JPS60146342U - 接着剤塗布装置 - Google Patents

接着剤塗布装置

Info

Publication number
JPS60146342U
JPS60146342U JP1984034481U JP3448184U JPS60146342U JP S60146342 U JPS60146342 U JP S60146342U JP 1984034481 U JP1984034481 U JP 1984034481U JP 3448184 U JP3448184 U JP 3448184U JP S60146342 U JPS60146342 U JP S60146342U
Authority
JP
Japan
Prior art keywords
adhesive
diamond
land
nozzle
adhesive applicator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984034481U
Other languages
English (en)
Inventor
石橋　尚登
古賀　政孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Japan Radio Co Ltd
Original Assignee
New Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Japan Radio Co Ltd filed Critical New Japan Radio Co Ltd
Priority to JP1984034481U priority Critical patent/JPS60146342U/ja
Publication of JPS60146342U publication Critical patent/JPS60146342U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors

Landscapes

  • Coating Apparatus (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
図は本考案の一実施例を示す説明図である。 １・・・・・・ダイアランド、２・・・・・・ディスペ
ンサー、３・・・・・・ディスペンサー２のノズル、４
・・・・・・接着剤、５　ａｔ　　５　ｂｙ　　６　ａ
ｔ　　６　ｂ−−−−−−ノズル。

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレーム等のダイアランドに半導体チップを接着
    するために該ダイアランドに接着剤を塗布する接着剤塗
    布装置において、先端部のノズルから必要量の接着剤を
    圧搾空気により吐出し、前記ダイアランドに接着剤を配
    剤するディスペンサーと、この配剤された接着剤を半導
    体チップの犬きさに応じて拡散するために気体を噴射す
    るノズルとを備えたことを特徴とする接着剤塗布装置。
JP1984034481U 1984-03-10 1984-03-10 接着剤塗布装置 Pending JPS60146342U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984034481U JPS60146342U (ja) 1984-03-10 1984-03-10 接着剤塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984034481U JPS60146342U (ja) 1984-03-10 1984-03-10 接着剤塗布装置

Publications (1)

Publication Number Publication Date
JPS60146342U true JPS60146342U (ja) 1985-09-28

Family

ID=30537888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984034481U Pending JPS60146342U (ja) 1984-03-10 1984-03-10 接着剤塗布装置

Country Status (1)

Country Link
JP (1) JPS60146342U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006055715A (ja) * 2004-08-18 2006-03-02 Dainippon Printing Co Ltd 液状接着剤の塗布方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57114245A (en) * 1981-01-06 1982-07-16 Nec Corp Assembling of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57114245A (en) * 1981-01-06 1982-07-16 Nec Corp Assembling of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006055715A (ja) * 2004-08-18 2006-03-02 Dainippon Printing Co Ltd 液状接着剤の塗布方法

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