JPS5932091Y2 - inductance element - Google Patents

Description

[Detailed Description of the Invention] The present invention aims to provide a flat-shaped inductance element that is inexpensive and easy to manufacture.

The frequencies shown in Figures 1 and 2 are from KHz to several 100 KHz.
This is an example of a conventional flat chock used in the frequency band of 1, in which two E-shaped cores 1 and 2 are butted against each other, and a coil 3 is wound around the central leg.

In order to make the element flat, it is necessary to make the length A large and the thickness B small.

However, a ferrite core in which A is large and B is small tends to be deformed during sintering, and even after it is made into a product, it has the disadvantage that it can break if handled improperly.

In addition, since the winding width of the coil 3 becomes large, when multiple winding is performed, the number of coils that can be applied to one winding machine is small, resulting in a relatively high number of man-hours.

The present invention aims to provide an inductance element free from the above-mentioned drawbacks, and embodiments of the present invention will be described below with reference to the drawings.

As shown in FIGS. 3, 4, and 5, spiral coils 5 and 6 are made on an insulating substrate 4 using metal foil such as copper foil.

A hole 7, 8 is formed in the center of each coil 5, 6, and the hole 7.
An amorphous magnetic tape 9 having a magnetostriction coefficient of zero is wound around the insulating substrate 4 a required number of times through the tape 8 .

The insulating substrate 4 may be a laminated printed board made of epoxy resin or the like, or a flexible printed board made of polyimide film, polyester film, or the like.

The amorphous magnetic tape 9 has magnetic properties that do not change even if mechanical strain is applied to it, such as Fe4.4CO70, Fe4.4CO70,
6S112.5 B 12.5 is used.

The thickness is approximately 30μ.

Insulation may be maintained by providing an insulating film between the coils 5 and 6 and the amorphous magnetic tape 9.

If the corners of the holes 7 and 8 are chamfered, the outermost layer of the film 9 will be wedged into the substrate 4 and the film will be stably attached, and no abnormal noise will be generated due to vibration.

Further, as shown in FIGS. 6 and 7, a flexible printed circuit board is used as the insulating substrate 4, which is folded back and amorphous films 9 a , 9 b , 9 C, and 9 d are passed through the holes.
Wrap it around the substrate 4.

In this embodiment, four amorphous films are provided.

In this case, the coupling between the coils 5 and 6 can be improved and a better transformer can be obtained.

As described above, the inductance element of the present invention has a spiral coil formed on an insulating substrate using metal foil, a hole is provided in the insulating substrate at the center of the coil, and an amorphous magnetic material with a magnetostriction coefficient of zero is inserted into the hole. Since the foil film is passed through and wrapped around the substrate, a flat inductance element can be obtained, and since it does not require a large core or coil unlike conventional methods, it can be manufactured easily and at low cost. .

[Brief explanation of drawings]

1 and 2 are a plan view and a side view of a conventional inductance element, and FIGS. 3, 4, and 5 are a plan view and a side view of an inductance element according to an embodiment of the present invention,
FIG. 6 and FIG. 7 are a plan view and a sectional side view of an inductance element in the same embodiment. 4... Insulating board, 5, 6... Coil,
7, 8... Hole, 9, 9a, 9 b, 9 C
, 9d...Amorphous magnetic foil film.

Claims (1)

[Scope of utility model registration request] A coil is formed using metal foil in a spiral shape on an insulating substrate.
A hole is made in the insulating substrate part at the center of this coil,
An inductance element formed by winding an amorphous magnetic foil tape with a magnetostrictive coefficient of zero around the insulating substrate through the hole.