JPS5932194A - Manufacturing method of electronic component mounting body - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]

The present invention relates to a ceramic substrate, particularly a ceramic substrate incorporating a resistive element tray, and a manufacturing method thereof. Conventionally, in the case of incorporating a resistance element (also simply called resistance) into a green sheet, (1) A conductor paste (fc1) with a low firing rate is applied to a ceramic board obtained by firing with lean sheet reducing
1! :Eha copper paste] Method of forming η layer resistor by baking in oxidizing low granite atmosphere after printing, (2),
Molybdenum (40)-manganese (Mn), Ihattansten (W), etc. are plated on the surface of a conductive layer of a ceramic plate obtained by firing the sheet in a steel-making process.

[After applying gold plating, carbon paste is applied to the resistor forming area, and a method of forming a resistor by firing is known)1-. However, the former method uses a ceramic plate (TC4) after firing.
Since conductor paste is printed, the conductor paste tends to ooze and spread on the ceramic plate, making it difficult to create precise patterns. Therefore, the pattern of the connection land for the face town bone chip is also detailed and blank. φB, the Jk ib'4 of the chip is poor, 'If this, conductor paste (011 paste) 1: f :// 5th τ
It has the disadvantage that the resistance of the wiring layer is high due to the low voltage, and the 'I' Ell is not well-developed, resulting in a low bonding M: when mounting the chip. ! F1, f (6 sides of the conductor layer of the stand covered with gold plating film, oxidation 4, resistance 1, type JJy, when the IC conductor layer oxidizes 〒+Vj IL'Tru)j method Tb, There is a cape point where f, high quality metal cost 7/'1i4 < l, and the resistance by carbon paste has the drawback of low reliability. Our goal is to provide high-quality resistive elements (resistors) on ceramic substrates at low prices. Another object of the present invention is to provide a method for manufacturing a lamic substrate containing a resistor element (10) and a method for manufacturing a lamic substrate that can manufacture a precise conductor layer pattern. Furthermore, the object of the present invention is to provide a ceramic substrate with a low resistance value and good solder wettability in a ceramic substrate having a resistive element (layers and corners). In order to achieve this purpose, the present invention prints a conductor base NrI')' on the p-plane of a green sheet in a desired pattern, and then bakes it in an atmosphere of reducing 51F to produce a ceramic sheet having a conductor base. 4 pieces of work to shape the board, 7 pieces of the above-mentioned ceramic plate (at least the surface portion of the conductive layer exposed on the surface that will become the resistance connection terminal), the layer and the crown, and the front 6 pieces of the ceramic plate. The resistor is formed by printing a resistor paste containing lanthanum polide on the resistor-forming area and baking it in a neutral (small active) or reducing atmosphere without oxygen to form the resistor. 41'
The present invention will be explained below with reference to Examples. FIG. 1 shows a ceramic base according to one embodiment of the present invention. Flowchart showing the manufacturing method of the board, Figure 2 IRI~l
cl is also a cross-sectional view of the workpiece at each manufacturing stage, Figure 3d
FIG. 1 is a plan view showing a part of the lamic substrate. Ceramic strip f? To make a 4-piece structure, first spread the green sheet, one-piece paste, and insulating paste on the surface, and then pour the conductive paste 2 and insulating paste 3 onto the green sheet 1, as shown in Figure 2 (8). (See the flowchart in FIG. 1) to form the multilayer board 4. Then, this multilayer board 4 is fired in a commonly used H gas atmosphere to form a fired board 5 as shown in Fig. 2, 1b+.
As shown below in FIG. 3, a wiring layer 8 called a pair of resistor connection terminals 63 and component mounting lands 7 is provided over the inside and surface of the sintered plate 5. +Stl Nt2 green sheet l is made by adding flux such as silica to alumina powder and forming it into a sheet shape with a binder.
When printing Xl-, the solvent in the Nikleen Sheet ltj paste is easily absorbed, and the sideward bleeding of the printed layer is reduced. Therefore, it is possible to make the printed pattern finer and more precise, and it is also possible to reduce the gaps between the front H component mounting lands 7. 1'lf conductor paste does not deteriorate even depending on the degree of burning of green sheet 1 M□ -Mn, P, l-Ag
. The main ingredient is a highly heat-resistant additive such as W. Therefore, the 111M of the component mounting land 7 is 100/1m, the pitch is 1.0077m, and the conventional value of 7n is 200,
It becomes significantly smaller than #m. In the example, V is connected to the component mounting land 7 by connecting portion 9 made of conductive paste embedded in the through hole in the 414 paste layer 2 inside the multilayer board 4. However, it may be extended on the multilayer board 4 and connected to a conductive paste layer having a constant Qi. Further, each conductive paste layer has a thickness of, for example, 20 μm and 1ν of 44 degrees, the thickness of the green sheet 1 is approximately 100 μm, and the green sheet 1 has a thickness of, for example, II 1361- of 10071 m.
I am f(7). Finally, this layer 4 is subjected to the usual firing process, T2Wachi 1■
Original t'i, multi': Baked in the surrounding air T2, hardened. Conductor base 1 no r/iu, 7! f, body layer 1 (B: f
xsu, ri II -y 'y -)1sr and 11・1・
4 paste layers, integrated 7'1. ceramic plate 11
becomes. Tsu@'&'? A copper plating film 12 is formed on the surface of the ceramic plate 11 with a thickness of about 2 μm [1-].
See Figure 2fbl]. As shown in Figure 1cl, lanthanumolide (La)
After printing a resistive paste mainly composed of
Ebisu (801,1~90 (l C-I: 50 minutes sushi,
Resistance (tit resistance element) 13y) Dv. This 1+
(I B 6 has been developed and commercially available as an Ia anti-paste that can be connected to a copper film by printing, and it has been reported that it can be connected to a copper plating film by ζ. tl
(Is it possible to make a connection? This has been confirmed through experiments. This LaB6 can be fired in an atmosphere surrounded by an oxygen-containing inert (neutral) gas or a reduced gas. As a result, when resistance is formed,
Oxidation of the conductor layer 10 made of W or the like can be prevented, and no deterioration of the four-layer IO occurs. In such a ceramic substrate 14, solder 15 is applied to the component mounting land 7 on the surface and the IC chip 16 is fixed by face-down Φ bonding. The solder 15 is previously formed in the form of a bump electrode on the IT pole of the IC chip 1G. According to this embodiment, printing of the conductive paste for forming the entire conductor layer is performed on a hygroscopic green sheet. As a result, the solvent in the paste is printed onto the green sheet without bleeding, and fine and rough patterning becomes possible. Therefore, when mounting components such as IC chips by face-down bonding, it is possible to reduce the size of the component mounting land and narrow the pitch between lands, allowing each land to properly correspond to the bump ML pole of the component. Implementation becomes possible. In addition, the entrance surface of the wiring layer is made of copper metal with extremely low resistance.
Since it is full at 714%, the resistance value of the wiring layer is 1. becomes smaller. In addition, since the copper plating film is pure copper without any natural glass frit (silica), etc., it has good #S resistance to "l'llll" used when mounting IC chips. Therefore, the high-reliability mounting becomes the internal oil.In addition, lanthanumolide forms a high-quality resistance compared to conventional carbon resistance.In addition, lanthanumolide is fired in an atmosphere that does not contain oxygen. Since this can be done, there is no need to cover the wiring layer with expensive gold as in the past, and at least an inexpensive cap can be used only at the connection with lanthanumolide.
It will get better if you look. This solidification helps reduce costs. In addition, the steel plating is only formed on the resistor 4 light connection terminal part of the wiring layer for connection with lanthanumolide, but it is not necessary to use it.
The IL is provided over the entire length of the wiring layer, as in the previous photo (/L
It becomes possible to reduce the resistance of the men's layer by 1 ut and increase the wettability of half 11 JJ by 1 ut. Note that the present invention is not limited to the above embodiments. As described above, according to the present invention, it is possible to provide at a low cost a ceramic substrate having a resistive element of component 5q which is precise, has a small resistance value, and has excellent wettability with solder.

[Brief explanation of drawings]

FIG. 1 is a flowchart showing a method for manufacturing a lamic substrate according to an embodiment of the present invention; FIG. 2 is a cross-sectional view of a workpiece at each manufacturing stage; FIG. It is a top view showing 1... green sheet, 2... conductor paste, 3...
... Insulating paste, 5... Baking board, 6... Resistance connection terminal, 7... Component mounting land, 8... Wiring +vi! Layer, 10... 4 body layers, 12... Copper plating film, 13...
・Resistor, 14...Ceramic board, 15...Solder,
16...IC chip.

Claims (1)

[Claims] 1. A ceramic substrate having a conductor layer and a resistor connected to the conductor layer, wherein the resistor is made of lanthanide, and the resistor is formed partially or entirely in the conductor layer. A ceramic substrate with a copper plated film connected to the conductor (t4) and b (7). 2 Previous 6 [-f of the conductor layer (B is a land for mounting parts) Lr!fN'f ii'J
One track mink substrate 1 as described in Kaida 1. 3. Apply one paste to the green sheet containing the bacteria I, print it in the desired pattern, and bake it at a temperature of 1111.
Rushi's mink board? The process of forming, 11 rt+, the conductor layer applied to the y side on the p-plane of the ceramic plate, 2 at least the surface portion that will become the resistance connection ΔIA element is covered with a copper plating layer. Resistance formation process 444: A resistor paste containing lanthanumolide as a main component is printed, and the neutral base is fired in a reducing atmosphere to form a resistor. This is the Hj”lx method for seven ramic substrates. 4. The step edge method for a ceramic substrate according to item 3, characterized in that a part of the conductor layer is a land for mounting components.