, 3: Transmission/reception element, 4: Ceramic substrate, 5: Heat sink plate, 6: Joint support part,
71J-do line.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 板金成形された筐体内に、前記筐体との間にヒートシン
ク板を介し、ＩＣ回路を有するセラミック基板が設けら
れる光送受信モジュール用筐体において、前記ヒートシ
ンク板が前記筐体に一点支持されていることを特徴とす
る光送受信モジュール用筐体。　　　　゛In the case for an optical transceiver module, in which a ceramic substrate having an IC circuit is provided in a case made of sheet metal with a heat sink plate interposed between the case and the case, the heat sink plate is supported at one point by the case. A casing for an optical transceiver module characterized by:゛
JP12264982U 1982-08-12 1982-08-12 Housing for optical transceiver module Pending JPS5929072U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12264982U JPS5929072U (en) 1982-08-12 1982-08-12 Housing for optical transceiver module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12264982U JPS5929072U (en) 1982-08-12 1982-08-12 Housing for optical transceiver module

Publications (1)

Publication Number Publication Date
JPS5929072U true JPS5929072U (en) 1984-02-23

Family

ID=30280266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12264982U Pending JPS5929072U (en) 1982-08-12 1982-08-12 Housing for optical transceiver module

Country Status (1)

Country Link
JP (1) JPS5929072U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06288090A (en) * 1993-04-05 1994-10-11 Kajima Corp Structure for mounting form

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06288090A (en) * 1993-04-05 1994-10-11 Kajima Corp Structure for mounting form

Similar Documents

Publication Publication Date Title
JPS6316492U (en)
JPS598106U (en) Optical sensor mounting structure
JPS6355966A (en) Heat radiator of integrated circuit module
JPS6350853Y2 (en)
JPS5972739U (en) heat dissipation fin
JPS59145045U (en) Transistor fixing device
JPS602841U (en) semiconductor mounting board
JPS5981041U (en) Integrated circuit heat dissipation device
JPS5895656U (en) Hybrid integrated circuit device
JPS5846456U (en) Mounting structure of heat sink
JPS59177957U (en) radiator
JPS5878676U (en) Ceramic wiring device
JPS5811287U (en) Printed board mounting device
JPS59146981U (en) small circuit module
JPS5874349U (en) Heat exchanger plate with terminal board
JPS5956753U (en) integrated circuit package
JPS59161458U (en) plate heating element
JPS5873548U (en) Temperature fuse mounting device
JPS5952641U (en) Heat dissipation device for semiconductor package
JPS59195752U (en) hybrid integrated circuit
JPS59173395U (en) Heat dissipation device for electronic components
JPS5895650U (en) Hybrid integrated circuit device
JPS6039295U (en) printed wiring board
JPS609232U (en) Hybrid integrated circuit device
JPS5972742U (en) radiator