JPS5992193A - Backing plate for laser working - Google Patents

Abstract

PURPOSE:To reduce the power density of a beam with a small volume by disposing a fume suction port, and a reflection surface and absorption surface for a beam in the cavity under the beam working part. CONSTITUTION:A part of a laser beam 10 transmits the material 12 to be worked and the beam 10 is irradiated directly to the lower side where there is no material 12 in the stage of working the material 12 in a beam working part 14 by the condensed beam 10. The transmitted or irradiated beam is reflected and spreaded in a lateral direction on a reflection surface 22 by which the reflected light is absorbed on an absorption surface 26. The surface 26 does not have a perpendicular wall surface and disperses and absorbs the beam 10 in the widest possible area. The power density of the beam 10 is decreased with the small volume even if said powder density is high.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is a back plate for laser processing, especially in laser welding, which absorbs unnecessary laser beams in order to hold the workpiece and protect jigs, tables, etc. This invention relates to a laser processing backup.

Is this Yuzu laser processing back plate suitable for laser cutting? :l When welding, the laser beam is irradiated! 17- To avoid beam interference on the back side of the machining part, it is necessary to keep the beam at a required distance from the machining part and to prevent unnecessary laser beams passing through the workpiece from machining the lower jig. There is a necessary soda that absorbs and processes Zabeam.

By the way, laser beam absorption processing kl1 is difficult in processing using a high-output laser because the power density is fixed. For example, when focusing a 5 KW laser beam with a diameter of 50 mm using a focusing tilt and a 2001IIK lens, The laser beam irradiates the beam at a distance of 200 degrees downward from the part of
/c,,,t 4'A degrees. However, the existing Ae (
-AI, (1, or tJCu +CuS blackening process absorption moon, t200 ~ 3 tl 0W10π2 beam processing is the limit, so the distance between the beam processing part and the back plate on the lower side is 200 There was one that had the disadvantage of requiring a back plate that held the lower part of the pouch/+U to hold the -C height iL'6.

The present invention has been developed in view of the above-mentioned conventional problems, and its purpose is to create a simple and compact laser beam capable of holding the workpiece U and effectively absorbing laser beams unnecessary for processing. 'Our objective is to provide a pack gray for processing.

” - In order to achieve the above object, the present invention is designed to hold the workpiece in a non-contact manner and around the beam processing section where the laser beam is irradiated, and to provide a fume suction port in the cavity below the beam processing section. A laser beam reflecting surface and a laser beam absorbing surface opposing the laser beam reflecting surface are disposed.

Hereinafter, preferred embodiments of the present invention will be described based on the drawings.

FIG. 1 is a cross-sectional view showing one embodiment of the present invention.

In the figure, 10 is a laser beam, 12 is a liquid injection system, 14 is a beam processing section to which the laser beam 10 is irradiated, and 16 is a back plate for laser processing that holds the workpiece 12.

In the beam machining section x4Q device, the back plate 16 is provided with a through hole 18 so that the workpieces 12 and 11 are kept in a non-contact state, and the liquid adhesion system 12 is held around the through hole 18. Beam forming and beam processing 1Xl
(It has a structure in which a cavity 20 communicating with the through hole 18 is formed below the hole 14.

In the sky Jj 20, a protrusion 24 is arranged on the optical axis of the laser beam 10 and has a three-inch cross-section shaped outer peripheral surface with a -9 beam reflecting surface 22 for beam diffusion. A laser beam absorption surface 26 is disposed facing the reflection surface 22 and absorbs the reflected laser beam 10.
A fume suction [128] is provided near the reflective surface 22 in order to prevent fume, dross, etc. generated during processing from adhering to the reflective surface 22 as much as possible.

Further, a water cooling duct 30 is disposed behind the reflecting surface 22 and the absorbing surface 26, and cooling water is passed through these ducts so that they are constantly cooled.

The above is an example configuration of the present invention. According to this configuration,
When the laser beam 10 is condensed and the workpiece 12 is processed in the beam laser 11 processing section 14, a part of the beam is
2, and the beam is directly irradiated downward at the portion where the round-shaped moon 12 is not present. These transmitted beams or irradiated beams): 1.

First, the light is reflected and diffused laterally by the reflective surface 22, and the reflected light is absorbed by the absorbing surface 26. In this case, the absorbing surface 26 does not have a wall surface perpendicular to the beam, and is configured to disperse and absorb the beam over as wide a surface as possible, so even when the power density of the laser beam 10 is high, the power density can be achieved in a small volume. can be reduced, and unnecessary laser beams can be effectively absorbed.

FIG. 2 is a cross-sectional view showing another embodiment of the present invention,
In this embodiment, the reflective surface 22 is formed to be inclined so as to diffusely reflect the laser beam 10 in one direction, and the light reflected from the reflective surface 22 is absorbed by the absorbing surface 26. It has the same configuration as shown in the figure, and can obtain the same effect as in the case of FIG. 1.

Fig. 3 fJ is a cross-sectional view showing still another embodiment of the present invention, except that in this embodiment, the reflecting surface 22 is divided into triangular shapes of i number of reflections, and the reflected light is diverged. te1
It has the same configuration as that in FIG. 1, and therefore can obtain the same effect as in the case of FIG.

FIGS. 4 and 5 are cross-sectional views showing other embodiments of the present invention, in which the reflective surface 22 is formed in an arcuate shape corresponding to FIGS. 1 and 2, respectively. , is constructed similarly to FIGS. 1 and 81!2, except that 1j is diverged, and is therefore identical to FIGS. This effect can be obtained.

In addition, reflective surface 22iJ: Diffuses laser beam 1() 1i
Any shape can be selected as long as the configuration allows the light to be emitted.

According to the present invention, the laser beam is diffusely reflected in the lateral direction on the reflective surface to widen the absorption surface, so the power density of the laser beam can be reduced in a small volume. It is possible to simplify and miniaturize the back plate 1 for laser processing and the overall +11 configuration.
In addition, since a fume suction port is placed near the reflective surface, the reflective surface will not be contaminated with fume or dross, and will be able to withstand long-term use.
It's a Jt effect.

[Brief explanation of the drawing]

Figure 1 is a cross-sectional view showing one embodiment of the present invention, and Figures 2-1 to 5 are cross-sectional views showing other embodiments of the present invention. are given the same reference numerals, 10 is a laser beam, 12tJ' is a haka system, 14 is a beam processing section, 16 is a back plate for laser processing, 20 cavities, 2
2 is a laser beam reflection surface, 26 is a laser beam absorption surface,
28 is a pume suction port. Agent Patent attorney Shin Kuzuno - (1 other person) Figure 1 Figure 2 Figure 3 Figure 4 Figure 5

Claims (1)

[Claims] +11 In the beam processing section where the laser beam is irradiated, the workpiece is held in a non-contact manner and around it, and the fume is sucked into the cavity under the beam processing. A grasshopper play for laser processing 1, characterized in that a laser beam absorption surface is provided.