JPS59632Y2 - Circuit element holding device - Google Patents
Circuit element holding deviceInfo
- Publication number
- JPS59632Y2 JPS59632Y2 JP7280679U JP7280679U JPS59632Y2 JP S59632 Y2 JPS59632 Y2 JP S59632Y2 JP 7280679 U JP7280679 U JP 7280679U JP 7280679 U JP7280679 U JP 7280679U JP S59632 Y2 JPS59632 Y2 JP S59632Y2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- circuit element
- holding device
- contactor
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005259 measurement Methods 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 17
- 239000003990 capacitor Substances 0.000 description 12
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004441 surface measurement Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Relating To Insulation (AREA)
Description
【考案の詳細な説明】
本考案は、回路素子の測定に用いられる挟持装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a holding device used for measuring circuit elements.
例えば゛高周波(100〜500 Mn2)で゛用いら
れる回路素子においては電気的特性を維持するため、そ
の外形寸法およびリードの寸法は極限まで短かくし、ま
た該リードの形状も極限まで小さくなるように構成され
ている。For example, in order to maintain the electrical characteristics of circuit elements used at high frequencies (100 to 500 Mn2), the external dimensions and dimensions of the leads should be made as short as possible, and the shape of the leads should also be made as small as possible. It is configured.
この種の回路素子のパラメータを高精度で測定するため
には、該素子と測定器の測定用端子との接続においても
、同様に接続経路を極限にまで短かくする必要がある。In order to measure the parameters of this type of circuit element with high precision, it is necessary to similarly shorten the connection path to the utmost in the connection between the element and the measurement terminal of the measuring instrument.
第1図は、回路素子であるチップコンテ゛ンサの斜視図
である。FIG. 1 is a perspective view of a chip capacitor that is a circuit element.
第2図は、第1図に示したチップ。コンデンサの測定に
利用する従来の挟持装置の概略断面図である。FIG. 2 shows the chip shown in FIG. 1 is a schematic cross-sectional view of a conventional clamping device used for measuring capacitors.
図において、絶縁体10を挾んで同軸形状に形成された
中心導体12と外側導体14とは測定器(図示せず)の
測定用端子となっている。In the figure, a center conductor 12 and an outer conductor 14, which are coaxially formed with an insulator 10 in between, serve as measurement terminals of a measuring device (not shown).
供試チップコンデンサ16は、L字状に形成された外側
導体の肩部上を矢印a方向に印加された接触圧によって
滑る導電性接触子18と中心導体12とにそれぞれ端子
1,3が接触するように挾持[される。In the test chip capacitor 16, the terminals 1 and 3 are in contact with the conductive contact 18 and the center conductor 12, respectively, which slide on the shoulder of the L-shaped outer conductor by contact pressure applied in the direction of arrow a. be held [to be held] as if
そして、コンテ゛ンサ16と側導体12.14とを最短
距離で且つ確実に電気的に接触させるためには、充分な
矢印す方向の接触圧を必要とするために接触子18をね
じ締めあるいははんだ付けなどによって固定していた。In order to ensure electrical contact between the capacitor 16 and the side conductor 12.14 over the shortest distance, sufficient contact pressure in the direction of the arrow is required, so the contactor 18 must be screwed or soldered. It was fixed by etc.
そのため、多数のコンデンサを連続して測定するには極
めて能率が悪い欠点があった。Therefore, there was a drawback that it was extremely inefficient to continuously measure a large number of capacitors.
本考案は上述欠点を解消するためになされたもので、操
作が容易で能率的な測定ができ且つ構成簡単な回路素子
挟持装置を提供せんとするものである。The present invention has been made in order to eliminate the above-mentioned drawbacks, and it is an object of the present invention to provide a circuit element holding device that is easy to operate, allows efficient measurement, and has a simple configuration.
第3図は本考案の一実施例による回路素子挟持装置の斜
視図、第4図あるいは第5図はそれぞれ第3図に示した
装置に供試チップコンデンサを装着する前、後の概略側
面図である。FIG. 3 is a perspective view of a circuit element holding device according to an embodiment of the present invention, and FIGS. 4 and 5 are schematic side views, respectively, before and after a test chip capacitor is mounted on the device shown in FIG. 3. It is.
第3〜5図を参照する。Please refer to FIGS. 3-5.
外側導体14と一体形成された基台22の側面にガイド
溝24が形成されている。A guide groove 24 is formed on the side surface of the base 22 that is integrally formed with the outer conductor 14.
一方基台22の他方側に取付けられた支持部26の孔に
貫通された中心棒27には、レバー2Bが具わっている
。A lever 2B is provided on a center rod 27 that passes through a hole in a support section 26 attached to the other side of the base 22.
また、中心棒27は座30および導電性のL字形接触子
32の縦片32 aを貫通しており、そしてその先端に
ストッパ34が固着されている。Further, the center rod 27 passes through the seat 30 and the vertical piece 32a of the conductive L-shaped contact 32, and a stopper 34 is fixed to the tip thereof.
前記支持部26と接触子30との間で中心棒27に周回
されたばね36は圧縮されている。A spring 36, which is wound around the center rod 27 between the support portion 26 and the contact 30, is compressed.
L字形接触子32の角部に設けたピン38はガイド溝2
4に挿入されており、該接触子32の横片32 bは外
側導体14に対向するように伸長している。The pin 38 provided at the corner of the L-shaped contact 32 is connected to the guide groove 2.
4, and the horizontal piece 32b of the contactor 32 extends so as to face the outer conductor 14.
先ずレバー28をばね36の弾性力に抗して矢印C方向
に引けは゛、ピン3Bはガイド溝24によって案内され
るので接触子32は直線運動すると共にばね36は更に
圧縮される。First, when the lever 28 is pulled in the direction of arrow C against the elastic force of the spring 36, the pin 3B is guided by the guide groove 24, so the contact 32 moves linearly and the spring 36 is further compressed.
この運動中、接触子32の縦片32 aはストッパ34
に押されるので、該接触子32の横片32 bは基台2
2の面と平行に保たれる。During this movement, the vertical piece 32a of the contactor 32 moves against the stopper 34.
, the horizontal piece 32 b of the contact 32 is pressed against the base 2
It is kept parallel to the plane of 2.
接触子32と外側導体14との間隔tがわずかに生じる
ように、ガイド溝およびピン38の位置が決めである。The positions of the guide groove and pin 38 are determined so that the distance t between the contactor 32 and the outer conductor 14 is slightly generated.
従って、接触子32の運動中外側導体14との接触が起
らないから両者が摩耗することはない。Therefore, since the contactor 32 does not come into contact with the outer conductor 14 during movement, both will not be worn out.
レバー2Bを引いた状態で供試チップコンデンサ16を
中心導体12と接触子32との間に置いた後該レバー2
Bを復帰させると該両者間に前記コンテ゛ンサ16は挾
持される。After placing the test chip capacitor 16 between the center conductor 12 and the contact 32 with the lever 2B pulled, the lever 2B is pulled.
When B is returned to its original position, the container 16 is held between the two.
コンデンサ16の端子1.3のそれぞれと接触子32.
中心導体12との電気的接触は、ばね36の押圧力によ
って確実に行われる。Each of the terminals 1.3 of the capacitor 16 and the contact 32.
Electrical contact with the center conductor 12 is ensured by the pressing force of the spring 36.
なお、座30の突起部52を介してばね36によって接
触子32は更に押圧されるため、ピン38の回りに偶力
を生じ、接触子32の先端は図の下方に向って押し下げ
られる。Note that since the contact 32 is further pressed by the spring 36 via the protrusion 52 of the seat 30, a couple is generated around the pin 38, and the tip of the contact 32 is pushed downward in the figure.
従って、接触子32の先端は、測定端子たる外側導体1
4に最短距離をもって接触される。Therefore, the tip of the contactor 32 is connected to the outer conductor 1 which is the measurement terminal.
4 at the shortest distance.
ここで座30の突起部52が接触子32を押す点からピ
ン38までの距離と、該ピン38から接触子32の先端
までの距離とを略々等しくすると、該先端と供試チップ
コンテ゛ンサ16との間の接触圧と、該先端の下部と外
側導体14との間の接触圧とは同程度となる。Here, if the distance from the point where the protrusion 52 of the seat 30 presses the contact 32 to the pin 38 is approximately equal to the distance from the pin 38 to the tip of the contact 32, then the distance between the tip and the sample chip container 16 is approximately equal. The contact pressure between the tip and the outer conductor 14 is approximately the same as the contact pressure between the lower part of the tip and the outer conductor 14.
このようにして供試チップコンデンサ16を1操作で挟
持装着し測定でき、また該コンデンサの離脱も容易にで
きる。In this way, the sample chip capacitor 16 can be clamped and mounted in one operation for measurement, and the capacitor can also be easily removed.
従って、極めて能率よく測定が行える。Therefore, measurements can be carried out extremely efficiently.
第6図は本考案の別実施例を示す概略側面図であり、供
試チップコンデンサ16が挟着された状態にある。FIG. 6 is a schematic side view showing another embodiment of the present invention, in which a test chip capacitor 16 is sandwiched.
図において、第5図と異なる点はガイド溝24およびピ
ン38を用いないで、座10の長さをL字形接触子32
の縦片32 aよりわずかに大きくし、カバー62を覆
ったことである。In this figure, the difference from FIG. 5 is that the guide groove 24 and pin 38 are not used, and the length of the seat 10 is
The vertical piece 32a is made slightly larger than the vertical piece 32a, and covers the cover 62.
また、座30を低摩擦係数で耐摩耗性のよい材料(例え
ばポリアセタール)で成形している。Further, the seat 30 is made of a material with a low coefficient of friction and good wear resistance (for example, polyacetal).
通常状態では、基台22に座30の下部が接触するが接
触子32は接触しないように、レバー2Bと銭座30お
よび接触子32とが保合装着されている。In a normal state, the lever 2B, the money seat 30, and the contact 32 are fitted together so that the lower part of the seat 30 contacts the base 22, but the contact 32 does not.
供試チップコンテ゛ンサ16の着脱時のレバー28の操
作時には、支持部26と中心棒27との接触点が支点と
なって座30が引き上げられるので、銭座30の上部が
カバー62の下面に沿って動く。When operating the lever 28 when attaching or detaching the test chip container 16, the seat 30 is pulled up using the contact point between the support portion 26 and the center rod 27 as a fulcrum, so that the upper part of the money seat 30 is pulled up along the bottom surface of the cover 62. Move.
そして挟着時には、カバー62の下面に当った座30の
上部が支点となって、ばね36の復旧力によって接触子
32の先端が押下げられて外側導体14に接触する。When clamping, the upper part of the seat 30 that is in contact with the lower surface of the cover 62 serves as a fulcrum, and the tip of the contact 32 is pushed down by the restoring force of the spring 36 and comes into contact with the outer conductor 14.
以上の説明より明らかな如く、本考案によれば、接触子
をねし止めあるいは半田付けすることなく、回路素子の
両端子と測定端子中心導体、接触子との接触がばねの復
旧力による十分な圧力をもって行われ、そして該回路素
子の両端子と面測定端子との電気的接触は最短経路で確
実に行われる。As is clear from the above explanation, according to the present invention, the contact between both terminals of the circuit element, the center conductor of the measuring terminal, and the contact can be made sufficiently by the restoring force of the spring, without having to screw or solder the contact. The electrical contact between both terminals of the circuit element and the surface measurement terminal is ensured through the shortest route.
第1図は供試チップコンテ゛ンサの斜視図、第2図は従
来の挟持装置、第3図は本考案の一実施例による挟持装
置の斜視図、第4図および第5図は第3図に示した装置
の既略側面図、第6図は本考案の他実施例を示す既略側
面図で、12,14:測定端子の導体、16:供試チッ
プコンデンサ、18.32 :接触子、22:基台、2
8ニレバー、36:ばねである。Fig. 1 is a perspective view of a test chip container, Fig. 2 is a conventional holding device, Fig. 3 is a perspective view of a holding device according to an embodiment of the present invention, and Figs. 4 and 5 are as shown in Fig. 3. FIG. 6 is a schematic side view showing another embodiment of the present invention, in which 12, 14: conductor of measurement terminal, 16: test chip capacitor, 18, 32: contactor, 22: Base, 2
8 Nilever, 36: Spring.
Claims (1)
の測定端子の一方との間隔が可変となる接触子と、供試
素子の両端子を前記一方の測定端子と接触子とに接触す
るように前記接触子を加圧する手段と、前記供試素子を
挾持すると前記加圧力を前記両測定端子のそれぞれの接
触面に対して垂直に分力する手段と、で成り、前記供試
素子の挟持時に前記接触子が前記測定端子の他方に接触
するようにした回路素子挟持装置。A contact whose respective contact surfaces are orthogonal and whose distance from one of two measurement terminals arranged at a distance is variable, and both terminals of the device under test are brought into contact with the one measurement terminal and the contact. means for applying pressure to the contactor so that the test element is clamped, and means for applying the pressurizing force perpendicularly to the respective contact surfaces of the two measurement terminals when the test element is clamped; A circuit element clamping device in which the contactor contacts the other of the measurement terminals when clamping the circuit element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7280679U JPS59632Y2 (en) | 1979-05-30 | 1979-05-30 | Circuit element holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7280679U JPS59632Y2 (en) | 1979-05-30 | 1979-05-30 | Circuit element holding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55172870U JPS55172870U (en) | 1980-12-11 |
| JPS59632Y2 true JPS59632Y2 (en) | 1984-01-09 |
Family
ID=29306437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7280679U Expired JPS59632Y2 (en) | 1979-05-30 | 1979-05-30 | Circuit element holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59632Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5849272U (en) * | 1981-09-29 | 1983-04-02 | 日本電気株式会社 | Chip-shaped sample mounting head |
| KR102038454B1 (en) * | 2019-04-26 | 2019-10-30 | 주식회사 시스다인 | A device for measuring the device value and size of a chip |
-
1979
- 1979-05-30 JP JP7280679U patent/JPS59632Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55172870U (en) | 1980-12-11 |
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