JPS5972103A - Method of producing resin-molded axial lead type electric part - Google Patents
Method of producing resin-molded axial lead type electric partInfo
- Publication number
- JPS5972103A JPS5972103A JP57181385A JP18138582A JPS5972103A JP S5972103 A JPS5972103 A JP S5972103A JP 57181385 A JP57181385 A JP 57181385A JP 18138582 A JP18138582 A JP 18138582A JP S5972103 A JPS5972103 A JP S5972103A
- Authority
- JP
- Japan
- Prior art keywords
- lead type
- axial lead
- resin molded
- blade
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 10
- 239000011347 resin Substances 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 31
- 238000004519 manufacturing process Methods 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003854 Surface Print Methods 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は樹脂モールドアキシャルリード型電子部品の製
造方法に係り、特に、樹脂モールド部の側面に突出した
パリ等の突出物を確実に取り得る方法に関する。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a method for manufacturing a resin molded axial lead type electronic component, and in particular, a method for reliably removing protrusions such as holes protruding from the side surfaces of a resin molded part. Regarding.
同軸上に配置した一対のリード線間に半導体ペレットを
配置し、このベレント部の周囲を樹脂モールドしたアキ
シャルリード型半導体素子等の電子部品が各種産業機器
等に多用されている。Electronic components such as axial lead type semiconductor elements, in which a semiconductor pellet is arranged between a pair of coaxially arranged lead wires and the periphery of the lead wire is molded with resin, are often used in various industrial equipment.
上記の樹脂モールドアキシャルリード型電子部品はその
樹脂モールド部を所定の金型を用いて射出成型によって
製作されるが、その場合完成した樹脂モールド部には、
溶融樹脂を導びくゲートやパリ等の突出物が形成される
。The resin mold axial lead type electronic component described above is manufactured by injection molding the resin mold part using a predetermined mold, but in that case, the completed resin mold part has
Projections such as gates and holes are formed to guide the molten resin.
すなわち、第１図に示すように同軸的に配置したリード
線１．１の中心部に樹脂モールド部２が形成されるが、
このモールド部の端面にゲート３、パリ４等の突出物が
残存する。That is, as shown in FIG. 1, the resin molded portion 2 is formed at the center of the lead wire 1.1 arranged coaxially.
Projections such as a gate 3 and a pad 4 remain on the end face of this molded portion.
これらゲート３、パリ４等の突出物は、一般にバレル方
法、粉末吹付方法等によって除去されるが、作業能率が
悪く、かつリード線やモールド部本体に傷を付けやすく
製品の信頼性を損ねるので好ましくない。These protrusions such as the gate 3 and the mold 4 are generally removed by the barrel method, powder spraying method, etc., but the work efficiency is poor and the lead wires and the mold body are easily damaged, impairing the reliability of the product. Undesirable.
さらに上記の方法では突出物が完全に除去できない場合
があり、後工程での表面印刷装置等のスムースな搬送を
妨げる等の障害があった。Furthermore, in the above-mentioned method, the protrusions may not be completely removed, resulting in problems such as interfering with smooth conveyance in a surface printing device, etc. in a subsequent process.
本発明は、上記の事情に基づいてなされたもので、樹脂
モールドアキシャルリード型電子部品の樹脂モールド部
端面に形成されたゲート等の突出物を確実に除去し得る
製造方法を提供することを目的とする。The present invention has been made based on the above-mentioned circumstances, and an object of the present invention is to provide a manufacturing method that can reliably remove protrusions such as gates formed on the end surface of a resin mold part of a resin mold axial lead type electronic component. shall be.
すなわち、本発明は、所定間隔を置いて連続的に搬送さ
れる樹脂モールドアキシャルリード型電子部品の樹脂モ
ールド部端面に形成された突出物を搬送途上の工程にお
いて回転刃と固定刃とを有するカッタ装置によって切断
するようにしたことを特徴とする樹脂モールドアキシャ
ルリード型電子部品の製造方法である。That is, the present invention provides a cutter having a rotating blade and a fixed blade to cut a protrusion formed on the end face of a resin molded part of a resin molded axial lead type electronic component that is continuously transported at a predetermined interval. This is a method for manufacturing a resin molded axial lead type electronic component, characterized in that cutting is performed using a device.
以下に、本発明の一実施例につき図面を参照して説明す
る。An embodiment of the present invention will be described below with reference to the drawings.
第２図、第３図は本発明に用いるカッタ装置の概略を示
す正面図および側面図である。FIGS. 2 and 3 are a front view and a side view schematically showing a cutter device used in the present invention.
このカッタ装置１０は、固定刃１１と回転刃１２により
構成され、回転刃Ｉ２は図示を略した回転軸に支持され
、この回転軸の回転により回転刃１２は一定速度で回転
するように構成されている。This cutter device 10 is composed of a fixed blade 11 and a rotary blade 12. The rotary blade I2 is supported by a rotary shaft (not shown), and the rotary blade 12 is configured to rotate at a constant speed by rotation of the rotary shaft. ing.
回転刃１２の詳細を第４図および第５図に示す。Details of the rotary blade 12 are shown in FIGS. 4 and 5.
すなわち、第４図はその正面図、第５図はその平面図で
あり、回転刃１２は樹脂モールドアキシャルリード型電
子部品の樹脂モールド部２の長さｔ（第１図参照）に等
しい厚さを有する円板１３を有する。この円板１３の外
周には等間隔配置のフィン１４と樹脂モールド部２が収
納される凹所１５とが形成されている。That is, FIG. 4 is a front view thereof, and FIG. 5 is a plan view thereof. It has a disc 13 having a shape. On the outer periphery of this disk 13, fins 14 arranged at equal intervals and a recess 15 in which the resin mold part 2 is housed are formed.
上記円板１３の両側面には、その外周先端部を鋭角に形
成して刃部１６を設けた円形刃１７が固定されている。A circular blade 17 is fixed to both side surfaces of the disk 13, and has a blade portion 16 formed at an acute angle at the tip of its outer periphery.
この円形刃１７の外周にはその外周方向に沿って半円形
の切欠き１８が形成されている。この切欠き１８の大き
さはリード線ｌの半径にほぼ等しい大きさとする。A semicircular notch 18 is formed along the outer circumferential direction of the circular blade 17. The size of this notch 18 is approximately equal to the radius of the lead wire l.
上記構成の回転刃１２の直下に設けられる固定刃１１の
詳細を第６図および第７図に示す。Details of the fixed blade 11 provided directly below the rotary blade 12 having the above configuration are shown in FIGS. 6 and 7.
すなわち、固定刃１１は基部１９上に対向配置した支持
部２０．２０を有し、この支持部２０．２０の平坦部２
１．２１のほぼ中央にはその肉厚を斜めに切り落して鋭
角の直刃部２２．２２が形成しである。That is, the fixed blade 11 has a supporting part 20.20 arranged oppositely on the base part 19, and the flat part 2 of this supporting part 20.20
At approximately the center of 1.21, the wall thickness is cut off diagonally to form an acute-angled straight edge portion 22.22.
上記の平坦部２１．２１に連続して傾斜部２３゜２３が
形成され、この傾斜部２２．２２の幅方向の間隔は第７
図に示すように内部に向って経径するようにテーパ状に
形成され、その開口端では樹脂モールド部２の長さｔに
ほぼ等しい幅に形成した平行配置の平坦部２１．２１の
幅に比して十分大きな寸法りとする。A sloped part 23.23 is formed continuously to the flat part 21.21, and the widthwise interval of this sloped part 22.22 is 7th.
As shown in the figure, it is formed in a tapered shape so that the diameter increases toward the inside, and the width of the parallel flat part 21.21 is approximately equal to the length t of the resin molded part 2 at its open end. The dimensions should be sufficiently large compared to the above.
以上のように構成の固定刃１１と回転刃１２によりカッ
タ装置１０を構成し、樹脂モールドアキンヤルリード型
電子部品の樹脂モールド部端面に形成された突出物を切
断する。The cutter device 10 is configured by the fixed blade 11 and the rotary blade 12 configured as described above, and cuts a protrusion formed on the end surface of the resin mold part of a resin molded asymmetric lead type electronic component.
すなわち、搬送ベルト２４０幅方向両端部近傍に適当な
支持手段２５を設け、この支持手段２４により樹脂モー
ルドアキシャルリード型電子部品５を所定間隔に整列さ
せ、′カッタ装置１０へ搬入する。That is, appropriate supporting means 25 are provided near both ends of the conveyor belt 240 in the width direction, and the resin molded axial lead type electronic components 5 are aligned at predetermined intervals by the supporting means 24 and transported into the cutter device 10.
カッタ装置１０に搬入された前記電子部品５は、そのリ
ード部１．１が固定刃１１の傾斜部２０゜２０に案内さ
れて進行し、直刃部２２．２０に致来する。The electronic component 5 carried into the cutter device 10 advances with its lead portion 1.1 guided by the inclined portion 20.20 of the fixed blade 11, and reaches the straight blade portion 22.20.
すなわち、一定速度で回転している回転刃１２と固定刃
１２との間に進行した前記電子部品５は、その樹脂モー
ルド部２が回転刃１１の凹所１５内に入り、樹脂モール
ド部２０両端面から軸方向に突出したリード線１．１が
、円形刃１７の切欠き１８．１８に入る。That is, when the electronic component 5 advances between the rotary blade 12 and the fixed blade 12 that are rotating at a constant speed, the resin molded part 2 enters the recess 15 of the rotary blade 11, and both ends of the resin molded part 20 A lead wire 1.1 projecting axially from the surface enters a notch 18.18 in the circular blade 17.
回転刃１２と固定刃１２にはそれぞれその刃部１６およ
び直刃部２３が設げられているので、これらの協働作用
により、前記樹脂モールド部２の端面から突出したゲー
ト３、パリ４等の突出物が切除される。Since the rotary blade 12 and the fixed blade 12 are provided with a blade portion 16 and a straight blade portion 23, respectively, the gate 3, paris 4, etc. protruding from the end face of the resin molded portion 2 are The protrusion is removed.
こうして突出物が切除された前記電子部品５は搬送ベル
ト２４によって次工程へと搬送される。The electronic component 5 from which the protrusions have been removed is conveyed to the next step by the conveyor belt 24.
本発明は上記したように固定刃と回転刃とを有するカッ
タ装置により樹脂モールドアキシャル型電子部品の樹脂
モールド部の端面に形成された突出物を１本毎に機械的
に切除するようにしたので、突出物を確実に取除くこと
ができ、次工程への搬送の支障となるようなことがない
。As described above, the present invention uses a cutter device having a fixed blade and a rotating blade to mechanically cut out protrusions formed on the end face of the resin molded part of a resin molded axial type electronic component one by one. , protrusions can be reliably removed and will not interfere with transportation to the next process.
さらにカッタ装置の固定刃と回転刃とは樹脂モールド部
の突出物のみに接触し、樹脂モールド部ヤリード線の逃
げの形成により、他の部分に接触することがないので、
損傷を与えるおそれがなく、したがってこの種電子部品
の信頼性を損ねることもない。Furthermore, the fixed blade and rotary blade of the cutter device only contact the protrusion of the resin mold part, and do not contact other parts due to the formation of the escape of the lead wire in the resin mold part.
There is no risk of damage and therefore no loss of reliability of this type of electronic component.
また、突出物の従来の除去方法に比較して本発明では、
すべて自動的に行なわれることから手数がかからず、作
業能率を著しく向上させることができる。Additionally, compared to conventional methods for removing protrusions, the present invention
Since everything is done automatically, there is no need for any trouble, and work efficiency can be significantly improved.
第１図は、樹脂モールドアキシャルリード型電子部品の
一部切欠斜視図、第２図、第３図は本発明方法に用いる
カンタ装置の概略を示す正面図および側面図、第４図、
第５図は、上記カッタ装置における回転刃の正面図およ
び平面図、第６図、第７図は、上記カッタ装置における
固定刃の概略を示す斜視図および平面図である。
２・・・樹脂モールド部、 ５・・・樹脂モールドア
キシャル型電子部品、１ｏ・・・カッタ装置、１１・・
・固定刃、 １２・・・回転刃、２４・・・搬
送ベルト
出願代理人 弁理士 菊 池 五 部FIG. 1 is a partially cutaway perspective view of a resin molded axial lead type electronic component, FIGS. 2 and 3 are front and side views schematically showing a canter device used in the method of the present invention, and FIG.
FIG. 5 is a front view and a plan view of the rotary blade in the cutter device, and FIGS. 6 and 7 are a perspective view and a plan view schematically showing the fixed blade in the cutter device. 2...Resin mold part, 5...Resin mold axial type electronic component, 1o...Cutter device, 11...
・Fixed blade, 12... Rotating blade, 24... Conveyor belt Application agent Patent attorney Kikuchi, Department 5
Claims (1)
を置いて並列にならべて搬送する手段と、この手段中に
設けた固定刃と回転刃とを有するカッタ装置とを備え、
このカッタ装置により前記電子部品の樹脂モールド部端
面に形成された突出物を切除するようにしたことを特徴
とする樹脂モールドアキシャルリード型電子部品の製造
方法。A means for transporting resin molded axial lead type electronic components in parallel at a predetermined interval, and a cutter device having a fixed blade and a rotary blade provided in the means,
A method for manufacturing a resin molded axial lead type electronic component, characterized in that the cutter device cuts out a protrusion formed on an end surface of a resin molded part of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57181385A JPS5972103A (en) | 1982-10-18 | 1982-10-18 | Method of producing resin-molded axial lead type electric part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57181385A JPS5972103A (en) | 1982-10-18 | 1982-10-18 | Method of producing resin-molded axial lead type electric part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5972103A true JPS5972103A (en) | 1984-04-24 |
Family
ID=16099804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57181385A Pending JPS5972103A (en) | 1982-10-18 | 1982-10-18 | Method of producing resin-molded axial lead type electric part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5972103A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04340730A (en) * | 1991-05-17 | 1992-11-27 | Nec Yamagata Ltd | Gate breaking method in sealing process of semiconductor device |
| JPH05104320A (en) * | 1991-10-08 | 1993-04-27 | Haimeka Kk | Method and device for removing dam burr of lead frame |
-
1982
- 1982-10-18 JP JP57181385A patent/JPS5972103A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04340730A (en) * | 1991-05-17 | 1992-11-27 | Nec Yamagata Ltd | Gate breaking method in sealing process of semiconductor device |
| JPH05104320A (en) * | 1991-10-08 | 1993-04-27 | Haimeka Kk | Method and device for removing dam burr of lead frame |
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