JPS60197366A - Carrier for double-sided polishing machine - Google Patents
Carrier for double-sided polishing machineInfo
- Publication number
- JPS60197366A JPS60197366A JP59052127A JP5212784A JPS60197366A JP S60197366 A JPS60197366 A JP S60197366A JP 59052127 A JP59052127 A JP 59052127A JP 5212784 A JP5212784 A JP 5212784A JP S60197366 A JPS60197366 A JP S60197366A
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- double
- teeth
- polishing machine
- sided polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、両面研磨１機に使用する被加工物のキャリア
に係シ、特に薄い板材を高精度に研磨するのに好適な両
面研磨機用のキャリアに関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a carrier for a workpiece used in a double-sided polishing machine, particularly for a double-sided polishing machine suitable for polishing thin plate materials with high precision. Regarding your career.
被加工物の２面全同時に研磨する場合、第１図に示すよ
うに行なわれている。すなわち、同図において、不織布
１を取付けた上下一対′の定盤２．３ｔ−備えている。When polishing all two surfaces of a workpiece at the same time, it is carried out as shown in FIG. That is, in the same figure, a pair of upper and lower surface plates 2.3t to which the nonwoven fabric 1 is attached are provided.
各定盤２．３は、それぞれ軸４，５に支持されている。Each surface plate 2.3 is supported by a shaft 4, 5, respectively.
前記軸５の上端には、歯車６が形成されている。また、
前記定盤−３の外側には歯車７が配置されている。前記
定盤２と定盤３０間に配置されるキャリア８の外周には
、前記歯車６，７と噛合う歯９が形成されている。また
、キャリア８の中央部には、穴１０ｄ±形成され、被加
工物１１全遊嵌支持するようになりている。A gear 6 is formed at the upper end of the shaft 5. Also,
A gear 7 is arranged outside the surface plate 3. Teeth 9 that mesh with the gears 6 and 7 are formed on the outer periphery of the carrier 8 disposed between the surface plate 2 and the surface plate 30. Further, a hole 10d± is formed in the center of the carrier 8, so that the entire workpiece 11 is loosely fitted and supported.
このような構成で、軸４． ５ｖｆ−回転させ、定盤２
．３を回転させて被加工物１１の研磨を行なう。このと
き、ｍ車６の回転によシ、キャリア８が回転すると、歯
車７が固定されているため、キャリア８は、自転すると
共に歯車６の周囲を公転する。このようたして、被加工
物１１を移動させることにより、被加工物１１の加工面
を均一に研磨するようになっている。With this configuration, axis 4. 5vf - rotate, surface plate 2
．． 3 to polish the workpiece 11. At this time, when the carrier 8 rotates due to the rotation of the m wheel 6, the carrier 8 rotates and revolves around the gear 6 since the gear 7 is fixed. By moving the workpiece 11 in this manner, the processed surface of the workpiece 11 is uniformly polished.
このような両面研磨においては、被加工物１１の加工面
がキャリア８よシ突出していなけれはならない。このた
め、被加工物１１が薄くなると、キャリア８は、さらに
薄くしなければならない。In such double-sided polishing, the processed surface of the workpiece 11 must protrude beyond the carrier 8. Therefore, if the workpiece 11 becomes thinner, the carrier 8 must be made even thinner.
すると、キャリア８の外周部に形成される歯の強度も低
下する。Then, the strength of the teeth formed on the outer periphery of the carrier 8 also decreases.
従来、キャリア８は、合成樹脂もしくは金属の単一材料
で形成されている。そして、合成樹脂でキャリア８を形
成した場合、キャリア８の厚さが薄くなると、歯９の強
度が研磨時に発生する研磨抵抗力よシ小さくなって、破
損することになる。また、キャリア８を金属で形成した
場合、キャリア８の歯９や、穴１０のエツジによって不
織布を傷付け、被加工物１１の加工面に傷やスクラッチ
を発生させるなどの欠点がある。Conventionally, the carrier 8 is made of a single material such as synthetic resin or metal. When the carrier 8 is formed of synthetic resin, if the thickness of the carrier 8 becomes thin, the strength of the teeth 9 becomes smaller than the polishing resistance force generated during polishing, resulting in breakage. Furthermore, when the carrier 8 is made of metal, there are drawbacks such as the teeth 9 of the carrier 8 and the edges of the holes 10 damaging the nonwoven fabric and causing scratches and scratches on the processed surface of the workpiece 11.
本発明の目的は、上記した従来技術の欠点全なくし、薄
い被加工物を高精度に研磨し得るようにした両面研磨機
用のキャリアを提供するにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a carrier for a double-sided polisher that eliminates all of the drawbacks of the prior art described above and is capable of polishing thin workpieces with high precision.
〔発明の概要〕
上記目的を達成するため、本発明においては、円盤の周
囲に歯を形成した基板を金属で形成し、前記基板の歯部
を除く端面を合成樹脂の保護膜で扱うことによシ、歯の
強度を確保すると共に、キャリアによる不織布の損傷を
防止するようにしたことを特徴とする。[Summary of the Invention] In order to achieve the above object, the present invention includes forming a substrate with teeth around a disk from metal, and treating the end surface of the substrate excluding the teeth with a protective film made of synthetic resin. Additionally, it is characterized by ensuring the strength of the teeth and preventing damage to the nonwoven fabric by the carrier.
以下、本発明の実施例を図面にしたがって説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第２図ないし第４図は、本発明の一実施例全示すもので
、同図において、キャリア１２は、中央部に４個の穴１
３が形成され、外周部に歯１４を形成した金属製の基板
１５の歯１４部を除く端面全合成樹脂製の保護膜１６で
榎い穴１７全形成して成る。2 to 4 show an embodiment of the present invention, in which the carrier 12 has four holes 1 in the center.
3 is formed, and the end surface of a metal substrate 15 with teeth 14 formed on the outer periphery except for the teeth 14 portion is entirely formed with a protective film 16 made of synthetic resin.
このような構成にすることによシ、キャリア１２の歯１
４０強度を確保し、かつ研磨時に不織布と基板１５が接
触して不織布を損傷するのを防止することができるので
、被加工物を高精度に加工することができる。With such a configuration, the teeth 1 of the carrier 12
40 strength can be ensured and damage to the nonwoven fabric due to contact between the nonwoven fabric and the substrate 15 during polishing can be prevented, so the workpiece can be processed with high precision.
たとえば、被加工物の厚さが１腫のとき、前記４ヤリア
１２は、０．５〜Ｑ、４譚の厚さのステンレス板で形成
し、保護膜１６はエポキシ樹脂で、厚さｏ、ｉ〜０．２
Ｗ程度に形成する。For example, when the thickness of the workpiece is 1 mm, the 4 layers 12 are formed of a stainless steel plate with a thickness of 0.5 to 4 mm, and the protective film 16 is made of epoxy resin and has a thickness of o, i~0.2
Form to about W.
前記保護膜１６は、所要の形状に形成さ、れた基板１３
０表面を適当な粗さになるように荒したのち、合成樹脂
を成形と同じ方法で覆着させればよい。The protective film 16 is formed into a desired shape and attached to the substrate 13.
After roughening the surface to an appropriate roughness, it is sufficient to cover it with a synthetic resin using the same method as molding.
カシ、合成樹脂は、エポキシ系、ポリイミド系、その他
の合成樹脂を使用することができる。As the oak and synthetic resin, epoxy-based, polyimide-based, and other synthetic resins can be used.
以上述べた如く、本発明によれば、厚さの薄い被加工物
？、その加工面に傷やスクラッチを発生させることなく
、高精度の研磨を行なうことができる。As described above, according to the present invention, a thin workpiece can be processed. , it is possible to perform high-precision polishing without causing scratches or scratches on the processed surface.
第１図は、両面研磨機の要部の構成図、第２図は、本発
明によるキャリアの平面図、第３図は、第２図のＡ−Ａ
断面図、第４図は、第２図のＥ−Ｅ断面図である。
１４・・・歯 １５・・・基板
１６・・・保護膜
代理人弁理士 高 橋明 夫
第 １ 図
篤 Ｚ 図
篇 ３ 図
第 ４図FIG. 1 is a configuration diagram of the main parts of a double-side polishing machine, FIG. 2 is a plan view of a carrier according to the present invention, and FIG. 3 is a line A-A in FIG. 2.
The sectional view, FIG. 4, is a sectional view taken along line EE in FIG. 14...Teeth 15...Substrate 16...Protective film Patent attorney Akio Takahashi 1st figure Atsushi Z 3rd figure 4th figure
Claims (1)
に噛合う歯が形成され、中央部に被加工物を遊嵌支持す
る穴が形成された両面研磨機用のキャリアにおいて、外
周部に歯が形成され、中央部に被加工物全支持する穴が
形成された金属性の基板と、この基板の両端面に、歯部
を除く両端面を慣う合成樹脂性の保護膜を形成したこと
を特徴とする両面研磨機用のキャリア。In a carrier for a double-sided polishing machine, the outer circumferential surface is formed with teeth that mesh with gears arranged at the center and outer circumference of the double-sided polishing machine, and a hole is formed in the center to loosely fit and support the workpiece. A metal substrate with teeth formed in the center part and a hole formed in the center to support the entire workpiece, and a synthetic resin protective film on both end surfaces of this substrate excluding the teeth. A carrier for a double-sided polishing machine, characterized by the fact that it is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59052127A JPS60197366A (en) | 1984-03-21 | 1984-03-21 | Carrier for double-sided polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59052127A JPS60197366A (en) | 1984-03-21 | 1984-03-21 | Carrier for double-sided polishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60197366A true JPS60197366A (en) | 1985-10-05 |
Family
ID=12906208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59052127A Pending JPS60197366A (en) | 1984-03-21 | 1984-03-21 | Carrier for double-sided polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60197366A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004148497A (en) * | 2002-10-31 | 2004-05-27 | Wacker Siltronic Ag | Carrier and method for processing workpieces on both sides simultaneously |
| JP2009099980A (en) * | 2007-10-17 | 2009-05-07 | Siltronic Ag | Carrier, method for coating carrier, and processing method for simultaneously removing material on both sides of semiconductor wafer |
| DE102011089570A1 (en) * | 2011-12-22 | 2013-06-27 | Siltronic Ag | Guide cage for grinding both sides of at least one disc-shaped workpiece between two rotating working wheels of a grinding device, method for producing the guide cage and method for simultaneous two-sided grinding of disc-shaped workpieces using the guide cage |
-
1984
- 1984-03-21 JP JP59052127A patent/JPS60197366A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004148497A (en) * | 2002-10-31 | 2004-05-27 | Wacker Siltronic Ag | Carrier and method for processing workpieces on both sides simultaneously |
| JP2009099980A (en) * | 2007-10-17 | 2009-05-07 | Siltronic Ag | Carrier, method for coating carrier, and processing method for simultaneously removing material on both sides of semiconductor wafer |
| US9539695B2 (en) | 2007-10-17 | 2017-01-10 | Siltronic Ag | Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers |
| DE102011089570A1 (en) * | 2011-12-22 | 2013-06-27 | Siltronic Ag | Guide cage for grinding both sides of at least one disc-shaped workpiece between two rotating working wheels of a grinding device, method for producing the guide cage and method for simultaneous two-sided grinding of disc-shaped workpieces using the guide cage |
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