JPS60165743A - Device for fixing heat exhaustion - Google Patents
Device for fixing heat exhaustionInfo
- Publication number
- JPS60165743A JPS60165743A JP856785A JP856785A JPS60165743A JP S60165743 A JPS60165743 A JP S60165743A JP 856785 A JP856785 A JP 856785A JP 856785 A JP856785 A JP 856785A JP S60165743 A JPS60165743 A JP S60165743A
- Authority
- JP
- Japan
- Prior art keywords
- casing
- fixing device
- heat
- fixing heat
- heat exhaustion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は特に金属ベースプレートである金属性の部材の
上に固定された電気的な構成要素、特に制御素子のため
の熱排出性の固定装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a heat-evacuation fixing device for electrical components, in particular control elements, fixed on a metallic member, in particular a metal base plate.
従来の技術
雑誌「エレクトロニクスＪ１９７７年１１号の１０７ペ
ージには、半導体の構成素子の十分な低温性を維持する
ための冷却手段が記されている。冷却作用は特に高出力
の半導体構成素子において必要であり、それは従来は伝
熱性の部材、例えばケーシング部材の冷却成形面及び（
又は）固定装置を介して形成されている。このためには
その冷却を行なうべき部分又は成形面への、熱的にまた
機構的に良好な接触が重要である。この際に伝熱性ペー
ストによる熱排出を用いれば、その冷却が極めて良好な
ものとなる。The conventional technical magazine "Electronics J, No. 11, 1977, page 107, describes cooling means for maintaining sufficiently low temperature properties of semiconductor components. Cooling action is especially necessary for high-power semiconductor components. , which has conventionally been applied to heat-conductive parts, such as the cooling molded surface of casing parts and (
or) formed via a fixation device. For this purpose, good thermal and mechanical contact with the part or molding surface to be cooled is important. At this time, if heat is discharged using a heat conductive paste, the cooling becomes extremely good.
発明の課題
本発明の課題は従来の固定装置を改良して、その構造が
より単純でかつ組立てが容易であり、しかも良好かつ均
一な熱排出性を有するものを提供することである。OBJECTS OF THE INVENTION It is an object of the present invention to improve the conventional fixing devices by providing a device which is simpler in structure and easier to assemble, and which also has good and uniform heat dissipation.
課題全解決するための手段
上記の課題は本発明によれば冒頭に述べた形式の固定装
置において、ケーシングが配設されており、このケーシ
ングがおり部を有し、前記の部利がこのおり部内にそう
人されていることによって解決された。Means for Solving All Problems The above-mentioned problem is achieved according to the invention by providing a fixing device of the type mentioned at the outset, in which a casing is arranged, the casing having a cage part, and the said part being connected to the cage. It was resolved by having so many people in the department.
実施態様
特許請求の範囲の各従属項には本発明の有利な実施態様
が記されている。特に、おう部と冷却されるべき部材と
の間のスペースが伝熱性のペーストによって充填されて
いると有利である。またケーシングが絶縁性の材料から
成っていると、電気的な制御素子のための電気的に有利
な周囲が形成され、特にケーシング電位との短絡は生じ
なくなり有利である。更にケーシング（６）
が弾性的なプラスチックから成り、かつ該ケーシングの
おり部の上縁に成形縁部が形成されていると、冷却され
るべき部材がその成形縁部を越えておう部内にはめ留め
られ、それによって組立てプロセスの複雑化を伴うこと
なく、おう部からの当該部材の移動を防市した確実な固
定も可能となり有利である。Advantageous embodiments of the invention are disclosed in the dependent claims. It is particularly advantageous if the space between the housing and the component to be cooled is filled with a thermally conductive paste. It is also advantageous if the housing is made of an insulating material, which provides an electrically advantageous surrounding for the electrical control element and, in particular, prevents short circuits with the housing potential. Furthermore, if the casing (6) is made of elastic plastic and is formed with a molded edge at the upper edge of the cage, it is possible that the component to be cooled can pass over the molded edge and fit into the cage. Advantageously, it is possible to securely fix the part without complicating the assembly process and to prevent movement of the part from the housing.
実施例
弾性材料製のケーシング１内にはおう部２が形成されて
おり、該おう部２の上縁部は歯状の成形縁部６を有して
いる。おう部２内には金属ベースプレート４がはめ留め
られており、この金属ベースプレート４とおう部２の壁
との間の空間には伝熱性のペースト３が充填されている
。金属ベースプレート４が電気的な制御素子５全保持し
ている。DESCRIPTION OF THE PREFERRED EMBODIMENTS A housing 2 is formed in the casing 1 made of an elastic material, the upper edge of which has a tooth-shaped profiled edge 6 . A metal base plate 4 is fitted into the housing 2, and a space between the metal base plate 4 and the wall of the housing 2 is filled with a heat conductive paste 3. A metal base plate 4 holds all electrical control elements 5.
電気的な制御素子５は薄膜技術による出方最終段であっ
て、金属ベースプレートーヒに接着されている。組立て
前にケーシング１にはおう部２と成形縁部６とが予め形
成されて伝熱性ペー（４）
スト３が充填され、そして金属ベースプレート４が電気
的な制御素子５の保持体としておう部２内にはめ留めら
れ、それによって歯形状の成形縁部６が金属ペースル−
ト４のずれ動きを防ぐことになる。図示はされていない
がおう部２の曲りに複数の接続点が配置されてお９、そ
れによって制御素子５が取付は後にこの接続点とボンデ
ライト法によって接続される。The electrical control element 5 is the last stage developed using thin film technology and is glued to the metal base plate. Before assembly, the casing 1 is preformed with a cap 2 and a molded edge 6 and filled with a thermally conductive paste (4) 3, and a metal base plate 4 serves as a holder for the electrical control element 5. 2 so that tooth-shaped shaped edges 6 are fitted into the metal paste hole.
This prevents displacement of the seat 4. Although not shown, a plurality of connection points 9 are arranged at the bends of the shell part 2, so that the control element 5 can later be attached to these connection points by the Bonderite method.
当然ながら本発明は図示の実施例に限定されろものでは
なく、特に本発明による固定装置は例えば出力抵抗体、
最終段トランジスタ、電圧ｆｌｔｌＪ御器等のためにも
適Ｉ２ている。Naturally, the invention is not limited to the illustrated embodiment, and in particular the fixing device according to the invention can be used, for example, for output resistors,
I2 is also suitable for the final stage transistor, voltage fltlJ control, etc.
発明の効果
本発明による熱排出性の固定装置においては、電気的な
制御素子を保持する部材がおり部内にそう人されるだけ
の固定方法なので極めて簡単である。それによって特に
大量生産においては、容易な組立て経過が可能となり有
利である。そう着状態において当該の冷却されるべき部
材ははう部によって取シ囲徒れるので、特に有効でかつ
均一な熱排出が行なわれ得る。Effects of the Invention In the heat dissipating fixing device according to the present invention, the fixing method is extremely simple because the member for holding the electrical control element is simply inserted into the cage. Particularly in mass production, this makes possible a simple assembly process, which is advantageous. In the docked state, the component to be cooled is surrounded by the crawler, so that a particularly effective and uniform heat removal can take place.
図面は本発明による熱排出性の固定装置の断面図である
。
１・・・ケーシング、２・・・おう部、３・・・伝熱性
のペースト、４・・・金属ベースプレート、６・・・成
形縁部、５・・・電気的な制ｆｌ素子
（ほか１名）The drawing is a sectional view of a heat dissipating fixing device according to the invention. DESCRIPTION OF SYMBOLS 1...Casing, 2...Shell part, 3...Heat conductive paste, 4...Metal base plate, 6...Molded edge, 5...Electric FL control element (other 1 given name)
Claims (1)
めの熱排出性の固定装置において、ケーシング（１）が
配設されており、このケーシング（１）がおう部（２）
？：有し、前記の部材がこのおう部（２）内にそう人さ
れていることを特徴とする、熱排出性の固定装置。 ２、おう部（２）と部材との間のスペースが伝熱性のペ
ースト（３）によって充填されている、特許請求の範囲
第１項記載の熱排出性の固定装置。 ３、 ケーシング（１）が絶縁性の材料から成っている
、特許請求の範囲第１項又は第２項記載の熱排出性の固
定装置。 ４、ケーシング（１）が弾性的なプラスチックから成り
、かつ該ケーシング（１）のおう部（２）の上縁に成形
縁部（６）が形成されている、特許請求の範囲第１項か
ら第３項棟でのいずれか１項記載の熱排出性の固定装置
。[Claims] 1. A heat dissipating fixing device for an electrical component fixed on a member, in which a casing (1) is arranged, the casing (1) Part (2)
? : A heat dissipating fixing device, characterized in that the above-mentioned member is disposed within the casing (2). 2. A fixing device with heat dissipation according to claim 1, wherein the space between the casing (2) and the member is filled with a heat-conductive paste (3). 3. Heat-dissipating fixing device according to claim 1 or 2, wherein the casing (1) is made of an insulating material. 4. From claim 1, wherein the casing (1) is made of elastic plastic and a molded edge (6) is formed on the upper edge of the casing (2) of the casing (1). The heat dissipating fixing device according to any one of paragraph 3 in the building.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843402538 DE3402538A1 (en) | 1984-01-26 | 1984-01-26 | Heat-dissipating mounting |
| DE3402538.3 | 1984-01-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60165743A true JPS60165743A (en) | 1985-08-28 |
| JPH0449782B2 JPH0449782B2 (en) | 1992-08-12 |
Family
ID=6225896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP856785A Granted JPS60165743A (en) | 1984-01-26 | 1985-01-22 | Device for fixing heat exhaustion |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS60165743A (en) |
| DE (1) | DE3402538A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006103721A1 (en) * | 2005-03-25 | 2006-10-05 | Mitsubishi Denki Kabushiki Kaisha | Power converter cooling structure |
| US7646182B2 (en) | 2006-03-29 | 2010-01-12 | Mitsubishi Electric Corporation | Power supply apparatus |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3633625A1 (en) * | 1985-12-04 | 1987-06-11 | Vdo Schindling | CARRIER PLATE |
| US5168919A (en) * | 1990-06-29 | 1992-12-08 | Digital Equipment Corporation | Air cooled heat exchanger for multi-chip assemblies |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1236612B (en) * | 1960-02-24 | 1967-03-16 | Globe Union Inc | Fixing of a transistor within a printed circuit in the recess of an insulating plate |
| DE1156457B (en) * | 1961-07-08 | 1963-10-31 | Telefunken Patent | Process for the production of an integrated circuit arrangement |
| US3480836A (en) * | 1966-08-11 | 1969-11-25 | Ibm | Component mounted in a printed circuit |
| US3396361A (en) * | 1966-12-05 | 1968-08-06 | Solitron Devices | Combined mounting support, heat sink, and electrical terminal connection assembly |
| NL159818B (en) * | 1972-04-06 | 1979-03-15 | Philips Nv | SEMI-CONDUCTOR DEVICE CONTAINING A FLEXIBLE INSULATING FILM WITH METAL TRACKS ON ONE SIDE. |
| US3936866A (en) * | 1974-06-14 | 1976-02-03 | Northrop Corporation | Heat conductive mounting and connection of semiconductor chips in micro-circuitry on a substrate |
| US4029999A (en) * | 1975-04-10 | 1977-06-14 | Ibm Corporation | Thermally conducting elastomeric device |
| DE2919058A1 (en) * | 1979-05-10 | 1980-11-20 | Siemens Ag | Electronic appliance with printed circuit module - encapsulated with modules in recesses of precast plastic block |
| DE3151655A1 (en) * | 1981-12-28 | 1983-07-07 | Siemens AG, 1000 Berlin und 8000 München | Arrangement for cooling component groups |
| US4410927A (en) * | 1982-01-21 | 1983-10-18 | Olin Corporation | Casing for an electrical component having improved strength and heat transfer characteristics |
-
1984
- 1984-01-26 DE DE19843402538 patent/DE3402538A1/en active Granted
-
1985
- 1985-01-22 JP JP856785A patent/JPS60165743A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006103721A1 (en) * | 2005-03-25 | 2006-10-05 | Mitsubishi Denki Kabushiki Kaisha | Power converter cooling structure |
| US7646182B2 (en) | 2006-03-29 | 2010-01-12 | Mitsubishi Electric Corporation | Power supply apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0449782B2 (en) | 1992-08-12 |
| DE3402538C2 (en) | 1993-04-01 |
| DE3402538A1 (en) | 1985-08-01 |
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