JPS5983052U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5983052U
JPS5983052U JP1982180167U JP18016782U JPS5983052U JP S5983052 U JPS5983052 U JP S5983052U JP 1982180167 U JP1982180167 U JP 1982180167U JP 18016782 U JP18016782 U JP 18016782U JP S5983052 U JPS5983052 U JP S5983052U
Authority
JP
Japan
Prior art keywords
semiconductor
heat dissipation
pellet
resin material
semiconductor equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982180167U
Other languages
English (en)
Other versions
JPH0351979Y2 (ja
Inventor
小関　隆之
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1982180167U priority Critical patent/JPS5983052U/ja
Publication of JPS5983052U publication Critical patent/JPS5983052U/ja
Application granted granted Critical
Publication of JPH0351979Y2 publication Critical patent/JPH0351979Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は半導体装置の一例を示す一部透視平面図、第２
図は第１図Ａ−Ａ断面図、第３図は第１図装置の取付例
を示す要部側断面図、第４図は絶縁型半導体装置の側断
面図、第５図は第４図装置の樹脂モールド装置の側断面
図、第６図は絶縁型半導体装置の変形例を示す側断面図
、第７図は本考案による半導体装置の一部透視平面図、
第８図−は第７図Ｂ−Ｂ断面図、第９図は本考案の他の
実施例を示す部分断面側面図である。 ２・・・・・・半導体ペレット、３・・・・・・リード
、５・・・・・・樹脂材、１６・・・・・・放熱基板、
１６ａ・・・・・・折曲部。　　　　・９８　？　１°
１

Claims (1)

    【実用新案登録請求の範囲】
  1. 放熱基板上に載置した半導体ベレットと、一端を半導体
    ペレットの近傍に配置したリードとを電気的に接続し、
    半導体ペレットを含みかつ放熱基板の全周を樹脂材にて
    被覆したものにおいて、上記放熱基板の半導体ペレット
    から離隔した端部をベレット載置面側に折曲すると共に
    折曲部の上下端部における樹脂材の厚みを略等しくした
    ことを特徴とする半導体装置。
JP1982180167U 1982-11-29 1982-11-29 半導体装置 Granted JPS5983052U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982180167U JPS5983052U (ja) 1982-11-29 1982-11-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982180167U JPS5983052U (ja) 1982-11-29 1982-11-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS5983052U true JPS5983052U (ja) 1984-06-05
JPH0351979Y2 JPH0351979Y2 (ja) 1991-11-08

Family

ID=30390716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982180167U Granted JPS5983052U (ja) 1982-11-29 1982-11-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS5983052U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02290032A (ja) * 1989-12-14 1990-11-29 Hitachi Ltd レジンモールド型半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02290032A (ja) * 1989-12-14 1990-11-29 Hitachi Ltd レジンモールド型半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0351979Y2 (ja) 1991-11-08

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