JPS5932077B2 - How to ground the metal core - Google Patents
How to ground the metal coreInfo
- Publication number
- JPS5932077B2 JPS5932077B2 JP10620579A JP10620579A JPS5932077B2 JP S5932077 B2 JPS5932077 B2 JP S5932077B2 JP 10620579 A JP10620579 A JP 10620579A JP 10620579 A JP10620579 A JP 10620579A JP S5932077 B2 JPS5932077 B2 JP S5932077B2
- Authority
- JP
- Japan
- Prior art keywords
- metal core
- grounding
- land
- core
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】
本発明は例えば重量部品等塔載する電子回路パッケージ
に用いる金属コア印刷配線板の製造工程において特に金
属芯(以下コアと呼ぶ)の接地方法に関す。DETAILED DESCRIPTION OF THE INVENTION The present invention particularly relates to a method of grounding a metal core (hereinafter referred to as a core) in the manufacturing process of a metal core printed wiring board used in an electronic circuit package on which heavy components are mounted, for example.
その意図するは関与する製作プロセスの作業性を高め生
産能力の向上をはかるものである。The intention is to improve the workability of the manufacturing processes involved and improve production capacity.
従来金属コア印刷配線板は一般の印刷回路用銅張積層板
に比し前記の如き機械的特性に優れ、又鉄板等のコアに
よりリレー等磁気回路を具備する部品の補助磁気回路を
も形成しうる等の利点があり、リレー等集積して実装に
なるところでは賞用されている。該配線板加工は鉄等の
コア部材を適宜形状・寸法にプレス抜きし及びまたスル
ーホールの孔加工も同時に形成し、しかるのち該部材表
面をエポキシ系とかアクリル系とかの樹脂層コート(絶
縁コート)により必要とするプリント板絶縁並に耐圧機
能を取得している。Conventional metal core printed wiring boards have superior mechanical properties as mentioned above compared to general copper-clad laminates for printed circuits, and can also form auxiliary magnetic circuits for parts equipped with magnetic circuits such as relays with cores such as iron plates. It has advantages such as water resistance, and is widely used in places where it is integrated and implemented, such as relays. The wiring board processing involves pressing a core member such as iron into an appropriate shape and size, and forming through-holes at the same time.Then, the surface of the member is coated with an epoxy or acrylic resin layer (insulating coat). ), it has obtained the necessary printed board insulation and voltage resistance functions.
そして該絶縁層の面上に無電解めつき等により銅層付着
をなし回路パタニングがされることになる。しかして前
記回路パターンの特定点をアースするには従来、スルー
ホール加工によりそのホール壁面で金属コアと導通せし
めるとか又場所によつては予じめ形成になるスルーホー
ル部に適宜径のタップネジをネジ込んで前記コアと導通
せしめる等していた。Then, a copper layer is deposited on the surface of the insulating layer by electroless plating or the like, and circuit patterning is performed. However, in order to ground a specific point in the circuit pattern, conventional methods include machining a through hole to make the hole wall conductive to the metal core, or, depending on the location, inserting a tap screw of an appropriate diameter into the pre-formed through hole. It was screwed in to establish electrical continuity with the core.
か様な金属コアの接地の一実施例を第1図の断面図に示
す。図に於て1は金属コア、2は絶縁コート、3は所謂
スルーホール加工部で基板の表裏両面の導通のために設
けるランド部(孔を利用し部品取付をなすこともある)
、4は該部処に接地のため埋込むタップネジで、該ネジ
4装着後ネジ先端とランド導体3との間に半田ブリッジ
層5を形成して接地回路としていた。An example of grounding a metal core is shown in cross-section in FIG. In the figure, 1 is a metal core, 2 is an insulating coat, and 3 is a so-called through-hole processing section, which is a land section provided for continuity between the front and back sides of the board (the holes may also be used to attach components).
, 4 is a tap screw embedded in the part for grounding, and after the screw 4 is installed, a solder bridge layer 5 is formed between the screw tip and the land conductor 3 to form a grounding circuit.
尚タップネジを用いない接地も当然あり、この場合ホー
ル部内壁に付着した絶縁コートを完全除去のため接地接
続前にタップ立てなりして行なう等金属コアの接地は細
密な作業を要しその工数も軽視でさない状況であつた。
本発明の目的は上記問題点を解決したものでコア接地の
作業性の高い以下提案になるものである。その特徴とす
るところはバーリング部周辺にランドを設け、該ランド
とパーリング端露出金属とを半田付け手段により接続す
る金属コアの接地方法にある。以下第2図の本発明にな
るプロセス図に従がいこれを説明する。図中前記と同一
番号の付けられたところは従来同様の機能部所である。Of course, there are also grounding methods that do not use tapped screws, and in this case, grounding the metal core requires detailed work, such as tapping the hole before connecting to the ground to completely remove the insulating coat that has adhered to the inner wall of the hole. It was a situation that I cannot take lightly.
The object of the present invention is to solve the above-mentioned problems and to provide the following proposal that improves the workability of core grounding. Its feature lies in the method of grounding the metal core by providing a land around the burring part and connecting the land to the exposed metal at the end of the burring by soldering means. This will be explained below according to the process diagram of the present invention shown in FIG. In the figure, the same numbers as above indicate the same functional parts as before.
イ図はバーリング加工になる孔6を示し、図示の如く例
えばコア板裏側に強制的に突起のエツジ変形部7がコア
製作初期ブレス加工等により形成せしめられる。Figure A shows a hole 6 to be burred, and as shown in the figure, for example, an edge deformation part 7 of a protrusion is forcibly formed on the back side of the core plate by pressing or the like during the initial production of the core.
しかるのち前記部材の両面に絶縁コート2の付着、次い
で導体層の銅等からなるランド部生成3の付加形成の状
態を口図に示す。仝ハ図はバーリング端面8の絶縁コー
トが除去されてコア金属表面が露出された状態である。
該絶縁コート除去は端的にはヤスリがけして取り除くか
或は局部的サンドプラストして除去するものである。仝
二図はハ図状態になる回路形成体をソルダレジスト塗布
等してフローソルダリング等により半田付け5をして金
属コアの接地接続が完了した状態である。The diagram shows the state in which an insulating coat 2 is then applied to both surfaces of the member, and then a land portion 3 made of copper or the like as a conductive layer is additionally formed. The figure shows a state in which the insulating coat on the burring end face 8 has been removed and the core metal surface has been exposed.
The insulating coat is simply removed by sanding or by localized sandplast. Figure 2 shows the state in which the circuit forming body shown in figure C is coated with a solder resist, soldered 5 by flow soldering, etc., and the grounding connection of the metal core is completed.
本発明になる前記接地方法によれば従来のホール壁面で
金属コアと接続あるいはタツプネジによる接続に比し接
地作業が簡易となり作業工数の削減に寄与するところ大
なるものがある。According to the grounding method of the present invention, the grounding work is simpler than the conventional connection to the metal core on the hole wall surface or the connection using a tap screw, which greatly contributes to a reduction in the number of work steps.
又目視による接続性能のチエツクも容易になされる等そ
の実用的効果大なるものがある。It also has great practical effects, such as the ability to easily check the connection performance visually.
第1図は従来の金属コア接地の一実施例を又第2図は本
発明になる金属コアの半田付け接地方法を示す断面図で
ある。
1・・・・・・金属コア、2・・・・・・絶縁コート、
3・・・・・・銅はく等からなるランド、5・・・・・
・半田付け、6・・・・・・バーリング加工になる孔。FIG. 1 is a sectional view showing an example of a conventional metal core grounding method, and FIG. 2 is a sectional view showing a metal core soldering grounding method according to the present invention. 1...Metal core, 2...Insulating coat,
3...Land made of copper foil, etc., 5...
・Soldering, 6...Hole to be burred.
Claims (1)
ち絶縁コート層と更に銅はく等付着してなる回路パター
ン形成を順次行なう金属コア印刷配線板の製造工程に於
て、前記バーリング部周辺にランドを設け、該ランドと
バーリング端露出金属とを半田付け手段により接続する
ことを特徴とする金属コアの接地方法。1. In the manufacturing process of a metal core printed wiring board, in which a metal core is burred in advance, and then an insulating coat layer and a circuit pattern formed by further adhering copper foil, etc. are sequentially formed, the area around the burring part is A method for grounding a metal core, comprising providing a land and connecting the land and exposed metal at the end of the burring by soldering means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10620579A JPS5932077B2 (en) | 1979-08-21 | 1979-08-21 | How to ground the metal core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10620579A JPS5932077B2 (en) | 1979-08-21 | 1979-08-21 | How to ground the metal core |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5630781A JPS5630781A (en) | 1981-03-27 |
| JPS5932077B2 true JPS5932077B2 (en) | 1984-08-06 |
Family
ID=14427651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10620579A Expired JPS5932077B2 (en) | 1979-08-21 | 1979-08-21 | How to ground the metal core |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5932077B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7683266B2 (en) | 2005-07-29 | 2010-03-23 | Sanyo Electric Co., Ltd. | Circuit board and circuit apparatus using the same |
| JP2010093292A (en) * | 2005-07-29 | 2010-04-22 | Sanyo Electric Co Ltd | Circuit device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58134060U (en) * | 1982-03-01 | 1983-09-09 | ミツミ電機株式会社 | motor |
| JPS63271996A (en) * | 1987-04-28 | 1988-11-09 | Fanuc Ltd | Printed board for large current |
-
1979
- 1979-08-21 JP JP10620579A patent/JPS5932077B2/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7683266B2 (en) | 2005-07-29 | 2010-03-23 | Sanyo Electric Co., Ltd. | Circuit board and circuit apparatus using the same |
| JP2010093292A (en) * | 2005-07-29 | 2010-04-22 | Sanyo Electric Co Ltd | Circuit device |
| US8166643B2 (en) | 2005-07-29 | 2012-05-01 | Sanyo Electric Co., Ltd. | Method of manufacturing the circuit apparatus, method of manufacturing the circuit board, and method of manufacturing the circuit device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5630781A (en) | 1981-03-27 |
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