JPS5999638A - Electronic parts assembling jig - Google Patents
Electronic parts assembling jigInfo
- Publication number
- JPS5999638A JPS5999638A JP57208469A JP20846982A JPS5999638A JP S5999638 A JPS5999638 A JP S5999638A JP 57208469 A JP57208469 A JP 57208469A JP 20846982 A JP20846982 A JP 20846982A JP S5999638 A JPS5999638 A JP S5999638A
- Authority
- JP
- Japan
- Prior art keywords
- assembly jig
- electronic component
- glass
- electronic parts
- assembling jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/18—Assembling together the component parts of electrode systems
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（発明の技術分野）
本発明は電子部品、特にガラスにより各部材を係合して
なる電子部品、の組立治具に関する。DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to an assembly jig for electronic components, particularly electronic components formed by engaging each member with glass.
（発明の技術的背景及びその間顕点）
カラーブラウン管の電子銃のように、複り）［に構成さ
れた部材を精度よく配置して組立てる技術として、帽熱
材でなる＃１１立治具の４二に１方棒状のガラスを載置
し、このカラスを加熱して軟化させたのち、所定の配置
に組合せたｉ１％品を軟化したガラスに押圧してカラス
とともに一体化することが行なわれている。っこの場合
、ガラスの軟化する温度は７００〜１０００° である
ので、組立治具には高温での応力が繰返し加わることに
なる。従来、組立治具には、耐熱性の観１点から剛熱羽
が用いられている。しかしながら、軟化したガラスは金
属相と濡れやすく、全灯）製の治具では繰返しの使用に
伴なう摩耗が大きく、所定の寸法精度を維持することが
困離であった。）またアルミナセラミックを用いること
も考えられたが、アルミナは耐熱衝撃性及び高温での強
度が弱く実用に耐えるものではなかった。(Technical background of the invention and its highlights) As a technique for accurately arranging and assembling members composed of multiple components, such as the electron gun of a color cathode ray tube, a #11 standing jig made of cap heat material was developed. A one-sided bar-shaped glass is placed on the glass plate, the glass is heated and softened, and then the i1% products assembled in a predetermined arrangement are pressed against the softened glass and integrated with the glass. ing. In this case, since the softening temperature of glass is 700 to 1000 degrees, stress at high temperatures is repeatedly applied to the assembly jig. Conventionally, rigid heat blades have been used in assembly jigs from the viewpoint of heat resistance. However, softened glass easily wets with the metal phase, and jigs made of 100% light bulbs suffer from significant wear due to repeated use, making it difficult to maintain a predetermined dimensional accuracy. ) It was also considered to use alumina ceramic, but alumina had poor thermal shock resistance and strength at high temperatures and was not suitable for practical use.
（発明の目的）
本発明は、耐摩耗性、耐熱性に優れた電子部品の組立治
具を提供することを目的とする。(Objective of the Invention) An object of the present invention is to provide an assembly jig for electronic components that has excellent wear resistance and heat resistance.
（発明の概要）
すなわち、本発明の組立治具は窒化珪素を主成分とする
焼結体でなることを特徴とする。(Summary of the Invention) That is, the assembly jig of the present invention is characterized by being made of a sintered body containing silicon nitride as a main component.
本発明の組立治具の一実施例を第１図に示す。An embodiment of the assembly jig of the present invention is shown in FIG.
第１図の組立治具は、ガラスが載Ｖｔ、される頂部１及
び組立装置にへ“、置される基部２から構成される。The assembly jig of FIG. 1 consists of a top part 1 on which the glass is mounted and a base part 2 which is placed on the assembly apparatus.
このような形状の電子部品組立治具は次のようにして製
造される。まず、焼結助剤（Ｙ、 Ｕｓ 、Ａ／、 ０
゜等）が添加された窒化珪素粉末をホットプレス、また
は圧縮成型後普通焼結により所定の形状に成形する２、
次に得られた焼結体に第１図に示すように頂部及びテー
パ面を研削加工により形成する８また窒化珪素はガラス
とは個れに（いセラミックであるが焼結体の気孔率が余
り大きいとカラスと個れやすくなるため、気孔率は１０
％未満であることがよい。An electronic component assembly jig having such a shape is manufactured as follows. First, sintering aid (Y, Us, A/, 0
2. Molding the silicon nitride powder to which 2.
Next, the top and tapered surfaces of the obtained sintered body are formed by grinding as shown in Fig. If it is too large, it will easily break up, so the porosity is 10.
It is preferable that it is less than %.
（発明の実施例）
第１図に示した組立治具（長さ３Ｑｍｇ、高さ４０門）
を次表に示す材料で形成して特性を比較した。その結果
を同表中に示す。(Embodiment of the invention) Assembly jig shown in Fig. 1 (length 3Qmg, height 40 gates)
were formed using the materials shown in the table below and their properties were compared. The results are shown in the same table.
以上の実施例からも明らかなように本発明の組立治具は
、急激な熱変化に対しても１Ｉｌ１７壊しない高いｌ熱
衝撃性を有しているばかりでなく、溶融したカラスに接
触しても化学的反応性が小さく、また機械的強度が大き
いためにｔＩ僅成部利を押圧されても損傷することがな
い。なかでもホットプレスしたものは優れているう従っ
て従来の組立治具と比較して、極めて優れた特性を備え
たものであるつAs is clear from the above examples, the assembly jig of the present invention not only has high thermal shock resistance that does not break even under sudden thermal changes, but also has high thermal shock resistance that does not break when exposed to sudden thermal changes. Since it has low chemical reactivity and high mechanical strength, it will not be damaged even if it is pressed with a small amount of pressure. Among these, hot-pressed ones are superior, and therefore have extremely superior properties compared to conventional assembly jigs.
第１図は本発明の組立治具の一実施例を示す斜視図であ
る。
１・・・頂 部
２・・・基 部
代理人弁理士 則 近 恵 佑
（ほか１名）
第１ 口FIG. 1 is a perspective view showing an embodiment of the assembly jig of the present invention. 1...Top 2...Base Patent attorney Nori Chika Megumi (and 1 other person) 1st mouth
Claims (4)
部品組立治具。(1) An electronic component assembly jig made of a sintered body whose main component is silicon nitride.
ものである特許請求の範囲第１項にハ１ム戦の電子部品
組立治具。(2) The electronic component assembly jig for Hamamu as set forth in claim 1, wherein the electronic component is formed by a ladle being engaged with glass.
ある特許８１“を求の範囲第１項に記載の電子部品組立
治具。(3)? q An electronic component assembly jig as set forth in item 1 of the scope of patent 81, which is an electron gun for an electronic component color cathode ray tube.
囲第１項に記載の電子部品組立治具。(4) The electronic component assembly jig according to claim 1, wherein the sintered body has a porosity of less than 10%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57208469A JPS5999638A (en) | 1982-11-30 | 1982-11-30 | Electronic parts assembling jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57208469A JPS5999638A (en) | 1982-11-30 | 1982-11-30 | Electronic parts assembling jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5999638A true JPS5999638A (en) | 1984-06-08 |
Family
ID=16556690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57208469A Pending JPS5999638A (en) | 1982-11-30 | 1982-11-30 | Electronic parts assembling jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5999638A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61286248A (en) * | 1985-06-10 | 1986-12-16 | Toshiba Corp | Retaining jig for sealing parts |
| JPS61206643U (en) * | 1985-06-13 | 1986-12-27 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51126756A (en) * | 1975-04-25 | 1976-11-05 | Sony Corp | Method of manufacturing electron gun structure and jig therefor |
-
1982
- 1982-11-30 JP JP57208469A patent/JPS5999638A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51126756A (en) * | 1975-04-25 | 1976-11-05 | Sony Corp | Method of manufacturing electron gun structure and jig therefor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61286248A (en) * | 1985-06-10 | 1986-12-16 | Toshiba Corp | Retaining jig for sealing parts |
| JPS61206643U (en) * | 1985-06-13 | 1986-12-27 |
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