JPS5987996A - Laser gas cutting equipment - Google Patents

Laser gas cutting equipment

Info

Publication number
JPS5987996A
JPS5987996A JP57197394A JP19739482A JPS5987996A JP S5987996 A JPS5987996 A JP S5987996A JP 57197394 A JP57197394 A JP 57197394A JP 19739482 A JP19739482 A JP 19739482A JP S5987996 A JPS5987996 A JP S5987996A
Authority
JP
Japan
Prior art keywords
cutting
laser light
cut
laser beam
combustion reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57197394A
Other languages
Japanese (ja)
Inventor
Akinori Taira
平良 成則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IHI Corp
Original Assignee
Ishikawajima Harima Heavy Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishikawajima Harima Heavy Industries Co Ltd filed Critical Ishikawajima Harima Heavy Industries Co Ltd
Priority to JP57197394A priority Critical patent/JPS5987996A/en
Publication of JPS5987996A publication Critical patent/JPS5987996A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462Nozzles; Features related to nozzles
    • B23K26/1464Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476Features inside the nozzle for feeding the fluid stream through the nozzle
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/228Selection of materials for cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To enable high speed cutting of a thick plate with a small heat input by radiating laser light to a material to be cut within a prescribed area, and injecting the gaseous oxygen flow of a flux area smaller than the irradiated area to the center of the laser light irradiation. CONSTITUTION:Assist gas 4 is ejected from a gap 8 and laser light 1 is radiated toward a material 3 to be cut. The laser light 1 is focused to the position of a nozzle port 9 by a lens 2, and is spread in a required range around the cutting point (a) on the surface of the material 3. Then the material 3 is preheated at the cutting point (a) and the part near the same to the temp. at which combustion reaction can take place, thereby forming a firing spot. High purity gaseous oxygen 10 having regulated pressure is ejected through the nozzle port 9 to the firing spot to induce the oxidation and combustion reaction with the material 3, thereby blowing downward the formed slag. The touch 5 is then moved in an arrow (b) direction, whereby cutting is performed.

Description

【発明の詳細な説明】 本発明−5物質の化学反応、燃焼反応で切断できる旧料
、特に軟鋼の厚板をレーザ光及び酸素ガス、により切断
する切断装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention-5 relates to a cutting device for cutting thick plates of old material, especially mild steel, which can be cut by chemical reaction or combustion reaction of substances, using laser light and oxygen gas.

現在燃焼反応で材料を切断する方法所謂溶断に於いては
、ガス切断が主流である。
Currently, gas cutting is the mainstream method for cutting materials by combustion reaction, so-called melt cutting.

断点に高純度の酸素ガスを吠付け、切断箇所を燃焼さぜ
つつ溶断するものである。
High-purity oxygen gas is applied to the cut point to burn and fuse the cut point.

斯かるガス切断tL於いて、軟鋼の板厚60咽で5 r
rt / mrn程度の切断速度が理論的にはh」能で
あるとされでいるが、実際には板厚12mmで08〜0
.9 m /minが限度である。これは、予熱炎の熱
密度が低く切断点周囲を高速度で予熱し得ないことによ
る。
In such gas cutting tL, 5 r with a mild steel plate thickness of 60 mm.
Theoretically, a cutting speed of about rt/mrn is said to be capable of cutting at a cutting speed of 0.8 to 0.0 mm with a plate thickness of 12 mm.
.. The limit is 9 m/min. This is because the heat density of the preheating flame is low and the area around the cutting point cannot be preheated at a high speed.

これに対し、熱密度の高い熱源、即ちレーザ光により、
レーザ光を主切断エネルギとして溶断する方法が近年開
発されつつある。
On the other hand, a heat source with high heat density, namely laser light,
In recent years, methods of fusing and cutting using laser light as the main cutting energy have been developed.

第1図はレーザ光により切断する場合の一例を示してお
り、レーザ光(1)をレンズ(2)により切断点に集光
させ、被切断材(3)の切断点を浴融し、空気、酸素、
“アルゴン、窒素等のアシストガス(4)を切断点i/
i”:吹付けて溶融した金属を吹飛し、又アシストガス
(4)で溶融金属の跳返りを防止している。この切断に
供しないア/ストガスd:切断点を冷却するという弊害
を有しており、レーザ光の熱を有効に切断に利用できな
い。更に、レーザ光によって厚板を切断するためには、
大電力、大出力のレーザ発振器を要し、ラノニングコス
1、設備費が高くなシ、しかも取入の良質加工限度は板
厚が10闘前後である。
Fig. 1 shows an example of cutting with a laser beam, in which the laser beam (1) is focused on the cutting point by a lens (2), the cutting point of the material to be cut (3) is melted in a bath, and then air ,oxygen,
“Put the assist gas (4) such as argon or nitrogen at the cutting point i/
i”: Blows away the molten metal, and also prevents the molten metal from bouncing back with the assist gas (4). A/st gas that is not used for cutting d: Prevents the harmful effect of cooling the cutting point. Therefore, the heat of the laser beam cannot be used effectively for cutting.Furthermore, in order to cut a thick plate with a laser beam,
It requires a high-power, high-output laser oscillator, and the equipment cost is high, and the limit for high-quality processing is about 10mm plate thickness.

その他、酸素プラズマによる切断方法もあるが、該切断
方法では切断面がテーパ状となると共に電極ノズルの交
換を必要として稼動率が悪い。又、大電力を要し、騒音
が甚しい等の欠点がある。
There is also a cutting method using oxygen plasma, but this cutting method results in a tapered cut surface and requires replacement of the electrode nozzle, resulting in poor operating efficiency. Further, it has drawbacks such as requiring a large amount of electric power and producing significant noise.

本発明は斯かる実情を鑑みなしたものであって、レーザ
光により切断点の周囲の高速予熱を行いつつガス切断を
行うことを特徴とし、小入熱で厚板の高速切断を可能と
するものである。
The present invention has been developed in view of the above circumstances, and is characterized by performing gas cutting while rapidly preheating the area around the cutting point using a laser beam, thereby making it possible to cut thick plates at high speed with a small heat input. It is something.

以下図面を参照しつつ本発明の詳細な説明する。The present invention will be described in detail below with reference to the drawings.

第2図中、(5)はトーチ本体であり、該トーチ本体の
内部は中空となっており、中空部(6)にレンズ(2)
をホルダ(7)により固定しである。トーチ本体(5)
の先端部は逆円錐状であり、該先端部に前記中空部(6
)と同心の切頭逆円錐筒状間隙(8)を形成し、該間隙
(8)と図示しないアシストガス源とを接続する。又、
前記レンズ(2)で仕切られた先端部の逆円錐状の空間
はその頂部に於いてノズ/L口(9)で外部と連通せし
め、更に該窒tH]と1列示しない高純度酸素ガス源と
を接続する。
In Fig. 2, (5) is a torch body, and the inside of the torch body is hollow, and a lens (2) is installed in the hollow part (6).
is fixed by a holder (7). Torch body (5)
The tip has an inverted conical shape, and the hollow part (6
), and a truncated inverted conical cylindrical gap (8) is formed concentric with the gap (8), and the gap (8) is connected to an assist gas source (not shown). or,
The inverted cone-shaped space at the tip partitioned by the lens (2) communicates with the outside through a nozzle/L port (9) at the top thereof, and further contains the nitrogen tH] and high-purity oxygen gas not shown in the first row. Connect to the source.

図示しないレーザ源よりトーチ本体中27’iVr (
6)にレーデ光(1)を導き、レーザ光(1)がノズル
口(9)の位置で集束する様レンズの焦点距離、レンズ
の取付位置等を定める。
27' iVr (
6) The laser beam (1) is guided to the laser beam (1), and the focal length of the lens, the mounting position of the lens, etc. are determined so that the laser beam (1) is focused at the position of the nozzle opening (9).

次に本発明の作用について説明する。Next, the operation of the present invention will be explained.

アンストガス(4)を前記間隙より噴出させ、レーザ光
(1)を被切断材(3)に照射する。レーづ光(1)は
ノズル口(9)の位置で集束しているので、被WJ新材
(3)の表面では切断点(、)の周囲所要範[川に迄広
カッている。レーザ光(1)により被切断利(3)Ir
e切断点(cL)及びその近傍が燃焼反応可能な迄予勿
νされ、着火スポットができる。該着火スポットに整圧
した高純度酸素ガス(10をノズル口(9) ヨ!:1
噴出する。酸素ガス00はノズル口(9)によって?流
され着火スポットの中心部に吹付けられ、被切断利(3
)と酸化燃焼反応を起し、酸化燃焼しη三成したスラグ
を下方へ吹飛ばす。
The unstuck gas (4) is ejected from the gap, and the material to be cut (3) is irradiated with the laser beam (1). Since the laser beam (1) is focused at the position of the nozzle opening (9), the surface of the new material to be WJed (3) is widened to the required range around the cutting point (,). (3) Ir to be cut by laser light (1)
The e-cutting point (cL) and its vicinity are heated until a combustion reaction is possible, creating an ignition spot. Pressure-regulated high-purity oxygen gas (10 is at the nozzle port (9) at the ignition spot. Yo!:1
gush. Oxygen gas 00 is supplied by the nozzle port (9)? It is sprayed to the center of the ignition spot, and the cutoff profit (3
) and causes an oxidative combustion reaction, and the slag formed by oxidative combustion and η is blown downward.

而して、1・−テを矢印(b)の方向へ移動すtL i
切断が行われる。
Then, move 1-te in the direction of arrow (b) tL i
A disconnection is made.

ここで、レーザ光(1)の照射面積は切断点(酸素ガス
の流束面積)より充分広くしであるので、切断点より広
がった部分のレーザ光は予熱作用をし、しかもレーザ光
(1)は熱密度が高いので急速予熱とする。
Here, since the irradiation area of the laser beam (1) is sufficiently wider than the cutting point (oxygen gas flux area), the portion of the laser beam that spreads out from the cutting point has a preheating effect, and moreover, the laser beam (1) ) has a high heat density, so rapid preheating is required.

従って、トーチを移動させても酸素ガス00)は常に充
分予熱された着火スポットに噴射されることになり、し
かも予熱速度が大きいので1・−チの移動速度を太きく
しても円滑な切断作業が可能である。
Therefore, even if the torch is moved, the oxygen gas 00) will always be injected to a sufficiently preheated ignition spot, and since the preheating speed is high, even if the torch movement speed is increased, the cutting operation will be smooth. is possible.

ここで、レーザ光(]、)の照射面積、レーザ光の強度
、酸素ガスθ()の圧力を適宜考慮してやれば。
Here, the irradiation area of the laser beam (), the intensity of the laser beam, and the pressure of the oxygen gas θ() should be taken into consideration as appropriate.

快調の板厚60闘で3 m / mtn迄の切断が可能
である。
It is possible to cut up to 3 m/mtn with a board thickness of 60 mm.

viI、前記しだアシストガス(アルゴン、ヘリュウム
、酸素、二酸化炭素等)は溶融金属が跳返す、ノズル口
(9)、レンズ(2)に付着するのを防止するものであ
り、低圧ガスでよい。
viI, the above-mentioned assist gas (argon, helium, oxygen, carbon dioxide, etc.) is to prevent molten metal from rebounding or adhering to the nozzle port (9) and lens (2), and may be a low-pressure gas. .

第6図は本発明の他の実施例を示すもので、し′−リ“
光(1)を被切断拐(3)の表1T11より下方で集束
する様にして、照射面積を所要の大きさにしたものであ
る。
FIG. 6 shows another embodiment of the present invention.
The light (1) is focused below the table 1T11 of the beam to be cut (3), so that the irradiation area is set to the required size.

以上述べた如く本発明によれば、 (1)  レーザ光と酸素ガスによる切断で、レーザ光
により直接切断するのではなく単に予熱す八ばよいので
小出力レーザでよく、入熱量が少なく、消費エネルギの
少ない切断ができる、((り1人熱量が少ないので高精
度の切断、歪の少ない切断が可能である、 (+ii)  レーザ光により急速予熱が可能であるの
で切断速度を大幅に増大させることができる、(1■)
  プラズマ切断の様に電極ノズルの交換が不要なので
無人運転が可能である、 (V)  カーフ幅が小さく、プラズマ切断の様にアー
クを使用しないのでフユームができない、(■1)騒音
が発生しにくい、 管種々の優れた効果を発揮する。
As described above, according to the present invention, (1) Cutting is performed using a laser beam and oxygen gas; instead of cutting directly with the laser beam, only preheating is sufficient, so a low output laser is required, the amount of heat input is small, and the consumption is low. Cutting can be done with less energy ((1) Since the amount of heat consumed by one person is small, it is possible to cut with high precision and with less distortion. (+ii) Rapid preheating is possible with laser light, which greatly increases the cutting speed. I can do it (1■)
Unlike plasma cutting, there is no need to replace the electrode nozzle, so unmanned operation is possible. (V) The kerf width is small and no arc is used, unlike plasma cutting, so there is no fumes. (■1) Less noise is generated. , The tube exhibits various excellent effects.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のレーザ光による切断を示す説門口、第2
図は本発明を実施する為1・−チの説明図、第6図d、
本発明の他の実施例の説明図である。 (1)il−ル−ザ光、(2)はレンズ、(3) (l
j被切断材、(5)は1・−チ本体、(9)はノズル口
、θOは酸素ガスを示す。 特許出廓人 石川島播磨重工業株式会社
Figure 1 shows the entrance gate and the second diagram showing cutting using conventional laser light.
The figures are explanatory diagrams of steps 1 and 6 for carrying out the present invention;
FIG. 6 is an explanatory diagram of another embodiment of the present invention. (1) il-loser light, (2) lens, (3) (l
j is the material to be cut, (5) is the 1-chi body, (9) is the nozzle opening, and θO is oxygen gas. Patent distributor Ishikawajima Harima Heavy Industries Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 1)レーザ光を所要面積で被切断制に照射せしめるレン
ズと、該照射面積より小なる流束面積でレーザ光の照射
中心に酸素ガスを噴射し得るノズル口を備えたことを特
徴とするレーザ・ガス切断装置。
1) A laser characterized by being equipped with a lens that irradiates a laser beam in a desired area to be cut, and a nozzle opening that can inject oxygen gas to the center of irradiation of the laser beam with a flux area smaller than the irradiation area.・Gas cutting equipment.
JP57197394A 1982-11-10 1982-11-10 Laser gas cutting equipment Pending JPS5987996A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57197394A JPS5987996A (en) 1982-11-10 1982-11-10 Laser gas cutting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57197394A JPS5987996A (en) 1982-11-10 1982-11-10 Laser gas cutting equipment

Publications (1)

Publication Number Publication Date
JPS5987996A true JPS5987996A (en) 1984-05-21

Family

ID=16373769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57197394A Pending JPS5987996A (en) 1982-11-10 1982-11-10 Laser gas cutting equipment

Country Status (1)

Country Link
JP (1) JPS5987996A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2643006A1 (en) * 1989-02-14 1990-08-17 Air Liquide GAS FOR LASER CUTTING OF CARBON STEELS, AND LASER CUTTING PROCESS
EP0600249A1 (en) * 1992-11-30 1994-06-08 Linde Aktiengesellschaft Procedure for material removing treatment of work pieces with laser beam and laser nozzle
US5651904A (en) * 1991-11-19 1997-07-29 Advanced Technik Gmbh Method for removing material from metal workpieces moved relative to the removal tool
US5728993A (en) * 1995-08-05 1998-03-17 The Boc Group Plc Laser cutting of materials with plural beams
US5786561A (en) * 1994-01-25 1998-07-28 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Nozzle assembly for laser beam cutting
WO1998058760A1 (en) * 1997-06-20 1998-12-30 Tanaka Engineering Works, Ltd. Laser cutting method and laser cutter
US6316743B1 (en) 1998-09-09 2001-11-13 Tanaka Engineering Works, Ltd. Laser piercing method, laser processing nozzle, and laser cutting apparatus
US6489588B1 (en) 1999-11-24 2002-12-03 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
US6531682B1 (en) * 1998-01-29 2003-03-11 Trodat Gmbh. Processing head for a laser engraving or cutting device
WO2006038152A1 (en) * 2004-10-05 2006-04-13 Koninklijke Philips Electronics N.V. Method for laser dicing of a substrate

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2643006A1 (en) * 1989-02-14 1990-08-17 Air Liquide GAS FOR LASER CUTTING OF CARBON STEELS, AND LASER CUTTING PROCESS
US5651904A (en) * 1991-11-19 1997-07-29 Advanced Technik Gmbh Method for removing material from metal workpieces moved relative to the removal tool
US5847358A (en) * 1991-11-19 1998-12-08 Advanced Technik Gmbh Method and apparatus for removing material from metal workpieces moved relative to a laser removal tool
EP0600249A1 (en) * 1992-11-30 1994-06-08 Linde Aktiengesellschaft Procedure for material removing treatment of work pieces with laser beam and laser nozzle
US5786561A (en) * 1994-01-25 1998-07-28 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Nozzle assembly for laser beam cutting
US5728993A (en) * 1995-08-05 1998-03-17 The Boc Group Plc Laser cutting of materials with plural beams
WO1998058760A1 (en) * 1997-06-20 1998-12-30 Tanaka Engineering Works, Ltd. Laser cutting method and laser cutter
KR100359654B1 (en) * 1997-06-20 2002-11-04 가부시키가이샤 다나카 세이사쿠쇼 Laser cutting method and laser cutter
US6531682B1 (en) * 1998-01-29 2003-03-11 Trodat Gmbh. Processing head for a laser engraving or cutting device
US6316743B1 (en) 1998-09-09 2001-11-13 Tanaka Engineering Works, Ltd. Laser piercing method, laser processing nozzle, and laser cutting apparatus
US6489588B1 (en) 1999-11-24 2002-12-03 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
US6660963B2 (en) 1999-11-24 2003-12-09 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
WO2006038152A1 (en) * 2004-10-05 2006-04-13 Koninklijke Philips Electronics N.V. Method for laser dicing of a substrate

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