JPS6012811A - Piezoelectric oscillation parts - Google Patents
Piezoelectric oscillation partsInfo
- Publication number
- JPS6012811A JPS6012811A JP12087283A JP12087283A JPS6012811A JP S6012811 A JPS6012811 A JP S6012811A JP 12087283 A JP12087283 A JP 12087283A JP 12087283 A JP12087283 A JP 12087283A JP S6012811 A JPS6012811 A JP S6012811A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- electrode
- covers
- parts
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000010355 oscillation Effects 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000000605 extraction Methods 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（技術分野）
本発明は圧電振動部品に関し、より詳しくは、プリント
回路基板等へ直接半田付けするチップ状の圧電振動部品
に関するものである。゛（従来技術）
従来より、たとえば第１図に示すように、入力端子１．
共通端子２と出力端子３．共通端子２間に２組のエネル
ギー閉じ込め型２重モードセラミックフィルタ５と６を
結合コンデンサＣにより縦続に接続した回路構成を有す
るフィルタがあったが、この種のフィルタでは、チップ
状のフィルタとして製品化されたものはなかった。最近
、コンデンサや抵抗はもちろん、コイル部品や機構部品
までがチップ化されつつあり、チップ化された圧電振動
部品を要求する声が高まっていた。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a piezoelectric vibrating component, and more particularly to a chip-shaped piezoelectric vibrating component that is directly soldered to a printed circuit board or the like. (Prior Art) Conventionally, for example, as shown in FIG. 1, input terminals 1.
Common terminal 2 and output terminal 3. There was a filter that had a circuit configuration in which two sets of energy trapping type dual mode ceramic filters 5 and 6 were connected in series between the common terminal 2 by a coupling capacitor C, but in this type of filter, the product was manufactured as a chip-shaped filter. Nothing was converted. Recently, not only capacitors and resistors, but also coil parts and mechanical parts are being made into chips, and there has been a growing demand for piezoelectric vibrating parts made into chips.
（発明の目的）
本発明は上述のような背景をもとになされたものであっ
て、その目的は、圧電基板およびその上下に接着するカ
バーの構造が単純で、特殊な加工や金型を必要とせず、
量産性のよい圧電振動部品を得ることである。(Objective of the Invention) The present invention has been made based on the above-mentioned background, and its object is to have a simple structure of a piezoelectric substrate and a cover bonded above and below the piezoelectric substrate, and to eliminate the need for special processing or molding. without needing,
The objective is to obtain a piezoelectric vibrating component that can be easily mass-produced.
（発明の構成）
このため、本発明は、上下両主面に夫々振動電極が形成
され、これら振動電極の引出電極が上記主面の周縁部に
引き出されてなる大略四角形状の圧電基板の上′下に上
記振動電極の振動を許容する空間を残して上記主面より
も寸法の小さい絶縁性のカバーが夫々接着され、上記圧
電基板の周縁部のカバーの外に位置する引出電極がカバ
ーに形成された端子電極に導通されていることを特徴と
している。(Structure of the Invention) Therefore, the present invention provides a piezoelectric substrate having a generally rectangular shape, in which vibrating electrodes are formed on both the upper and lower principal surfaces, and extraction electrodes of these vibrating electrodes are drawn out to the peripheral edge of the principal surface. 'An insulating cover smaller in size than the main surface is adhered to the bottom, leaving a space that allows the vibration of the vibrating electrode, and an extraction electrode located outside the cover on the periphery of the piezoelectric substrate is attached to the cover. It is characterized by being electrically connected to the formed terminal electrode.
（実施例）
以下、本発明をフィルタに適用した実施例について添付
図面を参照して本発明を具体的に説明する。(Example) Hereinafter, the present invention will be specifically described with reference to the accompanying drawings regarding an example in which the present invention is applied to a filter.
第２図ｆａ）および第２図ｆｂ）において、１１はフィ
ルタユニット、１２，１３は該フィルタユニット１１の
カバーである。In FIG. 2 fa) and FIG. 2 fb), 11 is a filter unit, and 12 and 13 are covers of the filter unit 11.
上記フィルタユニット１１は、第３図に示すように、圧
電基板１４の一方の主面に、３端子型のエネルギー閉じ
込め型２重モードフィルタ（以下、単にフィルタと記す
。）５および６の分割電極１７゜１８および１９，２０
．結合コンデンサＣの電極２１および引出電極２２．２
３ならびにこれら電極を接続する電極が形成され、また
、圧電基板１１の他方の主面に上記フィルタ５，６の共
通電極屑。As shown in FIG. 3, the filter unit 11 has divided electrodes 5 and 6 of a three-terminal energy trapping type dual mode filter (hereinafter simply referred to as a filter) on one main surface of a piezoelectric substrate 14. 17°18 and 19,20
．． Electrode 21 and extraction electrode 22.2 of coupling capacitor C
3 and an electrode connecting these electrodes are formed, and common electrode scraps of the filters 5 and 6 are formed on the other main surface of the piezoelectric substrate 11.
３、結合コンデンサＣの他方の電極２６．およびこれら
電極を相互に接続する電極が形成されてなるものである
。3. The other electrode 26 of the coupling capacitor C. And electrodes are formed to connect these electrodes to each other.
フィルタ５の分割電極１７．１８および共通電極２４．
フィルタ６の分割電極１９．２０および共通電極２５は
いずれもフィルタユニット１１の振動電極となっている
。The divided electrodes 17.18 and the common electrode 24. of the filter 5.
The divided electrodes 19 and 20 of the filter 6 and the common electrode 25 are both vibrating electrodes of the filter unit 11.
一方、カバー１２．１３はいずれもガラスエポキシもし
くはセラミック等の絶縁材料からなり、長方形状を有す
る上記圧電基板１４の主面の巾Ｗよりもやや小さな巾を
有する。On the other hand, the covers 12 and 13 are both made of an insulating material such as glass epoxy or ceramic, and have a width slightly smaller than the width W of the main surface of the piezoelectric substrate 14 having a rectangular shape.
上記カバー１２および１３は、第４図に示すように、圧
電基板１４の両主面に、フィルタ５および６の形成部分
に振動空間Ｓ□、Ｓ２を残して、接着剤２７により接着
されている。この接着は、圧電基板１４の主面の周縁部
に引き出されたフィルタ５および６の引出電極２２およ
び２３の一部分、およびコンデンサＣの電極２６および
場合によっては２１の一部分が上記カバー１２および１
３の外に位置するように行われる。 −
上記引出電極２２および２３のカバー１２の外に位置す
る部分は、第２図ｆａ）および第２図（ｂ）に示すよう
に、カバー１２． 、１３および圧電基板１４の両端部
に夫々形成された、はぼ−泥中を有する端子電極２８お
よび２９に夫々導通され、コンデンサＣの電極２６（第
３図参照）は、一端がコンデンサＣの上記電極２６に接
続され、上記端子電極２８と２９との間に形成された端
子電極３０により、カバー１２側に引き出されている。As shown in FIG. 4, the covers 12 and 13 are bonded to both main surfaces of the piezoelectric substrate 14 with an adhesive 27, leaving vibration spaces S□, S2 in the areas where the filters 5 and 6 are formed. . This adhesion is applied to parts of the lead electrodes 22 and 23 of the filters 5 and 6 drawn out to the periphery of the main surface of the piezoelectric substrate 14, and a part of the electrode 26 of the capacitor C and, in some cases, 21 of the covers 12 and 1.
It is done so that it is located outside of 3. - The portions of the extraction electrodes 22 and 23 located outside the cover 12 are located outside the cover 12, as shown in FIG. 2fa) and FIG. 2(b). , 13 and the piezoelectric substrate 14, respectively, and are electrically connected to the terminal electrodes 28 and 29, which have hollow holes, respectively.The electrode 26 of the capacitor C (see FIG. 3) has one end connected to the capacitor C. It is connected to the electrode 26 and drawn out to the cover 12 side by a terminal electrode 30 formed between the terminal electrodes 28 and 29.
上記端子電極２８および３０が第１図のフィルタの入力
端子１および共通端子２として使用され、端子電極２色
が第１図のフィルタの出力端子３として使用される。The terminal electrodes 28 and 30 are used as input terminal 1 and common terminal 2 of the filter of FIG. 1, and two colors of terminal electrodes are used as output terminal 3 of the filter of FIG.
上記フィルタを製造するには、先ず、第５図に示すよう
に、一定ｒｌＪＷを有する長尺の圧電母材３１を用意し
、その一方の主面に、第３図において実線で示す電極パ
ターンを連続してほぼ等間隔に、印刷もしくは蒸着等の
手法によって形成し、他方の主面にも、第３図において
点線で示す電極パターンを上記電極パターンと対向させ
て形成する。To manufacture the above filter, first, as shown in FIG. 5, a long piezoelectric base material 31 having a constant rlJW is prepared, and an electrode pattern shown by a solid line in FIG. They are formed continuously at approximately equal intervals by a method such as printing or vapor deposition, and an electrode pattern shown by dotted lines in FIG. 3 is also formed on the other main surface so as to face the electrode pattern.
また、圧電母材３１の上記中Ｗよりもやや小さい巾を有
するガラスエポキシもしくはセラミック等からなる長尺
カバー３３および３５を用意する。Further, long covers 33 and 35 made of glass epoxy, ceramic, or the like and having a width slightly smaller than the width W of the piezoelectric base material 31 are prepared.
上記圧電母材３１の両主面に、第３図の分割電極１７．
１８および１９．２０と共通電極２４および２５とその
近傍、すなわち、フィルタ５，６の振動部の振動を許容
する空間Ｓ□、Ｓ２（第４図参照）を残して、第６図に
示すように、接着剤ガ。The divided electrodes 17. shown in FIG.
18 and 19, 20, the common electrodes 24 and 25, and their vicinity, leaving spaces S□ and S2 (see FIG. 4) that allow vibration of the vibrating parts of the filters 5 and 6, as shown in FIG. Then, glue.
２７により、長尺カバー３３および３５を夫々接着して
、一つの長尺ユニット３７を形成する。27, the elongated covers 33 and 35 are adhered to each other to form one elongated unit 37.
上記接着剤２７．２７は、振動部の振動を許容する上記
空間Ｓ□、Ｓ２が形成されるように、塗布部分および厚
みを考慮して圧電母材３１の両主面に塗布することが好
ましい。The adhesive 27.27 is preferably applied to both main surfaces of the piezoelectric base material 31 in consideration of the application area and thickness so that the spaces S□, S2 that allow vibration of the vibrating part are formed. .
上記長尺ユニット３７は、回転させながら、スパッタリ
ング、蒸着、もしくはイオンブレーティング等のＰＶＤ
法で表面全体に金属膜（図示せｔ）を形成する。この金
属膜の材料は、半田くわれを考慮して、ニッケル（Ｎｉ
）と銅（Ｃｕ ）の合金とすることが好ましい。また、
上記金属膜の上に電解メッキを施して膜厚をさらに厚く
することが好ましい。While rotating, the long unit 37 performs PVD such as sputtering, vapor deposition, or ion blating.
A metal film (t shown in the figure) is formed on the entire surface using a method. The material of this metal film is nickel (Ni) in consideration of solder cracks.
) and copper (Cu). Also,
It is preferable to perform electrolytic plating on the metal film to further increase the film thickness.
次に、長尺ユニット３７の第２図ｆａ）および第２図（
ｂｌに示す端子電極２８，２９．３１およびコ゛ンデン
サＣの電極２１に対応する部分にエツチングレジスト膜
（図示せず。）を夫々塗布した後、全体をエツチング液
に浸漬し、第７図に示すように、上記エツチングレジス
ト膜で保護された部分を除いて、上記金属膜を除去し、
端子電極２８ 、２９および３０を形成する。Next, FIG. 2 fa) and FIG. 2 (
After applying an etching resist film (not shown) to the terminal electrodes 28, 29.31 shown in BL and the part corresponding to the electrode 21 of the capacitor C, the whole is immersed in an etching solution, and as shown in FIG. Then, remove the metal film except for the part protected by the etching resist film,
Terminal electrodes 28, 29 and 30 are formed.
その後、上記長尺ユニット３７を長手方向に対してほぼ
直交する線ｌ□、ｌ□、・・・に沿って切断すれば、第
２図ｆａ）および第２図ｔｂ）において説明したチップ
状フィルタを得ることができる。After that, if the elongated unit 37 is cut along lines l□, l□, . can be obtained.
上記チップ状フィルタは、必要に応じ、端子電極２８．
２９および３１に電解メッキをほどこしたり半田浸漬等
により、端子電極２８．２９および３１の上に半田メッ
キを施しておくことが好ましい。また、このコンデンサ
Ｃの電極２１が露出しているときは、電極２１上には、
プリント基板等への実装時に上記電極２１に半田が付着
して端子電極３１等に導通するのを防止するため、ソル
ダレジスト膜（図示せず。）を形成しておくことが好ま
しい。The chip-shaped filter has a terminal electrode 28.
It is preferable to apply solder plating on the terminal electrodes 28, 29 and 31 by electrolytic plating or solder dipping on the terminal electrodes 29 and 31. Moreover, when the electrode 21 of this capacitor C is exposed, on the electrode 21,
It is preferable to form a solder resist film (not shown) in order to prevent solder from adhering to the electrodes 21 and conducting to the terminal electrodes 31 etc. during mounting on a printed circuit board or the like.
上記のようにすれば、圧電母材３１．長尺カバー３３お
よび３５はいずれも単純な形状を有しており、これらの
ものを製造するのに特殊な金型や加工も不要であり、長
尺ユニット３７の切断により、簡単に、大量のチップ状
フィルタを製造することができる。If the above is done, the piezoelectric base material 31. The long covers 33 and 35 both have a simple shape, and no special molds or processing are required to manufacture them. By cutting the long unit 37, it is easy to manufacture large quantities. Chip-shaped filters can be manufactured.
なお、上記実施例において、接着剤２７の厚みにより、
圧電基板１４の振動部分の振動を許容する空間Ｓ□およ
びＳ２を形成する代りに、カバー１２．１３側に窪み（
図示せず。）を設けて上記と同様の空間を形成するよう
にしてもよい。In addition, in the above embodiment, depending on the thickness of the adhesive 27,
Instead of forming the spaces S□ and S2 that allow the vibration of the vibrating portion of the piezoelectric substrate 14, a recess (
Not shown. ) may be provided to form a space similar to the above.
マタ、上記実施例において、カバー１２．１３は、第８
図に示すように、そのコーナ部にチーｉ４を持たせてコ
ーナ部の欠損を防止するようにしてもよい。In the above embodiment, the cover 12.13 is the eighth
As shown in the figure, a chip i4 may be provided at the corner to prevent damage to the corner.
さらに、カバー１２．１３は、第９図に示すように、圧
電基板１４のカケを防止するため、相互に中方向にズラ
せて上記圧電基板１４に接着し、カバー１２．１３で圧
電基板１４を保護するようにしてもよい。この場合、圧
電基板１４において、引出電極２２．２３はコンデンサ
Ｃが設けられた辺と対向する辺側に設けられる。Furthermore, as shown in FIG. 9, in order to prevent the piezoelectric substrate 14 from chipping, the covers 12.13 are adhered to the piezoelectric substrate 14 while being shifted inward from each other. may be protected. In this case, in the piezoelectric substrate 14, the extraction electrodes 22, 23 are provided on the side opposite to the side on which the capacitor C is provided.
本発明は、上記実施例において説明したようなエネルギ
ー閉じ込め形のフィルタの他に、２端子型あるいは３端
子型の同様な発振子、ＦＭディスクリミネータ用共振子
および表面波装置等に広く適用することができる。In addition to the energy trapping filter as explained in the above embodiments, the present invention is widely applicable to similar two-terminal or three-terminal oscillators, resonators for FM discriminators, surface wave devices, etc. be able to.
（発明の効果）
以上、詳述したことからも明らかなように、本発明は、
圧電基板の主面にカバーを接着してなるチップ状の圧電
振動部品において、カバーの寸法を圧電基板の主面より
も小さくしカバーの外に位置する引出電極がカバーに形
成された端子電極に導通されるようにしたから、圧電母
材の上下に長尺カバーが形成されてなる１つの長尺ユニ
ットの切断で多数の圧電振動部品を得ることができ、圧
電振動部品を比較的簡単な工程で大量に生産することが
できる。(Effects of the Invention) As is clear from the detailed description above, the present invention has the following effects:
In a chip-shaped piezoelectric vibrating component formed by adhering a cover to the main surface of a piezoelectric substrate, the dimensions of the cover are made smaller than the main surface of the piezoelectric substrate, and the lead electrode located outside the cover is connected to the terminal electrode formed on the cover. Since electrical conduction is achieved, a large number of piezoelectric vibrating parts can be obtained by cutting one long unit consisting of long covers formed on the top and bottom of a piezoelectric base material, and piezoelectric vibrating parts can be manufactured in a relatively simple process. can be produced in large quantities.
また、カバーは平板状の単純な形状を有しており、製作
が容易であり、圧電振動部品のコストも大巾に引き下げ
ることができる。Furthermore, the cover has a simple flat plate shape and is easy to manufacture, and the cost of the piezoelectric vibrating component can be significantly reduced.
さらに、カバーの材質を選択することにより、信頼性の
グレードおよび使用条件に応じた圧電振動部品を得るこ
とができる。Furthermore, by selecting the material of the cover, it is possible to obtain a piezoelectric vibrating component according to the reliability grade and usage conditions.
第１図は結合コンデンサで３端子型フイルりを縦続に接
続したフィルタの回路図、第２図（ａ）および第２図（
ｂ）は夫々本発明に係る圧電振動部品の一実施例のフィ
ルタを異なる方向から見た斜視図、第３図は第２図（ａ
）および第２図（ｂ）のフィルりに使用されるフィルタ
ユニットの平面図、第４図は第２図（ａ）および第２図
ｆｂ）のフィルりのＩＩ −ＩＩ線断面図、第５図、第
６図および第７図は夫々第２図ｆａ）および第２図（ｂ
）のフィルタの製造工程の説明図、第８図および第９図
は夫々第２図（ａ）および第２図（ｂ）のフィルタの変
形例の断面図である。
１１・・・フィルタユニット、１２．１３・・・カッ〈
−１２２．２３・・弓１出電極、２６・・・電極、２７
・・・接着剤、２８，２９．３０・・・端子電極。
特許出願人 株式会社村田製作所
代 理 人 弁理士 青 山 葆 ほか２名第７１！１
第８図
第９図Figure 1 is a circuit diagram of a filter in which 3-terminal films are connected in series with a coupling capacitor, Figure 2 (a) and Figure 2 (
b) is a perspective view of a filter of an embodiment of the piezoelectric vibrating component according to the present invention, viewed from different directions, and FIG.
) and a plan view of the filter unit used for the filling shown in FIG. 2(b), FIG. 4 is a sectional view taken along the line II-II of the filling shown in FIG. Figures 6 and 7 are Figure 2fa) and Figure 2b, respectively.
), and FIGS. 8 and 9 are cross-sectional views of modified examples of the filters shown in FIGS. 2(a) and 2(b), respectively. 11... Filter unit, 12.13... Ka<
-122.23... Bow 1 electrode, 26... Electrode, 27
...Adhesive, 28,29.30...Terminal electrode. Patent applicant Murata Manufacturing Co., Ltd. Agent Patent attorney Aoyama Aoyama and 2 others No. 71!1 Figure 8 Figure 9
Claims (1)
動電極の引出電極が上記主面の周縁部に引き出されてな
る大略四角形状の圧電基板の上下に上記振動電極の振動
を許容する空間を残して上記主面よりも寸法の小さい絶
縁性のカバーが夫々接着され、上記圧電基板の周縁部の
カバーの外に位置する引出電極がカバーに形成された端
子電極に導電されていることを特徴とする圧電振動部品
。(1) Vibrating electrodes are formed on both the upper and lower principal surfaces, and the extraction electrodes of these vibrating electrodes are drawn out to the periphery of the principal surface to allow vibration of the vibrating electrodes on the upper and lower sides of a roughly square-shaped piezoelectric substrate. Insulating covers smaller in size than the main surface are adhered to each other leaving a space, and a lead electrode located outside the cover at the periphery of the piezoelectric substrate is electrically conductive to a terminal electrode formed on the cover. A piezoelectric vibrating component featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12087283A JPS6012811A (en) | 1983-07-02 | 1983-07-02 | Piezoelectric oscillation parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12087283A JPS6012811A (en) | 1983-07-02 | 1983-07-02 | Piezoelectric oscillation parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6012811A true JPS6012811A (en) | 1985-01-23 |
Family
ID=14797035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12087283A Pending JPS6012811A (en) | 1983-07-02 | 1983-07-02 | Piezoelectric oscillation parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6012811A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61136630U (en) * | 1985-02-12 | 1986-08-25 | ||
| JPS62221211A (en) * | 1986-03-22 | 1987-09-29 | Tdk Corp | Ceramic resonator |
| JPS62227208A (en) * | 1986-03-28 | 1987-10-06 | Tdk Corp | Group delay equalizer |
| JPH0479604A (en) * | 1990-07-20 | 1992-03-13 | Murata Mfg Co Ltd | Piezo-resonator |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433714A (en) * | 1977-08-19 | 1979-03-12 | Mitsubishi Electric Corp | Automatic playing envelope generating system |
| JPS5661820A (en) * | 1979-10-25 | 1981-05-27 | Matsushima Kogyo Co Ltd | Quartz oscillator |
-
1983
- 1983-07-02 JP JP12087283A patent/JPS6012811A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433714A (en) * | 1977-08-19 | 1979-03-12 | Mitsubishi Electric Corp | Automatic playing envelope generating system |
| JPS5661820A (en) * | 1979-10-25 | 1981-05-27 | Matsushima Kogyo Co Ltd | Quartz oscillator |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61136630U (en) * | 1985-02-12 | 1986-08-25 | ||
| JPS62221211A (en) * | 1986-03-22 | 1987-09-29 | Tdk Corp | Ceramic resonator |
| JPS62227208A (en) * | 1986-03-28 | 1987-10-06 | Tdk Corp | Group delay equalizer |
| JPH0479604A (en) * | 1990-07-20 | 1992-03-13 | Murata Mfg Co Ltd | Piezo-resonator |
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