JPS5987971A - Soldering method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a solder Iτ terminal piece to which pre-soldering is applied, in which a terminal piece to which a wiring material is connected and a nitride terminal piece are mixed. 1'J] (; Concerning the method of attaching a half-FJ (solder A-1) by blowing high-temperature air onto the J terminal group.

0)) Prior art and problems In order to reduce the number of man-hours required for wiring the distribution material to the terminal 71゛r on which the soldered terminal pieces are arranged,
The solder-treated wiring material is placed on the terminal piece using an insulating chip provided with solder, and high-temperature air is blown to melt the solder on the insulating chip. It will be done.

This soldering work has conventionally been performed as shown in (n,)(b) of FIG.

It was done like a gateway.

Terminal block I holding a plurality of terminal pieces 2 as shown in (a)
The wiring material 7-3 is attached to the terminal tIT formed by A, and the core it, 'i! of the wiring material 4 is attached.
4 A and terminal piece 2 are fixed and connected.

As shown in (b), such a solder pad is preliminarily coated with (+i
ii Solder 2A is applied, and the insulating chips 3 are made of a material that shrinks when heated, and solder 3A is applied to the inner peripheral surface.
is fixed. 1) When attaching the half-H 1) C first, insert the insulating chip 3 so that the core wire 4A protrudes 11-ft.
Terminal piece 2 to be inserted into wiring material 4 to be A-terminated and wired
to wear a crown. Next, the nozzle 5 is brought close and high Fm air at a temperature of about 400° C. as shown by arrow A is blown. The insulating tube 3 is heated by this high-temperature air and is shrunk, and the solder 3A is melted, so that the terminal piece 2 and the core wire 4A are fixed together by the molten heat.

However, not all of the arranged terminal pieces 2 are wired, and there are empty terminal pieces 2 that are not wired.

When the above-mentioned high temperature is blown onto the vacant terminal M'2, the two preliminary solders are melted and the half IB is scattered as shown by arrow B.

This scattered solder adheres to the equipment or the wiring material 4, causing a problem.

(C.) Object of the Invention The object of the invention is to provide a device which eliminates the above-mentioned problems by preventing the scattering of molten solder on empty terminal pieces.

(d) Structure of the Invention The purpose of the present invention is to solve the problem of wiring step A in the soldering method.
A first cheep of a predetermined length with a half "■" held on the inner periphery is attached to the terminal piece so that the terminal-treated wiring material is inserted into the terminal piece. In the empty 1 child piece where the wiring material is not wired, there is a L that goes around the 4j child piece.
A second chip of a predetermined length is attached to the solder, and high-temperature air is blown to melt the solder.
? This is achieved by the soldering method.

(e) Examples of the invention The present invention will be explained in detail below with reference to FIG.

FIG. 2 illustrates the soldering method according to the present invention [7(a)
ld is a side view of the terminal group, and (b) is a perspective view of the insulating tube. The nozzle 5 blows high-temperature air in the direction of arrow A). The insulating chip is cut into a length e that is longer than the length of the inner FF, d, and the terminal piece 2, which can be inserted into the outer periphery of the terminal 6. Therefore, before or after the above-described installation work of the wiring material 4, the terminal piece 2 is covered with an insulating material 2, and high-temperature air is blown onto the terminal piece 2. In this way, the solder melted by heating with high-temperature air can be prevented from scattering.

If the wiring is to be carried out by wires, the insulating chip can be removed and the wiring material 4 can be connected.

(f) Detailed Description of the Invention As described above, in the present invention, the empty terminal piece 2 to which the wiring material 4 is not wired is insulated.

The system is designed to blow high-temperature air over the air.

This prevents the preliminary solder from scattering.Furthermore, if the insulating Q-Pro is attached to the empty terminal piece 2 in advance, it is possible to determine whether there is a wire or not, and wiring mistakes can be prevented when installing the wire @4, making it practical. The effect is a dog.

[Brief explanation of drawings]

Figure 1 illustrates the conventional soldering method; (a) is a side view;
(b) is an explanatory diagram of soldering work, and Fig. 2 is an explanation of the Nakata Kanri method according to the present invention. (a) id: (lli 1 side view,
(b) I-1,4'inP. FIG. In the figure, 1 is a terminal group, IA is ): j77 units, 2
is a terminal piece, 2A is a preliminary solder, 3 is an insulation chip, 4 is
4A is a wiring material, 4A is a core wire, 5 is a nozzle, 6 is a tube, and 3A is a solder. Figure 1 (α) (Figure 2 (o) (b)

Claims (1)

[Claims] In a soldering terminal piece having a plurality of terminal pieces on which a spare half 111 is applied, a wiring material is fixed to a predetermined terminal piece in such a manner that electrical continuity is obtained. The terminal piece has a first duplex of a predetermined length in which solder 1 is held on the inner periphery and is terminally processed.
At the same time, a second tube of a predetermined length is attached to the vacant terminal piece where the wiring material is not wired so as to cover the terminal piece, and the solder is soldered. A half-■1-1 method characterized by performing blowing of air to melt the gas.