JPS5989021A - Chip-shaped piezoelectric oscillation parts - Google Patents

Abstract

PURPOSE:To prevent an increment of resonance resistance or generation of a minute spurious by fixing the piezoelectric oscillation element in a case in unparallel to the inner surface of the case. CONSTITUTION:A piezoelectric oscillation element 1 is stored in a cylindrical case 2, and caps 31 and 32 are put on both sides of the case 2. These caps are connected electrically to the lead-out electrodes of the element 1 by means of conductive connection mambers 41 and 42 such as a conductive adhesive. Furthermore the caps 31 and 32 contain the 1st part corresponding to the case 2 and the 2nd part extending along the side face of the case 2 from the 1st part respectively. The 1st part of the cap 31 protrudes outside the case 2 to form a projected part 311.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention This invention relates to piezoelectric vibrating chips, and more particularly to piezoelectric vibrating chips having an improved structure for holding or positioning an energy-containing piezoelectric vibrating element.

DESCRIPTION OF THE PRIOR ART FIG. 1 is a perspective view of the background of the present invention and illustrating an example of a chip-shaped piezoelectric vibrating element that can be used in the present invention. The piezoelectric vibrating element 1 includes a piezoelectric plate 110 made of, for example, ceramic, and opposing vibrating electrodes 111 and 12175ζ are formed on both surfaces of the plate, respectively.

Vibrating electrodes 111 and 121 cooperate to cause energy-confining, thickness-wide vibrations in the piezoelectric grating. These vibrating electrodes 111 and 121 are -'ff
1-'D, lead electrodes 12 and 122 are connected to 1-'C lead-out voltages ff11:13 and 123, respectively.

Such a piezoelectric vibrating element 1 is housed in a case 2 as shown in FIG. The case 2 is cylindrical with openings at both ends, and the openings are covered by caps 31 and 62, respectively.The caps 61 and 62 and the extraction electrode of the piezoelectric element 1 housed in the case 2 115 and 126 (FIG. 1) are CWI electrically connected by conductive connecting members 41 and 42, such as conductive paint or creamy solder.In this way, a chip-shaped piezoelectric vibrating component is produced. It will be done.

Since such chip-shaped piezoelectric vibrating components can be made inexpensive and compact, they can be used in a variety of fields, but it has been thought that they have the following problems that need to be solved. .

That is, in a chip-shaped piezoelectric vibrating component using the above-mentioned cap, in some cases, before the conductive paint solidifies, due to the weight of the element 1, the temperature rises to 1 °C1 in Fig. 2.
As shown by 1, the element may go down. On the other hand, when storing the element 1 in the case 2, it was difficult to leave a fixed space of 1 year above and below the element. Gakatsu °C
1. As a result, in the above configuration, if the inner bottom surface of the case 2 is completely flat and the element 1 remains horizontal,
41.42
If it is completely removed, the same is true even if it is not orthogonal to the main plane of contact between the element 1 and the inner bottom surface of the case 2. Since it is an energy-confining type, there is no problem if the lead polarization or extraction electrode part comes into contact with the case, but if the vibrating electrode part comes into contact with the case, not only will the resonance resistance increase, but the resonant frequency will be reversed. °C slight spurious occurs between or near the resonant frequency °C
Shimari. This kind of thing looks like a chip °! The C1 problem occurs when a dynamic component is used as an oscillator in a loss generating circuit or a discriminator element in a 7M circuit.

OBJECTS OF THE INVENTION Therefore, an object of the present invention is to provide a chip-shaped piezoelectric vibrating component in which at least the vibrating portion of the piezoelectric vibrating element can be prevented from contacting the inner wall of the case.

SUMMARY OF THE INVENTION A chip-shaped piezoelectric vibrating component according to the present invention includes a single shaft-shaped case in which a single vibrating element is housed, and a cap formed of a thin plate of a conductive material to be placed over openings at both ends of the case. , and a conductive connecting member for electrically connecting each of the pair of electrodes of the piezoelectric vibrating element to the corresponding cap, and the pressure vibrating element is fixed to the inner surface of the case in a non-parallel state.

Effects of the Invention According to the present invention, since the piezoelectric vibrating element is fixed in the case in a non-parallel state with the inner surface of the case, the vibrating portion of the piezoelectric vibrating element does not come into contact with the case. Therefore, problems such as an increase in resonance resistance or generation of minute spurious noises do not occur, and it can be effectively used as an oscillator or frequency disk 17 emitter.

The above-mentioned objects of the invention and the objects and features of the pond will become clearer from the following detailed description with reference to the drawings.

DESCRIPTION OF THE EMBODIMENTS As the piezoelectric vibrating element 1 of the present invention, a conventional piezoelectric vibrating element as shown in FIG. 1 can be used. In FIG. 1, the vibration m-poles 111 and 121 are in contact with and read out from the extraction electrodes 113 and 123 through thin lead electrodes 112 & 122, respectively, but the connection electrodes or lead electrodes 112 and 1221-1:, the piezoelectric plate C may be formed over the gold part. The piezoelectric vibrating element 1 is housed in a cylindrical case 2 made of, for example, synthetic wood 11, alumina (ceramic), or glass. The case 2 has openings at both ends, and gaps 51 and 62 are respectively placed over the ends.

The caps 61 and 62 are 4-painted, respectively.
Conductive connecting members 41 and 42, such as cream solder or other conductive adhesive, are electrically connected to the leads 113 and 123 (FIG. 1) of the C1 element 1, respectively, and V2.

The caps 31 and 62 are respectively attached to the cylindrical case 2.
and a second portion extending along the side surface of the case 2 from the first portion. A protrusion 611 that protrudes outward from the case 2 is formed in the first portion of one of the caps 31 . Note that since these caps 31 and 52 are formed of thin plates of a conductive material such as aluminum or copper, such protrusions 311 can be easily formed by known press molding or the like. One end of the C1 element 1 then engages with the recess formed by the protrusion 311 thereof.

Shidatsu'C1 In this implementation row, element 1 is the third A
As shown in the figure, it is housed diagonally in the case 2. At this time, the extraction electrode 123 (
The part shown in FIG.
The parts corresponding to 11 and 121 (Fig. 1) are
[There is no contact with the inner wall of case 2.] That is, the vibrating portion of the element 1 is always separated by a space that forms the inner wall of the case.

FIG. 4 is an illustrative cross-sectional view showing another embodiment of the present invention. In this embodiment, the shape of the cap 51 is different from that shown in FIG. 3A. That is, FIGS. 3A and 3B.
In the embodiment shown in the figure, the protruding part 1 protruding outward from the case 2 forms a stepped part for positioning the 'C' position, whereas in the embodiment shown in FIG. A "C step part" is formed by the recessed part 312-.
, one end of the element 1 is held at the stepped portion formed by the recess 312. In this embodiment, when looking at the vibrating electrode portion formed approximately at the center of the element 1, a space that forms the inner wall of the case 2 is always separated.

FIG. 5 is an illustrative cross-sectional view showing still another embodiment of the present invention. In this embodiment, as compared to the embodiment shown in FIG. 4, the cap 52 is also formed with four parts 622 that protrude inward of the case 2, similarly to the cap 31. This allows °c
1. With the positioning of element 1, the mechanical stability becomes even greater.

A chip-shaped piezoelectric vibrating component as shown in FIG. 5 can be manufactured as shown in FIGS. 6A and 6B. A cylindrical case 2 with both ends open is prepared, and a cap 61 having four parts 312 is placed on one end. At this time, solder cream or conductive paint 41 is applied in advance. Next, element 1 as shown in FIG.
is inserted into the case from the other end of the open case 2, and positioned as shown by the two-dot chain line in FIG. 6A.

Then, as shown in Fig. 6A, when the element 1 is rotated 180° with the longitudinal direction as the rotation axis, the other end of the element 1 falls due to its own weight to come into contact with the inner wall of the case 2, as shown in Fig. 6B. do. Thereafter, a cap 32 coated with a conductive base or conductive paint 42 is placed over the other end of the case 2. In this way, the embodiment shown in FIG. 5 is completed.

FIG. 7 is an illustrative cross-sectional view showing still another embodiment of the present invention. This embodiment is a variation of that shown in Figures 3A and 3B. That is, in this embodiment, the cap 51
The same C% as shown in Figure 2 is used.

The C1 element 1 is housed and fixed obliquely to the inner wall of the case 2. An extreme example of a slanted structure is shown in Figure 7, 'C', but the invention is not limited to this. 0.05m or more) is sufficient. 7th
A chip-shaped piezoelectric moving component as shown in the figure can be made as shown in FIG. Solder cream or conductive paint 42
is applied to the cap 62 in advance. Next, this is put into the recess 51 of the transfer jig 50, and the element 1 is put into the case 2 from the C. Then, as shown in FIG. 8, the element 1 becomes oblique with respect to the inner wall or the axial direction of the case 2. J) Cap 61 coated with solder cream or conductive paint 41 in advance
Put it in case 2. The method shown in FIGS. 6A and 6B may also be used. Alternatively, the case 2 may be placed in a horizontal position, and the C element 1 may be inserted with spaces left and right above and below.

In this case, the element 1 may be inserted in advance so as to be oblique to the inner wall of the case 2, or it may be inserted so as to be as parallel as possible and then be naturally inclined. In addition, in the structure shown in Figure 7, before the conductive paint solidifies, due to the weight of element 1,
There may be a risk that the element 1 will be lowered as shown by 11 in the figure, and the vibrating part of the element 1 will come into contact with the inner bottom surface of the case 2, thereby disturbing the C vibration.

However, in reality, such a result does not occur; in other words, the imaging amplitude of element 1 is so small that it is imperceptibly small, so a small amount of space is sufficient. On the other hand, since the self-zero weight of J element 1 is extremely small, the conductivity is 6
A79, A, Yo, □, Ia1゜This 9Akatsu'C descend and push aside the conductive paint 41 and 42 attached to the lower surface of both ends of the element 1'[, the inner bottom surface of the case 2 It is highly unlikely that they are closely parallel to each other. In manufacturing,
Since it is difficult to insert element 1 parallel to the inner surface of case 2, in reality it hardens in an oblique position and C
It is possible to put it away. Furthermore, it is difficult to finish the inner surface of case 2 completely flat, and from this point of view,
There may be a slight space between the vibrating part and the vibrating part. Due to the combination of these factors, vibrations are not hindered even in the structure shown in FIG. 7. The same is true for C in the case where they do not intersect, and in any case, vibrations are not hindered in C.

In addition, in the above-mentioned embodiment, C used circular shapes or square shapes for the cylindrical case and the cap, respectively.
For example, it is also possible to use a circular cap in a case where only both ends are circular and the remaining portion is square.

As described above, according to the present invention, the temperature inside the case is
Since the vibrating portion of the piezoelectric element is always housed with a space serving as a case separated from it, an increase in sympathetic resistance and generation of minute spurious waves do not occur.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an example of a piezoelectric element that can be used in the parentheses invention that forms the background of this invention. FIG. 2 is an illustrative cross-sectional view showing an example of a chip-shaped piezoelectric vibrating component, which is the background of the present invention. FIGS. 6A and 6B are views showing an embodiment of the present invention, with FIG. 3A showing a sectional view thereof, and FIG. 6B showing an external perspective view thereof. FIGS. 4 and 5 are illustrative cross-sectional views showing other embodiments of the present invention, respectively. FIGS. 6A and 6B are illustrative views showing the process of making the chip-shaped piezoelectric vibrating component shown in FIG. 5. FIG. 7 and FIG. 8 are illustrative cross-sectional views of still other embodiments of the present invention, respectively. In the figure, 1 is a piezoelectric element, 111.121 is a vibrating electrode, 113.123 is a drawer, 2 is a case, 31.32 is a cap, 611 is a protrusion, 512.
522 is a protrusion, 41.42 is a conductive connecting member, patent applicant Murata Manufacturing Co., Ltd. 40

Claims (1)

[Scope of Claims] ill An energy-containing piezoelectric vibrating element in which a pair of vibrating electrodes are formed; a cylindrical case having openings formed at both ends thereof and in which the piezoelectric imaging element is housed; a cap formed of a thin plate of conductive material to be placed over the openings at both ends of the case; and a conductive connecting member for electrically connecting each of the pair of vibrating electrodes of the piezoelectric vibrating element to the corresponding cap. The piezoelectric vibrating element is a chip-shaped piezoelectric vibrating component fixed to the inner surface of the case in a non-parallel state.