JPS60187537U - automatic wire bonder - Google Patents

automatic wire bonder

Info

Publication number
JPS60187537U
JPS60187537U JP1984074879U JP7487984U JPS60187537U JP S60187537 U JPS60187537 U JP S60187537U JP 1984074879 U JP1984074879 U JP 1984074879U JP 7487984 U JP7487984 U JP 7487984U JP S60187537 U JPS60187537 U JP S60187537U
Authority
JP
Japan
Prior art keywords
wire
capillary
clamper
spark
operates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984074879U
Other languages
Japanese (ja)
Other versions
JPH025533Y2 (en
Inventor
吉郎 高橋
雲然　國幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Japan Radio Co Ltd
Original Assignee
New Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Japan Radio Co Ltd filed Critical New Japan Radio Co Ltd
Priority to JP1984074879U priority Critical patent/JPS60187537U/en
Publication of JPS60187537U publication Critical patent/JPS60187537U/en
Application granted granted Critical
Publication of JPH025533Y2 publication Critical patent/JPH025533Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る自動ワイヤホンダの主要部を示す
正面図、第２図はクランパの詳細構造図、第３図は電気
トーチの詳細図、第４図は捨てボンド操作の流れ図、第
５図は捨てボンド操作の工程図、第６図は他の実施例の
捨てボンド操作の工程図である。 １４・・・アームスライドユニット、２０・・・キャピ
ラリー、２２・・・電気トーチ、２６・・・クランパス
ライドユニット、３０・・・クランパ、３６−・・ワイ
ヤ。 ２２　　　　　　　　　　２２　　”−４０６６ １ ２Fig. 1 is a front view showing the main parts of the automatic wire honda according to the present invention, Fig. 2 is a detailed structural diagram of the clamper, Fig. 3 is a detailed diagram of the electric torch, Fig. 4 is a flow chart of the disposable bond operation, FIG. 5 is a process diagram of the disposable bond operation, and FIG. 6 is a process diagram of the disposable bond operation of another embodiment. 14... Arm slide unit, 20... Capillary, 22... Electric torch, 26... Clamper slide unit, 30... Clamper, 36-... Wire. 22 22”-4066 1 2

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）ワイヤの先端部が下方に突出して挿通されるキャ
ピラリーと、このキャピラリーの上方に位置して前記ワ
イヤを把持し、キャピラリーとともに下降してワイヤを
繰り出すクランパと、前記ワイヤの先端部との間にスパ
ークを発生させるトーチと、前記キャピラリーとクラン
パとを作動させる駆動装置と、接続位置を検知するとと
もに、前記駆動装置を介して前記キャピラリーを作動さ
せて前記ワイヤを接続位置に固着する制御装置とを有す
る自動ワイヤホンダにおいて、前記トーチによるスパー
クの発生の有無を検出するスパーク検出装置と、このス
パーク検出装置の出力を受けて前記スパークの発生がな
い場合に、少な（とも１回前記キャピラリーを下降させ
て前記ワイヤの固着操作を行う捨てボンド機構とを有す
ることを特徴とする自動ワイヤボンダ。(1) A capillary into which the wire is inserted with its tip protruding downward; a clamper positioned above the capillary to grip the wire and descend together with the capillary to feed out the wire; and the tip of the wire. a torch that generates a spark between them; a drive device that operates the capillary and the clamper; and a control device that detects a connection position and operates the capillary via the drive device to fix the wire at the connection position. and a spark detection device for detecting the presence or absence of spark generation by the torch; An automatic wire bonder comprising a disposable bonding mechanism that lowers the wire to fix the wire. （２）前記捨てボンド機構は、前記スパークの発生がな
い場合に前記クランパを作動させ、前記ワイヤを把持し
て繰り出すクランパ駆動装置が設けられていることを特
徴とする実用新案登録請求の範囲第１項記載の自動ワイ
ヤホンダ。(2) The disposable bond mechanism is provided with a clamper drive device that operates the clamper to grasp and feed out the wire when the spark is not generated. The automatic wire Honda described in item 1.
JP1984074879U 1984-05-22 1984-05-22 automatic wire bonder Granted JPS60187537U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984074879U JPS60187537U (en) 1984-05-22 1984-05-22 automatic wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984074879U JPS60187537U (en) 1984-05-22 1984-05-22 automatic wire bonder

Publications (2)

Publication Number Publication Date
JPS60187537U true JPS60187537U (en) 1985-12-12
JPH025533Y2 JPH025533Y2 (en) 1990-02-09

Family

ID=30615579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984074879U Granted JPS60187537U (en) 1984-05-22 1984-05-22 automatic wire bonder

Country Status (1)

Country Link
JP (1) JPS60187537U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412544A (en) * 1990-05-02 1992-01-17 Kaijo Corp Semiconductor assembling device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412544A (en) * 1990-05-02 1992-01-17 Kaijo Corp Semiconductor assembling device

Also Published As

Publication number Publication date
JPH025533Y2 (en) 1990-02-09

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