JPS5971380A - 導電性接着剤 - Google Patents

導電性接着剤

Info

Publication number
JPS5971380A
JPS5971380A JP18243382A JP18243382A JPS5971380A JP S5971380 A JPS5971380 A JP S5971380A JP 18243382 A JP18243382 A JP 18243382A JP 18243382 A JP18243382 A JP 18243382A JP S5971380 A JPS5971380 A JP S5971380A
Authority
JP
Japan
Prior art keywords
curing agent
conductive adhesive
electrically conductive
epoxy resin
urea
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18243382A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0251469B2 (cs
Inventor
Teru Okunoyama
奥野山　輝
Hiroshi Inaba
稲葉　洋志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP18243382A priority Critical patent/JPS5971380A/ja
Publication of JPS5971380A publication Critical patent/JPS5971380A/ja
Publication of JPH0251469B2 publication Critical patent/JPH0251469B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
JP18243382A 1982-10-18 1982-10-18 導電性接着剤 Granted JPS5971380A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18243382A JPS5971380A (ja) 1982-10-18 1982-10-18 導電性接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18243382A JPS5971380A (ja) 1982-10-18 1982-10-18 導電性接着剤

Publications (2)

Publication Number Publication Date
JPS5971380A true JPS5971380A (ja) 1984-04-23
JPH0251469B2 JPH0251469B2 (cs) 1990-11-07

Family

ID=16118179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18243382A Granted JPS5971380A (ja) 1982-10-18 1982-10-18 導電性接着剤

Country Status (1)

Country Link
JP (1) JPS5971380A (cs)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05120914A (ja) * 1991-10-30 1993-05-18 Sumitomo Bakelite Co Ltd 半導体用導電性樹脂ペースト
JP2000319622A (ja) * 1999-05-14 2000-11-21 Denso Corp 導電性接着剤及びそれを部品接続材料として用いた回路基板
CN107434958A (zh) * 2016-05-25 2017-12-05 汉能新材料科技有限公司 一种导电胶与使用其作为粘结剂的方法及其脱胶方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4993495A (cs) * 1972-10-27 1974-09-05
JPS5390344A (en) * 1977-01-21 1978-08-09 Hitachi Ltd Adhesive composition
JPS5426000A (en) * 1977-07-28 1979-02-27 Mitsubishi Chem Ind Ltd Epoxy resin composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4993495A (cs) * 1972-10-27 1974-09-05
JPS5390344A (en) * 1977-01-21 1978-08-09 Hitachi Ltd Adhesive composition
JPS5426000A (en) * 1977-07-28 1979-02-27 Mitsubishi Chem Ind Ltd Epoxy resin composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05120914A (ja) * 1991-10-30 1993-05-18 Sumitomo Bakelite Co Ltd 半導体用導電性樹脂ペースト
JP2000319622A (ja) * 1999-05-14 2000-11-21 Denso Corp 導電性接着剤及びそれを部品接続材料として用いた回路基板
CN107434958A (zh) * 2016-05-25 2017-12-05 汉能新材料科技有限公司 一种导电胶与使用其作为粘结剂的方法及其脱胶方法

Also Published As

Publication number Publication date
JPH0251469B2 (cs) 1990-11-07

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