JPS6233432A - Lead frame pusher - Google Patents

Lead frame pusher

Info

Publication number
JPS6233432A
JPS6233432A JP60173020A JP17302085A JPS6233432A JP S6233432 A JPS6233432 A JP S6233432A JP 60173020 A JP60173020 A JP 60173020A JP 17302085 A JP17302085 A JP 17302085A JP S6233432 A JPS6233432 A JP S6233432A
Authority
JP
Japan
Prior art keywords
lead frame
pusher
presser
chip
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60173020A
Other languages
Japanese (ja)
Other versions
JPH0446453B2 (en
Inventor
Masanari Iwata
岩田　政成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60173020A priority Critical patent/JPS6233432A/en
Publication of JPS6233432A publication Critical patent/JPS6233432A/en
Publication of JPH0446453B2 publication Critical patent/JPH0446453B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7622—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To hold a lead frame between a lead frame pusher and a heat block in case of bonding process by a method wherein a pusher member holding the peripheral outside of IC chip is section-formed into multiple parts to be connected to an elasticity-deformable connector to a pusher main body at the central part in the longitudinal direction of each pusher member. CONSTITUTION:A lead frame pusher 11 composed of a pusher main body 1, pusher members 12 and an elasticity-deformable connector 13 connecting the pusher members 12 to the pusher main body 1 at the central part in the longitudinal direction of each pusher member 12 is constituted to pressure-hold a lead frame 4 loaded upon a heat block 5. When one end of pusher member 12 with the frame being held is pushed in the arrow P1 direction, the connector 13 is elasticity-deformed to be distorted in the arrow (e) direction while when both ends of pusher member 12 are pusher in the P1, P2 directions, the connector 13 is elasticity-deformed to be distorted in the arrow (f) direction making all pusher members 12 evenly abut against the lead frame 4 at the peripheral outside of IC chip 7 in every case.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ＩＣ製造工程においてＩＣチップとリードフ
レームとを金属細線で結線する場合に使用するリードフ
レーム押圧器に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a lead frame presser used for connecting an IC chip and a lead frame with a thin metal wire in an IC manufacturing process.

〔従来の技術〕[Conventional technology]

従来、この種リードフレーム押圧器は、第３図に示すよ
うに構成されている。これを同図〜第５図に基づいて説
明すると、１はその隅部に４個の取付孔２を有する押圧
器本体で、中央部には矩形状の窓３が設けられており、
この窓３の裏側周縁にはボンディング時にリードフレー
ム４をヒートブロック５に押圧する枠状の押圧部６が設
けられている。なお、前記リードフレーム４上にはＩＣ
チップ７がろう付けされており、このＩＣチップ７上に
は電極（パッド）８が配設されている。また、９はこの
電極８と金属線（図示せず）によって接続されるリード
である。Conventionally, this type of lead frame presser has been constructed as shown in FIG. This will be explained based on FIGS. 1 to 5. Reference numeral 1 denotes a presser main body having four mounting holes 2 at its corners, and a rectangular window 3 provided in the center.
A frame-shaped pressing portion 6 is provided on the back side periphery of the window 3 to press the lead frame 4 against the heat block 5 during bonding. Note that there is an IC on the lead frame 4.
A chip 7 is soldered to the IC chip 7, and an electrode (pad) 8 is provided on the IC chip 7. Further, 9 is a lead connected to this electrode 8 by a metal wire (not shown).

このように構成されたリードフレーム押圧器においては
、ボンディング時、すなわちリードフレーム４とこのフ
レーム４上のＩＣチップ７とを結線する時に、第５図に
矢印Ａで示す方向にリードフレーム４がピッチ送りされ
るが、このときリードフレーム４の移動がスムーズに行
われるように押圧器本体１は同図に矢印Ｂで示す方向に
、またヒートブロック５は同図に矢印Ｃで示す方向に後
退している。そして、リードフレーム４上のＩＣチップ
７が押圧器本体１の窓３の下方に位置すると、押圧器本
体１およびヒートブロック５は前進してリードフレーム
４を把持する。しかる後、ワイヤボンディングがＩＣチ
ップ７の電極８とリードフレーム４のリード９との間で
行われる。In the lead frame presser configured in this way, when bonding, that is, when connecting the lead frame 4 and the IC chip 7 on this frame 4, the lead frame 4 is pitched in the direction shown by arrow A in FIG. At this time, the presser main body 1 is moved back in the direction shown by arrow B in the same figure, and the heat block 5 is moved back in the direction shown by arrow C in the same figure, so that the lead frame 4 can move smoothly. ing. Then, when the IC chip 7 on the lead frame 4 is positioned below the window 3 of the presser body 1, the presser body 1 and the heat block 5 move forward to grip the lead frame 4. Thereafter, wire bonding is performed between the electrodes 8 of the IC chip 7 and the leads 9 of the lead frame 4.

なお、第４図に示す鎖線で囲む部分はフレーム把持状態
において押圧器本体１の押圧部６がＩＪ　−ドフレーム
４に当接する部分である。Note that the portion surrounded by the chain line shown in FIG. 4 is the portion where the pressing portion 6 of the pressing device main body 1 comes into contact with the IJ-de frame 4 when the frame is gripped.

この場合、リードフレーム４の把持の良否がワイヤボン
ディングの良否に直接影響を及ぼすため、ヒートブロッ
ク５のフレーム載置部５ａおよび押圧器本体１の押圧部
６が部品レベルで平面度が要求され、組立段階では両部
材Ｌ　　５の互いの平行度が要求される。In this case, since the quality of gripping the lead frame 4 directly affects the quality of wire bonding, flatness of the frame mounting portion 5a of the heat block 5 and the pressing portion 6 of the presser body 1 is required at the component level. In the assembly stage, mutual parallelism of both members L5 is required.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところが、この種のリードフレーム押圧器においては、
押圧器本体１の押圧部６およびヒートブロック５の載置
部５ａを高精度に加工しなげればならず、コストが嵩む
という不都合があった。However, in this type of lead frame presser,
The pressing part 6 of the pressing device main body 1 and the mounting part 5a of the heat block 5 must be machined with high precision, which is disadvantageous in that the cost increases.

すなわち、その加工精度が悪い押圧部６をもつ押圧器本
体１においては、ヒートブロック５との間でリードフレ
ーム４を把持した場合、往々にして第６図に示すように
その一部がリードフレーム４に当接するだけで両部材１
，４間に間隙ｇが生じてしまうからである。That is, in the presser main body 1 having the pressing part 6 with poor machining accuracy, when the lead frame 4 is held between the heat block 5 and the lead frame 4, a part of the lead frame 4 often breaks as shown in FIG. Both parts 1 just by touching 4
, 4, a gap g is created between them.

本発明はこのような事情に鑑みなされたもので、ボンデ
ィング時にヒートブロックとの間でリードフレームを確
実に把持することができるリードフレーム押圧器を提供
するものである。The present invention was made in view of these circumstances, and provides a lead frame presser that can reliably hold a lead frame between it and a heat block during bonding.

（問題点を解決するための手段） 本発明に係るリードフレーム押圧器は、ＩＣチップの周
囲外側を保持する押圧子を複数個に分断形成すると共に
、各押圧子の長さ方向中央部において押圧器本体に弾性
変形可能な接続部で連結したものである。(Means for Solving the Problems) A lead frame presser according to the present invention divides and forms a presser that holds the outer periphery of an IC chip into a plurality of pieces, and presses the center portion of each presser in the longitudinal direction. It is connected to the container body by an elastically deformable connection part.

〔作　用〕[For production]

本発明においては、フレーム把持状態において接続部が
弾性変形して全押圧子がＩＣチップの周囲外側のリード
フレームに当接することになる。In the present invention, when the frame is gripped, the connecting portion is elastically deformed, and all the pressers come into contact with the lead frame outside the periphery of the IC chip.

〔実施例〕〔Example〕

第１図は本発明に係るリードフレーム押圧器を示す下面
図、第２図はその要部を示す斜視図で、同図において第
３図〜第６図と同一の部材については同一の符号を付し
、詳細な説明は省略する。Fig. 1 is a bottom view showing a lead frame presser according to the present invention, and Fig. 2 is a perspective view showing its main parts. The detailed explanation will be omitted.

同図において、符号１１で示すリードフレーム押圧器は
、前記押圧器本体１．この押圧器本体１を切り抜き形成
することにより複数個に分断形成され前記ｒｃチフブ７
の周囲外側を保持する押圧子１２およびこれら押圧子１
２を各押圧子１２の長さ方向中央部において前記押圧器
本体１に連結する弾性変形可能な接続部１３からなり、
前記ヒートブロック５上に載置したリードフレーム４を
押圧保持するように構成されている。In the same figure, the lead frame presser indicated by reference numeral 11 has the presser main body 1. By cutting out and forming this presser main body 1, the rc chip 7 is divided into a plurality of pieces.
A presser 12 that holds the outer periphery of the presser 1 and these pressers 1
2 to the presser main body 1 at the central portion in the longitudinal direction of each presser 12,
It is configured to press and hold the lead frame 4 placed on the heat block 5.

このように構成されたリードフレーム押圧器においては
、リードフレーム４とこのフレーム４上のＩＣチップ７
とを結線するに、リードフレーム４を把持することによ
り行われる。In the lead frame presser configured in this way, the lead frame 4 and the IC chip 7 on this frame 4 are
The wiring is connected by grasping the lead frame 4.

すなわち、第２図に示すフレーム把持状態において、押
圧子１２の一端に同図に矢印で示す方向にＰ、なる力が
作用すると、接続部１３が弾性変形して同図に矢印ｅで
示す方向にねじれ、また押圧子１２の両端に同図に矢印
で示す方向にＰＩ＋Ｐ２なる力が作用した場合は、接続
部１３が弾性変形して同図に矢印ｆで示す方向に撓み、
各々の場合全押圧子１２が均等にＩＣチップ７の周囲外
側のリードフレーム４に当接する。なお、実際には押圧
子１２に複雑な力が作用するが、前記同様に安定したフ
レーム把持が可能となる。That is, when the frame is gripped as shown in FIG. 2, when a force P is applied to one end of the presser 12 in the direction indicated by the arrow in the figure, the connecting portion 13 is elastically deformed and moves in the direction indicated by the arrow e in the figure. When the force PI+P2 is applied to both ends of the presser 12 in the direction indicated by the arrow in the figure, the connecting portion 13 is elastically deformed and bent in the direction indicated by the arrow f in the figure.
In each case, all the pressers 12 evenly abut against the lead frame 4 outside the periphery of the IC chip 7. Although a complicated force actually acts on the presser 12, stable frame gripping is possible in the same manner as described above.

なお、本発明において、１個の押圧子１２に対する接続
部１３の個数は前述した実施例に限定されず、１個の押
圧子１２に対し接続部１３を例えば３個等の複数個で構
成することができ、その個数は適宜変更することができ
る。In addition, in the present invention, the number of connection parts 13 for one presser 12 is not limited to the above-mentioned embodiment, and the number of connection parts 13 for one presser 12 may be three, for example. The number can be changed as appropriate.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、ＩＣチップの周囲
外側を保持する押圧子を複数個に分断形成すると共に、
各押圧子の長さ方向中央部において押圧器本体に弾性変
形可能な接続部で連結したので、接続部が弾性変形して
全押圧子がリードフレームに当接することになり、ボン
ディング時にリードフレームをヒートブロックとの間で
確実に把持することができる。As explained above, according to the present invention, the presser that holds the outer periphery of the IC chip is divided into a plurality of pieces, and
Since each presser is connected to the presser main body at the center in the lengthwise direction by an elastically deformable connection part, the connection part is elastically deformed and all the pressers come into contact with the lead frame. It can be held securely between the heat block and the heat block.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明に係るリードフレーム押圧器を示す下面
図、第２図はその要部を示す斜視図、第３図は従来のリ
ードフレーム押圧器を示す下面図、第４図はリードフレ
ームを示す斜視図、第５図および第６図はリードフレー
ムの把持状態を示す断面図である。 ■・・・・押圧器本体、４・・・・リードフレーム、５
・・・・ヒートフロック、７・・・・ｌＣチップ、１１
・・・・リードフレーム押圧器、１２・・・・押圧子、
１３・・・・接続部。Fig. 1 is a bottom view showing a lead frame presser according to the present invention, Fig. 2 is a perspective view showing the main parts thereof, Fig. 3 is a bottom view showing a conventional lead frame presser, and Fig. 4 is a lead frame FIGS. 5 and 6 are cross-sectional views showing how the lead frame is being held. ■... Presser body, 4... Lead frame, 5
...Heat flock, 7...LC chip, 11
...Lead frame presser, 12...Pressor,
13...Connection part.

Claims (1)

【特許請求の範囲】[Claims] ヒートブロック上に載置したリードフレームを押圧保持
するリードフレーム押圧器において、ＩＣチップの周囲
外側を保持する押圧子を複数個に分断形成すると共に、
各押圧子の長さ方向中央部において押圧器本体に弾性変
形可能な接続部で連結したことを特徴とするリードレー
ム押圧器。In a lead frame presser that presses and holds a lead frame placed on a heat block, a presser that holds the outer periphery of an IC chip is divided into a plurality of pieces, and
A lead frame presser characterized in that each presser is connected to a presser main body at a central portion in the length direction by an elastically deformable connecting portion.
JP60173020A 1985-08-06 1985-08-06 Lead frame pusher Granted JPS6233432A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60173020A JPS6233432A (en) 1985-08-06 1985-08-06 Lead frame pusher

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60173020A JPS6233432A (en) 1985-08-06 1985-08-06 Lead frame pusher

Publications (2)

Publication Number Publication Date
JPS6233432A true JPS6233432A (en) 1987-02-13
JPH0446453B2 JPH0446453B2 (en) 1992-07-30

Family

ID=15952717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60173020A Granted JPS6233432A (en) 1985-08-06 1985-08-06 Lead frame pusher

Country Status (1)

Country Link
JP (1) JPS6233432A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03233947A (en) * 1990-02-09 1991-10-17 Fujitsu Ltd Lead-frame inner-lead holding-down jig
KR20020069885A (en) * 2001-02-28 2002-09-05 앰코 테크놀로지 코리아 주식회사 Clamp for semiconductor package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5288970U (en) * 1975-12-26 1977-07-02
JPS60113438A (en) * 1983-11-24 1985-06-19 Nec Corp Base ribbon holding mechanism

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5288970U (en) * 1975-12-26 1977-07-02
JPS60113438A (en) * 1983-11-24 1985-06-19 Nec Corp Base ribbon holding mechanism

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03233947A (en) * 1990-02-09 1991-10-17 Fujitsu Ltd Lead-frame inner-lead holding-down jig
KR20020069885A (en) * 2001-02-28 2002-09-05 앰코 테크놀로지 코리아 주식회사 Clamp for semiconductor package

Also Published As

Publication number Publication date
JPH0446453B2 (en) 1992-07-30

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