JPS6019565A - Luminous head for printing - Google Patents
Luminous head for printingInfo
- Publication number
- JPS6019565A JPS6019565A JP58128357A JP12835783A JPS6019565A JP S6019565 A JPS6019565 A JP S6019565A JP 58128357 A JP58128357 A JP 58128357A JP 12835783 A JP12835783 A JP 12835783A JP S6019565 A JPS6019565 A JP S6019565A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- substrate
- diode array
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Led Devices (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
イ）産業上の利用分野
本発明は発光ダイオードアレイを用いたプリンター等に
用いる印字用発光ヘッドに関する。DETAILED DESCRIPTION OF THE INVENTION A) Field of Industrial Application The present invention relates to a light emitting head for printing used in a printer or the like using a light emitting diode array.
口）従来技術
プリンター等に用いる印字用発光ヘッドは、第１図に示
すように、基板（１１）の上に棒状の発光ダイオードア
レイじを載置していたが、発光ドットヒ。1) Conventional light-emitting heads for printing used in printers, etc. had a bar-shaped light-emitting diode array placed on a substrate (11), as shown in FIG.
ッチがと乃至名岬−と狭くなると端子数も膨大となり配
線も密度の高いまま長短離設けなければならない。そこ
で同じ基板ｌ１に駆動素子０５！Ｑ５１を配置すること
で印字用発光ヘッドの小型化、端子数減少などを図るこ
とが出来るが、発光ドツト数が多いから駆動素子（１５
）（Ｉｓは発光ダイオードアレイ（１２）１ケに対し１
乃至４個、画素子の歩留まりを考慮すると２個が必要と
なる。そこで第２図に示すように発光ダイオードアレイ
■の両側の略中央部に駆動素子載置部（５）ｄを設ける
。ところが第２図上側に示す如く１発光ダイオードアレ
イ（２）のワイヤポンドバラ）（２３）（２３）・・・
と駆動素子のワイヤボンドバット（財）（財）を素子の
外側で配線すると、発光ダイオードアレイ（２）のワイ
ヤポンドバット（財）（２３）・・・の間１１？％が４
乃至４Ｈであるから極めて狭く、そのため発光ダイオー
ドアレイ（支）の両翼ではゆとりある配線ができるが、
駆動素子の発光ダイオードアレイ寄シの部分で配線が密
集する。また同図下側の如く駆動素子内側から配線する
と、そのままでは図の如ぐ事実上配線できないので、ワ
イヤボンドバット間隔を広げなくてはいけない。ところ
がそれによシ駆動素子上のワイヤポンドバット（図示せ
ず）と基板上のワイヤポンドパットｃ！！４１例・・７
）ｉ術ｎ、ワイヤの垂れ下が９による短絡事故等が生じ
るほか、印字用発光ヘッドには信頼性向上のためワイヤ
として金線を使う事が多く、長いワイヤは高価となる。As the gap becomes narrower, the number of terminals increases enormously, and wiring must be arranged long and short while maintaining a high density. Therefore, drive element 05 is placed on the same substrate l1! By arranging Q51, it is possible to downsize the printing light emitting head and reduce the number of terminals, but since the number of light emitting dots is large, the drive element (15
) (Is is 1 for 1 light emitting diode array (12)
4 to 4, and when considering the yield of pixel elements, two are required. Therefore, as shown in FIG. 2, driving element mounting portions (5) d are provided approximately in the center on both sides of the light emitting diode array (2). However, as shown in the upper part of FIG.
If the wire bond batts (23) of the light emitting diode array (2) and the wire bond batts (23) of the driving element are wired outside the element, 11? % is 4
Since it is 4H to 4H, it is extremely narrow, so there is plenty of room for wiring on both wings of the light emitting diode array (support).
Wiring becomes dense in the area near the light emitting diode array of the drive element. Furthermore, if wiring is done from inside the drive element as shown in the lower part of the figure, it is virtually impossible to wire as shown in the figure, so the distance between the wire bond butts must be widened. However, the wire pound pad (not shown) on the drive element and the wire pound pad on the board c! ! 41 cases...7
) In addition to short-circuit accidents caused by sagging wires, gold wires are often used as wires in printing light-emitting heads to improve reliability, and long wires are expensive.
いずれの場合も配線密度が基板の場所によって異なるの
で、放熱がアンバランスになシ、これによって発光輝度
が変化したシ素子寿命が短かくなるので不都合である。In either case, since the wiring density differs depending on the location on the substrate, heat dissipation becomes unbalanced, which is disadvantageous because the life of the element whose luminance has changed is shortened.
また発光ダイオードアレイの略中央部に駆動素子が位置
しているので、基板全体では均一に素子が配置されてい
る事になる。Furthermore, since the driving element is located approximately at the center of the light emitting diode array, the elements are uniformly arranged over the entire substrate.
素子は概ね保護樹脂で覆われているとはいえ、基板全面
に素子が配置されていると、取扱中にワイヤに触れ、断
線や短絡を生じやすい。Although the elements are generally covered with a protective resin, if the elements are arranged over the entire surface of the board, the wires may come into contact with them during handling, easily causing disconnection or short circuits.
ハ）発明の目的
本発明は上述の点を考慮してなされたもので、配線密度
や放熱性が略均−となり、かつ取扱いやすい印字用発光
ヘッドを提供するものである。C) Purpose of the Invention The present invention has been made in consideration of the above-mentioned points, and provides a light emitting head for printing which has substantially uniform wiring density and heat dissipation properties and is easy to handle.
二）発明の構成
本発明は発光ダイオードアレイに対し点対称となる偏位
置に駆動素子を配置することにより、配線密度を略均−
化しかつ部品のない部分を広く形成するもので、以下本
発明を実施例に基づいて詳細に説明する。2) Structure of the Invention The present invention can substantially equalize the wiring density by arranging driving elements at offset positions that are point symmetrical with respect to the light emitting diode array.
The present invention will be described in detail below based on examples.
ホ）実施例
第６図は本発明実施例の印字用発光ヘッドの平面図であ
るが、配線が判読しやすいように駆動素子は載置してい
ない。また発光ダイオードアレイ１個毎にユニット化し
たものを例示しである。図において（１）はセラミック
等の基板で、（２）は基板（１）の略中央部に基板を略
二分するよう載置された発光ダイオードアレイである。E) Embodiment FIG. 6 is a plan view of a light emitting head for printing according to an embodiment of the present invention, but no driving element is mounted so that the wiring can be easily read. In addition, an example in which each light emitting diode array is made into a unit is shown. In the figure, (1) is a substrate made of ceramic or the like, and (2) is a light emitting diode array placed approximately in the center of the substrate (1) so as to roughly divide the substrate into two.
この発光ダイオードアレイ（２）は、整列された複数の
発光部（２ｆ（２ｉ’・・・と、それに給電するリード
部（２＋（２）・・・が設けであるモノリシックＧ ａ
Ａ ｓ等である。（３１（３）・・−は発光ダイオー
ドアレイ（２）の両側の基板（１）上に設けられた発光
ダイオードアレイ用のワイヤポンドバットで、（４）（
４）・・・は駆動素子載置部（５）（５）の周辺部に設
けられた駆動素子用のワイヤポンドバットである。両方
ノワイヤポンドパッ） （３１＋３１・・・＋４１（４
１・・・はそれぞれ結線されているが、駆動素子載置部
（５）（５１は発光ダイオードアレイ（２）の中心位置
からはずれた基板（１）の隅部の点対称となる位置に設
けであるので、１部が載置部内側に、残シが外側に配線
され、全体としてその配線は空領域側になびくような均
一な密度の配線となっている。（尚配線は説明の都合上
線巾を無視して図示しである。） ＋６０６＋・・・は
発光ダイオードアレイ（２）のリード部（２）（２）・
・・とワイヤポンドパラ） （３）＋３＋・・・を結線
する金線等からなるワイヤである。This light emitting diode array (2) consists of a monolithic Ga
As etc. (31(3)...- are wire pond bats for the light emitting diode array provided on the substrate (1) on both sides of the light emitting diode array (2), (4)(
4)... are wire pond butts for driving elements provided around the driving element mounting parts (5) (5). Both Noiyaaponpa) (31+31...+41(4
1... are connected to each other, and the driving element mounting portion (5) (51 is provided at a point symmetrical position at the corner of the substrate (1) away from the center position of the light emitting diode array (2). Therefore, one part is wired inside the mounting part and the other part is wired outside, and the wiring as a whole has a uniform density so that it flows toward the empty area.(The wiring is for convenience of explanation only. (Illustrated ignoring the upper line width.) +606+... is the lead part (2) (2) of the light emitting diode array (2).
... and wire pound parallel) (3) +3+... is a wire made of gold wire etc. that connects it.
上述の如く駆動素子を点対称に配置することで、発熱部
分の分散、配線分散による放熱の均等化のほか、部品の
ない領域を広くかつ対称的にとれるので取扱いも容易と
なる。またこの実施例は１発光ダイオードアレイ毎のユ
ニットを示したが、細長い基板の略中央部に複数の発光
ダイオードアレイを直線上に整列配置した場合でも、各
発光ダイオードアレイ毎に本願を適用すればよい。By arranging the drive elements point-symmetrically as described above, in addition to distributing the heat generating parts and distributing the wiring to equalize the heat radiation, it is also easy to handle because the area without components can be made wide and symmetrical. Furthermore, although this embodiment shows a unit for each light emitting diode array, even when a plurality of light emitting diode arrays are arranged in a straight line approximately at the center of a long and thin substrate, the present invention can be applied to each light emitting diode array. good.
へ）発明の効果
以上の如く本発明は、基板と、基板の略中央部に基板を
略二分するよう載置された発光ダイオードアレイと、発
光ダイオードアレイの中心位置からずれ、かつ略点対称
となる基板上の位置に載置された発光ダイオードアレイ
の駆動素子とを具備した印字用発光ヘッドであるから、
配線しゃすく熱的に均一で取扱いやすい。f) Effects of the Invention As described above, the present invention provides a substrate, a light emitting diode array placed approximately in the center of the substrate so as to divide the substrate into two, and a light emitting diode array that is offset from the center position of the light emitting diode array and is approximately point symmetrical. The light emitting head for printing is equipped with a driving element for a light emitting diode array placed on a position on a substrate.
Wiring is smooth, thermally uniform, and easy to handle.
第１図は印字用発光ヘッドの側面断面図、第２図は従来
のヘッドの平面図、第３図は本発明実施例の印字用発光
ヘッドの平面図である。
（１）αト・・・・・基板、（２）ａ２・・・・・・発
光ダイオードアレイ、（２ｉ ｔｉ・・・・・・・・・
発光部、＋２）（２＋・・・町、、 リード部、（３）
（３）・・・・・・・・・（発光ダイオードアレイ用の
）ワイヤポンドバット、（４）（４）・・・・・・・・
・（駆動素子用の）ワイヤポンドバラ） 、＋５）（５
）・・・・・・駆動素子載置部、（１５１Ｑ５１・旧・
・駆動素子、（６）（６）・・・・・・・・・ワイヤ。
第１図
第３図FIG. 1 is a side sectional view of a light emitting head for printing, FIG. 2 is a plan view of a conventional head, and FIG. 3 is a plan view of a light emitting head for printing according to an embodiment of the present invention. (1) αt...Substrate, (2) a2...Light emitting diode array, (2i ti......
Light emitting part, +2) (2+...machi, Lead part, (3)
(3)・・・・・・・・・Wire pond butt (for light emitting diode array), (4)(4)・・・・・・・・・
・Wire plate (for drive element) , +5) (5
)...Drive element mounting section, (151Q51/old/
- Drive element, (6) (6)...Wire. Figure 1 Figure 3
Claims (1)
置された発光ダイオードアレイと、発光ダイオードアレ
イの中心位置からずれ、かつ略点対称となる基板上の位
置に載置された発光ダイオードアレイの駆動素子とを具
備した事を特徴とする印字用発光ヘッド。1) A substrate, a light emitting diode array placed approximately in the center of the substrate so as to divide the substrate into two, and a light emitting diode array placed at a position on the substrate that is offset from the center position of the light emitting diode array and is approximately symmetrical with respect to the point. A light emitting head for printing characterized by comprising a driving element for a light emitting diode array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58128357A JPS6019565A (en) | 1983-07-13 | 1983-07-13 | Luminous head for printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58128357A JPS6019565A (en) | 1983-07-13 | 1983-07-13 | Luminous head for printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6019565A true JPS6019565A (en) | 1985-01-31 |
| JPH0526663B2 JPH0526663B2 (en) | 1993-04-16 |
Family
ID=14982817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58128357A Granted JPS6019565A (en) | 1983-07-13 | 1983-07-13 | Luminous head for printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6019565A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5774166A (en) * | 1980-10-29 | 1982-05-10 | Oki Electric Ind Co Ltd | Array head of light emitting diode |
| JPS57109674A (en) * | 1980-12-27 | 1982-07-08 | Ricoh Co Ltd | Thermal head |
| JPS5824464A (en) * | 1981-08-04 | 1983-02-14 | Rohm Co Ltd | Manufacture of thermal printer head |
-
1983
- 1983-07-13 JP JP58128357A patent/JPS6019565A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5774166A (en) * | 1980-10-29 | 1982-05-10 | Oki Electric Ind Co Ltd | Array head of light emitting diode |
| JPS57109674A (en) * | 1980-12-27 | 1982-07-08 | Ricoh Co Ltd | Thermal head |
| JPS5824464A (en) * | 1981-08-04 | 1983-02-14 | Rohm Co Ltd | Manufacture of thermal printer head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0526663B2 (en) | 1993-04-16 |
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