JPS595976Y2 - Lead frame Osae Souchi - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement of a lead frame holding device used during semiconductor wire bonding work.

2. Description of the Related Art During wire bonding work to lead frames in the manufacturing process of semiconductor integrated circuits, LSIs, etc., it is necessary to securely fix the leads to be bonded to a support stand.

Conventionally, for this purpose, a flat holding plate with a rectangular window exposing the tip side of each lead to be bonded was fixed at a fixed position above the lead frame, and the support base on which the lead frame was placed was moved up and down. A device has been used in which a lead frame is sandwiched between a support stand and a holding plate to hold down the leads.

In order to completely hold all the leads with such a holding device, the parallelism between the top surface of the support and the bottom surface of the holding plate, the flatness of each of these surfaces, etc. must be highly accurate, and the leads themselves must be It is necessary that there be no warping, twisting, and thickness discrepancies.

However, it is actually difficult to satisfy all of these conditions with the holding device described above, and there are some leads that cannot be held down sufficiently, which has the disadvantage that it is almost impossible to hold all the leads completely. .

This drawback has a large effect on bonding using ultrasonic energy.

In this case, if the lead is not completely pressed down, the lead itself will vibrate, resulting in a loss of ultrasonic energy and resulting in unsatisfactory bonding.

The present invention provides a lead frame holding device that eliminates the above-mentioned drawbacks by improving the structure of the holding plate.

Hereinafter, the present invention will be explained in detail with reference to drawings of embodiments.

In Fig. 1, 1 is a lead frame, 2 is a guide rail for holding this lead frame at both ends and transferring it to a bonding position, and 3 is a node frame 1 fixedly installed at a bonding position between these guide rails. A heat block serves as a support base, and reference numeral 4 indicates a heater for heating the leads built into this heat block.

Reference numeral 5 designates a presser plate made of an elastic material, which is attached to a holder (not shown) and is movable up and down.

As shown in FIGS. 2A, B, and C, this holding plate is provided with a counterbore portion 5a having a width W slightly wider than the width of the lead frame 1 over its entire length on the lower surface, and a window 5b in the center.
is provided.

A plurality of lead pressing members 5C are protruded inward from this window portion at positions facing each lead 1a of the lead frame shown in FIG. The cracks are provided in a comb-like shape.

Further, the top surface of each lead pressing member 5C on the distal side is sloped toward the distal end, and the distal end protrudes downward to form a lead pressing portion 5d.

In the holding device constructed as described above, the lead frame 1, which is fed on the guide rail 2 and supported by the heat block 3, is moved downwardly by the holding plate 5 as shown in FIG. It is held between the holding plate 5 and the heat block 3.

In this case, as shown in FIG. 3, each lead 1a of the lead frame is individually pressed at a shaded position p by the lead pressing portion 5d of the lead pressing member 5C facing each other.

Moreover, the presser plate 5 is attached to the lead frame 1 with a lead pressing portion 5.
Since the elasticity of the lead holding member 5C is activated by pressure contact only at point d, even if some of the plurality of leads 1a have some warp, twist, or uneven thickness, all the leads 1a are completely held down. It will be done.

In the above embodiment, the heat block that supports the lead frame is fixed and the presser plate is moved up and down to press the leadframe. You can also press it down.

As described above, according to the holding device of the present invention, a holding plate having a plurality of lead holding members divided into comb-teeth shapes is used at a position facing each lead of a lead frame, and the tip of each holding member is The IJ single-pressing part, which is shaped like this, presses each lead to hold down the lead frame, so even if some of the leads in the lead frame have warp, twist, or uneven thickness, each lead will can be sufficiently pressed individually by the pressing members facing each other, and all the leads can be completely pressed.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view showing an embodiment of the present invention, FIG. 2 A is a plan view showing an example of a presser plate in the present invention, FIG. 2 B is a sectional view taken along the line X--X of FIG. Figure 2C is Y-Y in Figure 2A
The line sectional view and FIG. 3 are explanatory diagrams showing an example of a portion of the lead frame that is pressed. 1...Lead frame, 1a...Lead, 3...Heat block as a support base, 5
...Press plate, 5b...Window, 5C...
...Lead pressing member, 5d...Lead pressing part.

Claims (1)

[Scope of utility model registration request] In a lead frame holding device in which the lead frame is held down by a holding plate whose distance from the lead frame supported on a support base changes relatively, the holding plate is made of an elastic material having a window in the center; A plurality of lead holding members divided into comb-teeth shapes are protruded inwardly from the window portion at positions facing each lead of the lead frame, and a plurality of lead holding members divided into comb teeth are provided at the tip portions of each lead holding member. The lead frame holding device is characterized in that a lead pressing portion is formed to protrude toward the lead.