JPS5939963U - 接着剤付き積層板 - Google Patents
接着剤付き積層板Info
- Publication number
- JPS5939963U JPS5939963U JP13683482U JP13683482U JPS5939963U JP S5939963 U JPS5939963 U JP S5939963U JP 13683482 U JP13683482 U JP 13683482U JP 13683482 U JP13683482 U JP 13683482U JP S5939963 U JPS5939963 U JP S5939963U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive laminate
- laminate
- adhesive
- adhesive layer
- recorded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
図面は接着剤付き積層板の断面図を示し、第１図、第４
図、第５図は本考案のもの、第２図、第３図は従来のも
のを示す。 符号の説明、１・・・・・・積層板、２・・・・・・第
一の接着剤層、３・・・・・・第二の接着剤層、４・・
・・・・接着剤層。
図、第５図は本考案のもの、第２図、第３図は従来のも
のを示す。 符号の説明、１・・・・・・積層板、２・・・・・・第
一の接着剤層、３・・・・・・第二の接着剤層、４・・
・・・・接着剤層。
Claims (1)
- 積層板の表面に第一の接着剤層を設け、その表面に化学
粗化容易な第二の接着剤層を設けた接着剤付き積層板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13683482U JPS5939963U (ja) | 1982-09-09 | 1982-09-09 | 接着剤付き積層板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13683482U JPS5939963U (ja) | 1982-09-09 | 1982-09-09 | 接着剤付き積層板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5939963U true JPS5939963U (ja) | 1984-03-14 |
Family
ID=30307536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13683482U Pending JPS5939963U (ja) | 1982-09-09 | 1982-09-09 | 接着剤付き積層板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5939963U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12064845B2 (en) | 2021-01-21 | 2024-08-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Formulations for chemical mechanical polishing pads with high planarization efficiency and CMP pads made therewith |
| US12064846B2 (en) | 2021-01-21 | 2024-08-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Formulations for high porosity chemical mechanical polishing pads with high hardness and CMP pads made therewith |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5497779A (en) * | 1978-01-19 | 1979-08-02 | Matsushita Electric Industrial Co Ltd | Printed circuit board |
-
1982
- 1982-09-09 JP JP13683482U patent/JPS5939963U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5497779A (en) * | 1978-01-19 | 1979-08-02 | Matsushita Electric Industrial Co Ltd | Printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12064845B2 (en) | 2021-01-21 | 2024-08-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Formulations for chemical mechanical polishing pads with high planarization efficiency and CMP pads made therewith |
| US12064846B2 (en) | 2021-01-21 | 2024-08-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Formulations for high porosity chemical mechanical polishing pads with high hardness and CMP pads made therewith |
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