JPS5957745A - Manufacture of aluminum-core metallic foil lined laminated board - Google Patents

Manufacture of aluminum-core metallic foil lined laminated board

Info

Publication number
JPS5957745A
JPS5957745A JP57169364A JP16936482A JPS5957745A JP S5957745 A JPS5957745 A JP S5957745A JP 57169364 A JP57169364 A JP 57169364A JP 16936482 A JP16936482 A JP 16936482A JP S5957745 A JPS5957745 A JP S5957745A
Authority
JP
Japan
Prior art keywords
aluminum
metal foil
plate
foil
aluminum plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57169364A
Other languages
Japanese (ja)
Inventor
光橋 一紀
木村 裕光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP57169364A priority Critical patent/JPS5957745A/en
Publication of JPS5957745A publication Critical patent/JPS5957745A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Laminated Bodies (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は、アルミニウム芯金屑箔張積層板の製造法に関
する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an aluminum core metal scrap foil-clad laminate.

近年、電子機器の小形化、高密度化に伴い、これに使用
されるプリント回路板の基板として要求される性能も、
従来のセルローズ基材、或はガラス布バ材積劇板では対
応出来ない状態1こなりつつある。すなわち、より反り
が少な(、高度な#4 Fi!I性、剛性、然伝導竹を
保持した金属箔張積層板が要求されるようになってきた
。これに対応するため、金屑:こ、入Ji’iJA板、
例えばアルミニウム芯、鉄芯人「1層板か提供され、通
信機器の電源基板或は太陽電池用のセル結句用基板等に
適用され始y)だ。しかるに、従来のアルミニウム芯金
属τ」張積層板は、金11(1箔と表面酸化皮膜層を有
するアルミニウム板との接着強度に問題かあった。この
問題解決の一手段として、銅箔と表面O化皮膜居を有す
るアルミニウム板との間1こ、紙或はカラス布基材に熱
硬化性樹脂を含浸したへ利 (以下テコフィルムと言う
)を1プライ押入して加熱、加圧下に接着する方法か採
られていた。しかし、該方法で製造されたアルミニウム
芯金屑箔張積層板は、前記テコフィルムを使用している
ため、下記の欠点があっlこ。
In recent years, as electronic devices have become smaller and more dense, the performance required for the printed circuit boards used in these devices has also increased.
This situation is becoming increasingly difficult to meet with conventional cellulose substrates or glass fabric panels. In other words, there is a growing demand for metal foil-clad laminates with less warping (high #4 Fi!I properties, rigidity, and conductivity). , entered Ji'iJA board,
For example, aluminum core or iron core metal ``single-layer plates'' have been provided, and have begun to be applied to power supply boards for communication equipment, cell connection boards for solar cells, etc.).However, conventional aluminum core metal τ" There was a problem with the adhesion strength between the gold 11 (1 foil) and the aluminum plate with a surface oxide film layer.As a way to solve this problem, we tried to bond between the copper foil and the aluminum plate with a surface oxide film layer. 1) A method was used in which one ply of thermosetting resin-impregnated fiber (hereinafter referred to as lever film) was pressed into a paper or glass cloth base material and bonded under heat and pressure. Since the aluminum core metal scrap foil-clad laminate manufactured by this method uses the above-mentioned lever film, it has the following drawbacks.

(1)反りが大きい。(1) Large warpage.

(2)熱伝導性が良くない。(2) Poor thermal conductivity.

(3)  iJ熱性、耐21′口111°がツjる。(3) iJ heat resistance, resistance to 21' opening 111°.

(4)製造工数が大。(4) Manufacturing time is large.

(5)高価である。(5) It is expensive.

本発明は、かかる欠点を改良せんとするものであり、反
りか少なく耐熱性の模れた且安価なアルミニウム芯金屈
箔張積Jjり板を提供することを目的とするものである
。
The present invention aims to improve these drawbacks, and aims to provide an aluminum-core metal bent foil-clad JJ board that is less warped, has good heat resistance, and is inexpensive.

上記の目的を達成するために、本発明は、表面酸化処理
皮膜層を有するアルミニウム板1に接着剤3 (;J金
属箔2を重ね次いて金属箔2側にコム状弾性体4を載置
してなる招成体を鏡面板50間化挿入し、加熱、加圧下
+9前記接着剤3付金属箔2と表面酸化処理皮膜層を有
するアルミニウム板1を接若ぜしめた後冷却して鏡面板
5及び前記ゴム状弾性体4を取り除(工程を経ることを
特徴とする。これ1こよって、金属箔の接骨剤層単独で
テコフィルムを用いることなく表面酸化処理皮膜層を有
するアルミニウム板と金F4箔の接着が可能となり、ゴ
ム状弾性体の加熱、加圧時のクッション力を利用して薄
い金属箔接着剤層と一す面酸化処理皮膜層を有するアル
ミニウム板の間に空気層を残すことなく杼めて良好な接
7°1が行なわれる。
In order to achieve the above object, the present invention overlaps an adhesive 3 (; The formed body is inserted into a mirror plate 50, and the metal foil 2 with the adhesive 3 and the aluminum plate 1 having the surface oxidized film layer are bonded together under heating and pressure, and then cooled to form a mirror plate. 5 and the rubber-like elastic body 4 is removed (characterized by passing through a process. 1) Therefore, the metal foil bone cement layer alone can be used as an aluminum plate having a surface oxidized film layer without using a lever film. Gold F4 foil can be bonded, and an air layer is left between the thin metal foil adhesive layer and the aluminum plate, which has an oxidized film layer on one side, by utilizing the cushioning force of the rubber-like elastic body when heated and pressurized. A good contact 7°1 is made without any trouble.

本発明を実施するに当り、表面酸化処理皮膜層を有する
アルミニウム板1は、例えば硫酸処理により表面1こ酸
化皮膜を形成しその厚さが少くとも6μ以」ニ有するも
のが望ましい。6μ以下の場合、金属箔との接着力不足
、金属箔をエツチングして回路板として使用する場合の
絶縁性低下、エツチング液によるアルミニウム板の侵食
等の問題かある。金属箔2、例えば銅箔は、市販の銅張
積層板用のものか使用出来、アルミニウム板1との接着
面には一般フエノール樹脂積層板に使用する接着剤3、
例えはニトリル変性フェノール樹脂を20〜30μ厚さ
に塗布したものである。金属箔2の表面iこ接するコム
状弾性(木4は、加熱、加圧下に於ても金属箔2に付着
せず且表面が平滑で金属箔2にシワや凹凸を発生させず
、加熱加圧下Iこ於て均一な圧力分布を(−する本j質
を選択する必要があり、特にシリコンコムシート、ブチ
ルゴムシー1・等が適当である。また、コム状弾性体4
の厚さは、成形時の熱伝導性、コスト等を考慮すれば0
5〜2%か望ましい。05%以下ではコム状弾性体のク
ッション力か不充分となり、得られるアルミニウム芯金
屑箔張積層板の金属箔剥離強度が不足し且耐半田性の不
足をきたす恐れがある。一方2%を越えると加!!II
+、成形時の熱伝導か低下し、得られるアルミニウム芯
金属箔張積層板の反りが大きくなる危険がある。
In carrying out the present invention, it is preferable that the aluminum plate 1 having a surface oxidized film layer has an oxidized film formed on its surface by, for example, sulfuric acid treatment and has a thickness of at least 6 μm or more. If it is less than 6μ, there are problems such as insufficient adhesion with metal foil, reduced insulation when etching the metal foil and using it as a circuit board, and corrosion of the aluminum plate by the etching solution. The metal foil 2, for example, copper foil, can be used for commercially available copper-clad laminates, and the adhesive surface with the aluminum plate 1 is an adhesive 3 used for general phenolic resin laminates.
For example, a nitrile-modified phenol resin is coated to a thickness of 20 to 30 μm. The comb-like elasticity (wood 4) that is in contact with the surface of the metal foil 2 does not adhere to the metal foil 2 even under heat and pressure, has a smooth surface, does not cause wrinkles or unevenness on the metal foil 2, It is necessary to select a material that provides a uniform pressure distribution during rolling, and silicone comb sheets, butyl rubber sheets, etc. are particularly suitable.
The thickness is 0 considering thermal conductivity during molding, cost, etc.
5 to 2% is desirable. If it is less than 0.05%, the cushioning force of the comb-like elastic body will be insufficient, and the resulting aluminum cored metal scrap foil-clad laminate may lack metal foil peel strength and solder resistance. On the other hand, if it exceeds 2%, it is added! ! II
+: There is a risk that the heat conduction during molding will decrease and the resulting aluminum core metal foil-clad laminate will become warped.

尚、熱硬化性樹脂積層板の製造法として一般的に知られ
る方法、例えは2枚の鏡面板の間に、接着創刊金属箔を
91 (flしたアルミニウム板を挿入し、鏡面板の外
側にクッション材を置き成形する方法では均一な圧力分
布が得られず且空気を内包した状態となり、金層箔とア
ルミニウム板との接着力か不均一で不充分となり、所望
の特性の積層板は出来ない。
In addition, using a generally known method for manufacturing thermosetting resin laminates, for example, an aluminum plate with a 91 fl. In the method of placing and forming, a uniform pressure distribution cannot be obtained and air is trapped, and the adhesive force between the gold layer foil and the aluminum plate is uneven and insufficient, making it impossible to produce a laminate with the desired characteristics.

次に本発明の詳細な説明する。Next, the present invention will be explained in detail.

実施例 表面に6μ厚の陽枠酸化被IIり処理を施したアルミニ
ウム板(板J’;): 1.5%、アルミニウムの材質
JIS If4000  A1050P−824、表面
処理JIS I(8601−1974にJ゛る)のノ1
側lこ接行剤付35μη削箔を接着剤面がアルミニウム
板に当接するようにmね、次いで該銅箔の表面にコム状
弾性体として10%厚のシリコンコムシートをl′rs
ねたv、、kn面板1’!j!に挿入し、温度160℃
、圧力100 K9/Crtlニc 60分間加11〜
、加圧しノー。その後冷却してシリコンコムシートを取
り除いた。得られたアルミニウム芯1・、j張積R/j
板の性能は第1表の通りであっ1こ。
Example Aluminum plate (plate J';) whose surface was subjected to positive frame oxidation treatment with a thickness of 6 μm (plate J'): 1.5%, aluminum material JIS If4000 A1050P-824, surface treatment JIS I (J to 8601-1974)゛ru) no 1
A 35μη shaved foil with a contact agent on the side was placed so that the adhesive side was in contact with the aluminum plate, and then a 10% thick silicone comb sheet was placed on the surface of the copper foil as a comb-like elastic body.
Neta v,,kn face plate 1'! j! Insert it into the temperature 160℃
, Pressure 100 K9/Crtl 60 minutes 11~
, no pressure. Thereafter, it was cooled and the silicone comb sheet was removed. Obtained aluminum core 1.,j tension R/j
The performance of the board is as shown in Table 1.

比較例1 表面に6μ厚の附棧酸化抜膜処理を施した実施例と同様
のアルミニウム板の片側にフェノール樹脂含浸紙(プリ
プレグ)をlブライ重ねこの上に接着剤付35μ厚の銅
箔を載置し鏡面板を重ねて、実施例と同様の条件で成形
した。得られたアルミニウム芯例張mP板の性能は第1
表の通りであった。
Comparative Example 1 An aluminum plate similar to the example in which the surface was subjected to oxidation removal treatment with a thickness of 6 μm was overlaid with phenol resin-impregnated paper (prepreg) on one side, and a 35 μ-thick copper foil with adhesive was placed on top of this. The mirror plates were placed on top of each other and molded under the same conditions as in the example. The performance of the obtained aluminum core tensile mP board was the first.
It was as shown in the table.

比較例2 表面化6μ厚のlI+、l極部化t、+6膜処理を施し
た実施例と同様のアルミニラl−板を使用し、該アルミ
ニウム・板の片側に接着剤付35μ厚の銅箔を載盾しコ
ム状弾性体を使用することなく直接鏡面板の間に挿入し
て実施例と間柱の条件で加熱、加圧した。得られたアル
ミニウム芯銅張積層板の性能は第1表のiC2りてあっ
尚、反りは、残飛率4096にエツチングした5θOX
 500%の試料片について、第2図に示した寸法aを
測定したものである。耐半田性は、20X20シの試料
片3個の測定値幅で示した。
Comparative Example 2 Using the same aluminum l-plate as in the example, which had been subjected to surface treatment of 6μ thick lI+, l polarization t, and +6 film, a 35μ thick copper foil with adhesive was attached on one side of the aluminum plate. It was directly inserted between mirror plates without using a comb-shaped elastic body and heated and pressurized under the conditions of the example and studs. The performance of the obtained aluminum core copper clad laminate is as shown in iC2 in Table 1, and the warpage is 5θOX etched to a residual fly rate of 4096.
The dimension a shown in FIG. 2 was measured for a 500% sample piece. The solder resistance was shown by the range of measured values of three 20×20 sample pieces.

上述のように、本発明によるアルミニウム芯金属箔張「
1層板は、 (1)回路板としたときの反りが少なく、高密度電子機
器の回路板として実装時の問題はなく、太陽型i11!
のセルを貼付けても反りによるセル破壊の恐れはない。
As mentioned above, the aluminum core metal foil cladding according to the present invention "
The single-layer board has the following characteristics: (1) It has less warpage when used as a circuit board, and there are no problems when mounting it as a circuit board for high-density electronic equipment.
There is no risk of cell destruction due to warping even if cells are pasted.

(2)耐熱、耐半口]性、金屈剥Fil[強さが優れて
おり、回路板シ“1造工稈での熱処理によるツーフレ部
品実装時の回路剥離等の恐れかない。
(2) It has excellent heat resistance, half-opening resistance, and strength, and there is no fear of circuit peeling when mounting two-piece components due to heat treatment on a circuit board.

(3)  また、コム状弾性体は、くり返し使用出来る
ためft’i n板製造工程が簡単で安価なアルミニウ
ム芯金属箔張積層板を提c目11来る等本発明の工業的
価値は極めて大なるものである。
(3) In addition, since the comb-shaped elastic body can be used repeatedly, the industrial value of the present invention is extremely high, such as the introduction of aluminum core metal foil-clad laminates, which have a simple and inexpensive manufacturing process. It is what it is.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明によるアルミニウム芯金R箔張積層板の
製造時のt&成を示す断面図、第2図はfy!層板の反
りの測定位置を示す説明図である。 1はアルミニウム板、2は金属箔、 3は接着剤、4はゴム状弾性体、5は鏡面板特許出願人
FIG. 1 is a cross-sectional view showing the t&formation during manufacturing of the aluminum core R foil-clad laminate according to the present invention, and FIG. 2 is the fy! It is an explanatory view showing the measurement position of the warp of the layered plate. 1 is an aluminum plate, 2 is a metal foil, 3 is an adhesive, 4 is a rubber-like elastic body, and 5 is a mirror plate Patent applicant

Claims (1)

【特許請求の範囲】[Claims] 表面酸化処理皮膜層を有するアルミニウム板に接着剤イ
XJ金属箔を手ね次いで金属箔側にゴム状弾性体を載置
してなる摺成体を鏡面板にはさみ、加熱、加圧下に前記
接着剤イづ金属箔と表面酸化処理皮l14i層を有する
アルミニウム板を接着せしめた後冷却して鏡面板及び前
記コム状弾性体を取り除く工程を経ることを特徴とする
アルミニウム芯金属箔張rI屑板の製造法。
Apply adhesive IXJ metal foil to an aluminum plate having a surface oxidation treatment film layer, then sandwich the slide formed by placing a rubber-like elastic body on the metal foil side between mirror plates, and apply the adhesive under heat and pressure. (i) An aluminum core metal foil clad rI scrap board characterized by a step of bonding a metal foil and an aluminum plate having a surface oxidized skin layer, and then cooling and removing the specular plate and the comb-shaped elastic body. Manufacturing method.
JP57169364A 1982-09-28 1982-09-28 Manufacture of aluminum-core metallic foil lined laminated board Pending JPS5957745A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57169364A JPS5957745A (en) 1982-09-28 1982-09-28 Manufacture of aluminum-core metallic foil lined laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57169364A JPS5957745A (en) 1982-09-28 1982-09-28 Manufacture of aluminum-core metallic foil lined laminated board

Publications (1)

Publication Number Publication Date
JPS5957745A true JPS5957745A (en) 1984-04-03

Family

ID=15885206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57169364A Pending JPS5957745A (en) 1982-09-28 1982-09-28 Manufacture of aluminum-core metallic foil lined laminated board

Country Status (1)

Country Link
JP (1) JPS5957745A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103561546A (en) * 2013-11-10 2014-02-05 大连吉星电子有限公司 Flexible printed circuit board and metal sheet hot-pressing attaching process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103561546A (en) * 2013-11-10 2014-02-05 大连吉星电子有限公司 Flexible printed circuit board and metal sheet hot-pressing attaching process

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