JPS5970434A - Correction of wire rod - Google Patents

Correction of wire rod

Info

Publication number
JPS5970434A
JPS5970434A JP57179786A JP17978682A JPS5970434A JP S5970434 A JPS5970434 A JP S5970434A JP 57179786 A JP57179786 A JP 57179786A JP 17978682 A JP17978682 A JP 17978682A JP S5970434 A JPS5970434 A JP S5970434A
Authority
JP
Japan
Prior art keywords
wire rod
wire
correcting
gap
corrected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57179786A
Other languages
Japanese (ja)
Inventor
Kozo Uchiumi
内海 幸造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UTSUMI SEISAKUSHO KK
International Rectifier Corp Japan Ltd
Infineon Technologies Americas Corp
Original Assignee
UTSUMI SEISAKUSHO KK
International Rectifier Corp Japan Ltd
Infineon Technologies Americas Corp
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UTSUMI SEISAKUSHO KK, International Rectifier Corp Japan Ltd, Infineon Technologies Americas Corp, International Rectifier Corp USA filed Critical UTSUMI SEISAKUSHO KK
Priority to JP57179786A priority Critical patent/JPS5970434A/en
Publication of JPS5970434A publication Critical patent/JPS5970434A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • H05K13/023Feeding of components with bending or straightening of the terminal leads
    • H05K13/024Straightening or aligning terminal leads
    • H05K13/025Straightening or aligning terminal leads of components having oppositely extending terminal leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Processing (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To correct a wire rod surely and automatically by rotating a correcting roller to make the trough part of notched parts of collarlike bodies meet on a line connecting the center axes of a pair of correcting rollers, and supplying the wire rod to the notched part. CONSTITUTION:When a semiconductor element to be corrected is supplied between correcting rollers 20, 25, the lead wire of the element is bitten by collarlike bodies 22, 22 that rotate reverse to each other, and corrected forcibly and automatically to a straight line by meeting notched parts 24. In this case, the lead wire goes into a gap 29 that becomes straight in axial direction and corrected to a straight line in this gap 29, and correcting force is applied to left and right lead wires at the same time. Accordingly, torsional stress is not given and mechanical stress is not applied to the semiconductor pellet in the mold 3.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、・線材の曲りを矯正する方法に係り、特にア
キシャルリード型電子部品のリード線の曲りを直線状に
矯正する方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for correcting a bend in a wire, and particularly to a method for correcting a bend in a lead wire of an axial lead type electronic component into a straight line.

〔発明の技術的背景〕[Technical background of the invention]

たとえばアキシャルリード型半導体素子1は、第1図に
示すように同軸上に配置したリード線2゜2間に半導体
ベレットを固着させ、その周囲を樹脂モールド3して形
成されるが、この樹脂モールド3の両端から突出したリ
ード線2.2が、その線径や軟金属材料の使用等により
曲り易すい。
For example, an axial lead type semiconductor device 1 is formed by fixing a semiconductor pellet between lead wires 2°2 arranged coaxially as shown in FIG. The lead wires 2.2 protruding from both ends of the lead wires 2.2 are easily bent due to their wire diameter and the use of soft metal materials.

リード線2.2が曲がっていると、電子部品の製造工程
中、種々の不都合がある。
If the lead wire 2.2 is bent, there will be various inconveniences during the manufacturing process of electronic components.

たとえば、半導体素子の製造工程中には、その極性判別
工程、樹脂モールド部へのマーキング工程、リード線の
両端をテープで止めるテーピング工程等が存在するが、
これらの工程では装置へのスムースな挿入等をなすため
にリード線が直線状であることが必要である。
For example, during the manufacturing process of semiconductor devices, there are steps such as determining the polarity, marking the resin mold part, and taping both ends of the lead wires with tape.
In these steps, it is necessary for the lead wire to be straight in order to smoothly insert it into the device.

このため従来では第2図および第3図に示すようにアキ
シャルリード型半導体素子1のリード線2.2を支持す
るように2本のレール状のゴム帯4.4を設け、このゴ
ム帯4,4上に図示を略した搬送ベルト等の移送装置に
より前記半導体装置1を連続的に搬送し、ゴム帯4,4
の直上に設けたゴムローラ5,5でリード線2.2を押
圧し、その曲りを直していた。
For this reason, conventionally, as shown in FIGS. 2 and 3, two rail-shaped rubber bands 4.4 are provided to support the lead wires 2.2 of the axial lead type semiconductor element 1. , 4, the semiconductor device 1 is continuously transported by a transport device such as a transport belt (not shown) on the rubber bands 4, 4.
The lead wire 2.2 was pressed with rubber rollers 5, 5 provided directly above the lead wire 2.2 to straighten the bend.

〔背景技術の問題点〕[Problems with background technology]

しかしながら上記の矯正方法では、ゴム帯4゜4とゴム
ローラ5,5との間に左右のリード線2゜2が挿入され
るタイミングがずれた場合や左右のゴムローラ5,50
回転速度に差違がある場合にはリード線2.2にねじり
応力が加えられ、これが半導体素子1の内部に伝達され
、半導体ペレットに機械的ストレスを付与し、この種の
電子部品の信頼性を損ねる欠点を有する。
However, in the above-mentioned correction method, if the timing of inserting the left and right lead wires 2°2 between the rubber band 4°4 and the rubber rollers 5, 5 is misaligned, or when the left and right rubber rollers 5,50
If there is a difference in rotational speed, a torsional stress is applied to the lead wire 2.2, which is transmitted to the interior of the semiconductor element 1, imparting mechanical stress to the semiconductor pellet and reducing the reliability of this type of electronic component. It has disadvantages that detract from it.

さらに矯正すべき線材の線径が太い場合には、ねじれ防
止の見地からゴムローラ5.5の加圧力を一定限度以上
強くできず、そのため完全には曲りを矯正できない欠点
を有する。
Furthermore, if the wire to be straightened has a large diameter, the pressing force of the rubber rollers 5.5 cannot be increased beyond a certain limit in order to prevent twisting, and as a result, there is a drawback that the bend cannot be completely straightened.

〔発明の目的〕[Purpose of the invention]

本発明は、上記の事情に基づきなされたもので、アキシ
ャルリード型電子部品のリード線等の線材を確実にかつ
自動的に矯正し得るようにした線材の矯正方法を提供す
ることを目的とする。
The present invention has been made based on the above circumstances, and an object of the present invention is to provide a wire straightening method that can reliably and automatically straighten a wire such as a lead wire of an axial lead type electronic component. .

〔発明の概要〕[Summary of the invention]

すなわち、本発明は、軸方向に所定の間隔を隔てて配置
された複数の鍔状体を有し、この鍔状体の周縁部の一部
に少くとも1つの切欠部を設けた1対の矯正ローラを互
いに前記鍔状体が相手側の隣接する鍔状体によって形成
される軸方向の間隙に入り込むよ5に配置し、前記切欠
部の谷の部分が前記1対の矯正ローラの中心軸を結ぶ線
上で互いに迎合するように前記矯正ローラを回転させ、
前記切欠部に矯正すべき線材を案内して線材の曲りを矯
正するようにしたことを特徴とすゐ線材の矯正方法であ
る。
That is, the present invention has a plurality of flanges arranged at predetermined intervals in the axial direction, and a pair of flanges in which at least one notch is provided in a part of the peripheral edge of the flanges. The straightening rollers are arranged so that the flanged bodies enter into the axial gap formed by the adjacent flanged bodies on the other side, and the valley portion of the notch is aligned with the central axis of the pair of straightening rollers. rotating the correction rollers so that they meet each other on a line connecting the
This method of straightening a wire is characterized in that the wire to be straightened is guided into the notch to straighten the bend of the wire.

〔発明の実施例〕[Embodiments of the invention]

以下に、本発明の一実施例を図面を参照して説明する。 An embodiment of the present invention will be described below with reference to the drawings.

第4図は、本発明方法の概略構成を示し、たとえば第1
図に示すようなモールド部3の両端からり−ド線2が突
出したアキシャル型半導体素子1が搬送ベルト6によっ
て矢印方向に搬送される。
FIG. 4 shows a schematic configuration of the method of the present invention, for example, the first
As shown in the figure, an axial type semiconductor device 1 having lead wires 2 protruding from both ends of a molded portion 3 is conveyed by a conveyor belt 6 in the direction of the arrow.

= !− この搬送ベルト6によって搬送されたアキシャルリード
型半導体素子1は、互いに反対方向に回転する矯正ロー
220,25上に落され、矯正ローラ2(j、25の協
働作用によりリード線2,20曲りが矯正され、下方に
落下する。矯正ローラ20゜25の直下には、搬送ベル
ト7が設けてあり、この搬送ベルト7・で前記の半導体
素子1を受け、次工程へと搬送される。
=! - The axial lead type semiconductor device 1 conveyed by the conveyor belt 6 is dropped onto the correction rollers 220 and 25 rotating in opposite directions, and the lead wires 2 and 20 are The bend is corrected and the semiconductor element 1 falls downward. A conveyor belt 7 is provided directly below the correction rollers 20.degree. 25, and the semiconductor element 1 is received by the conveyor belt 7 and conveyed to the next process.

前記の矯正ロー220,25は、次の構成から成る。The above-mentioned straightening rows 220 and 25 have the following configuration.

すなわち第5図に示すように矯正ローラ20は、その回
転軸21の軸方向に所定の間隔tを隔てて複数の鍔状体
22が配置されている。上記の間隔tは本実施例の場合
4.2 mm 、鍔状体22の板厚を4朋、その枚数を
片側4枚とした。
That is, as shown in FIG. 5, the correction roller 20 has a plurality of flanges 22 arranged at a predetermined interval t in the axial direction of a rotating shaft 21 thereof. In this embodiment, the above-mentioned interval t was 4.2 mm, the thickness of the flanged body 22 was 4 mm, and the number of flanges 22 was 4 on each side.

また、上記鍔状体22の形状は第6図に示すようKその
周縁に少くとも1箇所に切欠部24が形成されてい4本
実施例では周縁に切欠部を6ケ所形成しである。
As shown in FIG. 6, the shape of the brim-like body 22 is such that at least one notch 24 is formed on its periphery, and in this embodiment, six notches are formed on the periphery.

矯正ローラ25は、矯正ローラ20と同様にそ 4− の軸方向に所定の間隔tを隔てて複数の鍔状体22が配
置されている。この鍔状体22は前記同様に板厚を4m
m、t=4.2龍、鍔状体22の枚数を3枚とし、図示
のように互いの鍔状体22.22が相手側の間隙26に
入り込むように配置される。
Similar to the correction roller 20, the correction roller 25 has a plurality of flanges 22 arranged at a predetermined interval t in the axial direction thereof. This flanged body 22 has a plate thickness of 4 m as described above.
m, t = 4.2 dragons, the number of flanges 22 is three, and they are arranged so that each flanges 22 and 22 fit into the gap 26 of the other side, as shown in the figure.

矯正ローラ25の鍔状体22の円周方向にも切欠部24
が設けられる。
There is also a notch 24 in the circumferential direction of the brim 22 of the correction roller 25.
is provided.

上記矯正ローラ20,25に設けた切欠部24゜24は
、互いに迎合して矯正されるべき線材の直径にほぼ等し
い空隙を形成するように構成される。
The notches 24 and 24 provided in the straightening rollers 20 and 25 are configured to fit each other to form a gap approximately equal to the diameter of the wire to be straightened.

すなわち、対向配置された矯正ローラ20,25の回転
軸21.27を結ぶ軸線mn上において、切欠部24.
24の谷の部分が互いに迎合して空隙29を形成するよ
うに矯正ローラ20,25を同期させて回転させる。
That is, the cutout portion 24.
The correction rollers 20 and 25 are rotated synchronously so that the valley portions of the rollers 24 meet each other to form a gap 29.

上記矯正ローラ20,25の中央部の回転軸21゜27
間には前記半導体素子1のモールド部3が遊嵌するのに
十分な間隙28が形成される。
Rotating shaft 21° 27 at the center of the correction rollers 20, 25
A gap 28 sufficient for loosely fitting the mold part 3 of the semiconductor element 1 is formed therebetween.

前記の切欠部24.24の迎合位置での空隙29は回転
軸21.27の軸方向に対して直線状となる。  □〔
発明の効果〕 上記の構成により、今、矯正すべきアキシャルリード型
半導体素子1を矯正ローラ20,25間に供給すれば、
前記半導体素子1のリード線2.2の部分は、互いに反
対方向に回転する鍔状体22゜22により噛み込まれ、
迎合する切欠部24により強制的にかつ自動的に直線状
に矯正される。
The air gap 29 in the engagement position of the cutout 24.24 is linear with respect to the axial direction of the rotation axis 21.27. □〔
[Effects of the Invention] With the above configuration, if the axial lead type semiconductor element 1 to be corrected is now supplied between the correction rollers 20 and 25,
A portion of the lead wire 2.2 of the semiconductor element 1 is bitten by a collar-like body 22° 22 rotating in mutually opposite directions,
The mating notch 24 forces and automatically straightens it.

この場合、リード線2.2は、軸方向に直線状となる間
隙29内に入り込み、この間隙29において直線状に矯
正するために左右のリード線2゜2に同時に矯正力が加
わることとなり、したがってねじり応力を付与すること
がなく、またモールド部3の内部の半導体ペレットに機
械的ストレスを加えるおそれもない。
In this case, the lead wire 2.2 enters the gap 29 that is straight in the axial direction, and in order to straighten the lead wire 2.2 straight in the gap 29, a straightening force is applied to the left and right lead wires 2.2 at the same time. Therefore, no torsional stress is applied, and there is no fear of applying mechanical stress to the semiconductor pellet inside the mold part 3.

なお、本発明の実施例では、樹脂モールド部の両端から
リード線が突出しているアキシャルリード型半導体素子
のリード線の矯正方法について説明したが勿論、これに
限定されるものではなく、広く線材の曲りの矯正方法と
して利用できることはいうまでもない。
In the embodiments of the present invention, a method for correcting the lead wires of an axial lead type semiconductor element in which the lead wires protrude from both ends of the resin molded part has been described, but the method is of course not limited to this, and a wide variety of wire materials can be used. Needless to say, it can be used as a method for correcting bends.

また、矯正ローラの鍔状体の機械的強度を考慮し適当な
材料を選定することにより剛性の強い棒状材の曲りをも
矯正することが可能である。
Further, by selecting an appropriate material in consideration of the mechanical strength of the brim of the correction roller, it is possible to correct the bending of a highly rigid bar-shaped member.

さらに、鍔状体の外周の複数箇所に数多くの切欠部を設
け、矯正ローラの回転数を上げて前記切欠部に連続的に
矯正すべき線材を供給するようにすれば、さらに矯正作
業の能率を向上させることができる。
Furthermore, if a large number of notches are provided at multiple locations on the outer periphery of the brim, and the number of revolutions of the straightening roller is increased to continuously supply the wire to be straightened to the notches, the efficiency of the straightening work can be further improved. can be improved.

なお、樹脂モールド部を有さない線材の曲りを矯正する
Kは、原理的には第5図の矯正ローラの左右いずれか半
分の構成を有すればその目的を達成することができる。
In principle, the K for straightening the bending of a wire without a resin molded portion can achieve its purpose if it has the configuration of either the left or right half of the straightening roller shown in FIG.

さらに鍔状体の枚数、板厚、隣接鍔状体間の間隔も本発
明の実施例に限定されるものではない。
Furthermore, the number of flanges, the plate thickness, and the distance between adjacent flanges are not limited to the embodiments of the present invention.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、アキシャルリード型半導体素子のリード線の
曲り状態を示す斜視図、第2図、第3図は、上記リード
線の曲りを矯正するための従来方法を示す側面図および
斜視図、第4図は、本発明の線材の曲りを矯正する方法
の概略を示す説明図、第5図は、上記方法を実施するた
めの矯正ローラの平面図、第6図は、第5図のA−A矢
視図である。 20、25・・・矯正ローラ、21.27・・・回転軸
、22・・・鍔状体、    24・・・切欠部、26
、28・・・間 隙 出願代理人 弁理士 菊 池 五 部
FIG. 1 is a perspective view showing a bent state of the lead wire of an axial lead type semiconductor element, FIGS. 2 and 3 are a side view and a perspective view showing a conventional method for correcting the bend in the lead wire, FIG. 4 is an explanatory diagram showing an outline of the method of straightening the bend in a wire according to the present invention, FIG. 5 is a plan view of a straightening roller for carrying out the above method, and FIG. -A arrow view. 20, 25... Correction roller, 21.27... Rotating shaft, 22... Flange-like body, 24... Notch, 26
, 28... Gap application agent Patent attorney Kikuchi Gobe

Claims (1)

【特許請求の範囲】[Claims] 軸方向に所定の間隔を隔てて配置された複数の鍔状体を
有し、この鍔状体の周縁部の一部に少くとも1つの切欠
部を設けた1対の矯正ローラを互いの前記鍔状体が相手
側の隣接鍔状体によって形成される軸方向間隙に入り込
むように配置し、前記切欠部の谷の部分が前記1対の矯
正ローラの中心軸を結ぶ線上で互いに迎合するように前
記矯正ローラを回転させ、前記切欠部に矯正すべき線材
を案内□して線材の曲りを矯正するようにしたことを特
徴とする線材の矯正方法。
A pair of correction rollers each having a plurality of flanges arranged at predetermined intervals in the axial direction and having at least one notch in a part of the peripheral edge of the flanges are connected to each other. The flanged body is arranged so as to fit into the axial gap formed by the adjacent flanged body on the other side, and the valley portion of the notch portion meets each other on a line connecting the central axes of the pair of correction rollers. A method for straightening a wire rod, characterized in that the straightening roller is rotated to guide the wire rod to be straightened into the notch portion to straighten the bend of the wire rod.
JP57179786A 1982-10-15 1982-10-15 Correction of wire rod Pending JPS5970434A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57179786A JPS5970434A (en) 1982-10-15 1982-10-15 Correction of wire rod

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57179786A JPS5970434A (en) 1982-10-15 1982-10-15 Correction of wire rod

Publications (1)

Publication Number Publication Date
JPS5970434A true JPS5970434A (en) 1984-04-20

Family

ID=16071863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57179786A Pending JPS5970434A (en) 1982-10-15 1982-10-15 Correction of wire rod

Country Status (1)

Country Link
JP (1) JPS5970434A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130250A (en) * 1984-07-23 1986-02-12 Matsutani Seisakusho:Kk Positioning and fetching device of fine bar
CN102832566A (en) * 2012-09-24 2012-12-19 安徽省电力公司蚌埠供电公司 Secondary wire leveler
JPWO2016147381A1 (en) * 2015-03-19 2017-12-28 富士機械製造株式会社 Tape feeder

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130250A (en) * 1984-07-23 1986-02-12 Matsutani Seisakusho:Kk Positioning and fetching device of fine bar
CN102832566A (en) * 2012-09-24 2012-12-19 安徽省电力公司蚌埠供电公司 Secondary wire leveler
JPWO2016147381A1 (en) * 2015-03-19 2017-12-28 富士機械製造株式会社 Tape feeder

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