JPS60201879A - Diamond grinding wheel composed of deposited diamond particles - Google Patents

Abstract

PURPOSE:To exhibit excellent grinding performance for long term by depositing artificial diamond particles in the dispersion phase of sintered alloy with strong contacting force and limited grain size distribution range. CONSTITUTION:The entirely of substrate or at least the grinding face of substrate is formed with sintered alloy having such composition as more than one of W, MO, Nb and their alloy will exist as the dispersion phase. Then artificial diamond particles having average grain size of 4-6mum are deposited with distribution area ratio of 50-60% and strong contacting force onto the dispersion phase of the grinding face of substrate. Thereafter, metal surface layer is formed through vacuum deposition or galvanization onto the surface of such diamond grinding wheel to exhibit and maintain excellent grinding performance for long term.

Description

[Detailed description of the invention] This invention applies to diamond polishing whetstones.

In particular, the present invention relates to a new diamond grinding wheel composed of precipitated artificial diamond grains.

Conventionally, diamond polishing wheels have been generally used for grinding and polishing cemented carbide, other cermets, ceramics, glass, and the like.

This conventional diamond polishing wheel has a base material made of, for example, M or M alloy, and the polishing surface is coated with a resin resin as a binder.
It has a structure in which natural diamond grains or artificial diamond grains manufactured by ultra-high pressure and high temperature synthesis are fully dispersed and bonded using a metal such as Cu or uyi.

Therefore, in the conventional diamond grinding wheel mentioned above,
Natural diamond grains and artificial diamond grains are not expensive, but diamond grains that affect the polished surface must be kept within a particle size distribution as narrow as possible, which requires an extremely long classification process. Therefore, the manufacturing cost was unavoidably high.

Therefore, the inventors of the present invention, from the above-mentioned viewpoint.

As a result of research aimed at manufacturing a diamond abrasive wheel composed of diamond grains with a narrow particle size distribution at a lower overall manufacturing cost, we found that: (1) using a conventional powder metallurgy method, the entire base material, or at least the polishing of the base material; W as active surface partial, dispersed phase.

It is manufactured from a sintered alloy having a structure in which one or more of Mo, Nb, and their alloys are present, and the polishing surface member is manufactured by sintering a core material or a main body made of stainless steel, M alloy, etc. A substrate is formed by fitting or brazing, and then the polishing surface of this substrate is used as a means for producing conventional artificial diamond precipitation, that is, by completely heating the reaction mixture gas and activating it. A method using a thermionic emitting material as described in Japanese Patent No. 91100.

(b) A method using high frequency plasma discharge as described in, for example, JP-A No. 58-135117; (C) Plasma discharge using microwaves as described in, for example, JP-A-58-110494. How to use all.

When treated by any of the methods (a) to (C) above, artificial diamond is precipitated and formed with strong adhesion to the dispersed phase mainly on the polishing surface. Since the particle size distribution of the precipitated artificial diamond grains is within an extremely narrow range, when used as a polishing wheel, it exhibits excellent whetstone performance. In the case of evaporation formation by ordinary chemical vapor deposition method or physical vapor deposition method, or shimetuki formation by electrolytic plating method or electroless plating method, the adhesion of the precipitated artificial diamond particles is further improved. Moreover, they found that the manufacturing cost of this diamond polishing whetstone is extremely low.

The present invention has been made based on the above findings, and includes the following: (1) The entire substrate or at least the polishing surface portion of the substrate contains one type of W, Mo, Nb, or an alloy thereof as a dispersed phase. A diamond polishing whetstone, which is composed of a sintered alloy having a structure in which the above exists, and has a structure in which artificial diamond grains formed by an artificial diamond precipitation method are closely attached to the dispersed phase on the polishing surface of the base. .

(2) The entire substrate or at least the polishing surface portion of the substrate is composed of a sintered alloy having a structure in which one or more of W, Mo, and Nb and alloys thereof are present as a dispersed phase, and the substrate Artificial diamond is precipitated on the dispersed phase on the polishing surface of 4:lj! A diamond polishing whetstone having a structure in which artificial diamond grains shaped like 1j121-2 are closely adhered by the 2nd method, and further having a metal surface layer formed by vapor deposition or plating on the surface thereof.

It has the following characteristics.

Next, the diamond polishing grindstone of the present invention will be specifically explained using examples.

Example 1 According to a normal powder metallurgy method, W powder having an average particle size of 1.2 μm, N1 powder having an average particle size of 3 μm, and Ou powder having an average particle size of 5 μm were prepared, and the t-1 volume of these raw material powders was W: 80%, Ni: 15.

Cu: 5% blended powder.

Wet-mixed for 72 hours using ethyl alcohol as a solvent in a ball mill using a steel ball with a diameter of 6 mm, and after drying, outer diameter near 0 mm x inner diameter: 50 m x thickness =
It is press-molded into a ring-shaped green compact with dimensions of 51+II++, and then this green compact is heated in a hydrogen atmosphere at a temperature of 1
1 by sintering at 400℃ for 2 hours.
A polishing surface member made of a W-based sintered alloy having a structure in which W is present as a dispersed phase is manufactured, and a cup-shaped grindstone body made of stainless steel of 1JIs/5US310 is coated with wax. The grindstone substrate is then used as a means for heating and activating the reaction mixture using a thermionic emitter, for example a filament made of tungsten metal. Medical reaction vessel: a quartz tube with an outer diameter of 120 φ, reaction mixture gas composition: volume ratio, C! H4/H2 = 1/100, distance between thermionic emitting material and the polishing surface of the grindstone base = 15
N. Atmospheric pressure inside the reaction vessel Nl Q torr. Heating temperature of the thermionic emitting material: 2200°C. Heating temperature of the polishing surface by the thermionic emitting material = 750°C.

Reaction treatment time: 20 hours By processing under the following conditions, an average particle size of 4.
Artificial diamond grains of μm size were precipitated at a distribution area ratio of 60%.

Next, the diamond abrasive grinding wheel of the present invention obtained as a result, and its surface were further coated with a normal sputtering method. Used, vacuum degree inside the reaction vessel: 2X 10 torr, atmosphere:
The applied voltage to the Arb Ni target was 1200V.

Voltage applied to the grindstone (rotating at 4 rotations/min): 200v
.

Processing time: 1 hour.

Regarding the surface-coated diamond polishing wheel of the present invention, in which a metal surface layer consisting of Ni with an average layer thickness of 2 μm was completely deposited under the conditions of
When the time required to polish the polished surface of the silicon nitride-based ceramic specimen having the dimensions of 5 m x thickness to 0.28 mm was measured, it took 25 seconds in each case.
This required time was equivalent to that of a conventional resin-bonded diamond polishing whetstone.

Example 2 Similarly, according to the usual powder metallurgy method, Mo powder having an average particle size of 1.5 μm and 1.8 μm were used as raw material powders.
nb powder with mf, CO powder with same 2 μm.

A Cu powder with a diameter of 5 μm and a Mn powder with a diameter of 5 μm were prepared.

These raw material powder Song Yin, capacity section, Mo: 30 section, Nb 22
5%, Co:204. The composition of Ou: 17% and Mn: 8% was blended, and the shape of the ring-shaped green compact was set to outer diameter: 50 mm x inner diameter: 30 mm x thickness: 15 mm, and its polishing action was A convex strip with a radius of 5 mm is provided along the circumference at the center of the outer circumferential surface, and the sintering conditions are in a hydrogen atmosphere.

Example 1 except that the temperature was kept at 1350°C for 1 hour.
Mo as the dispersed phase under the same conditions as in .

A polishing surface member made of a sintered alloy having a structure in which Wb and its alloys are present is manufactured, and this polishing surface member is made of a brass core material having dimensions of diameter: 30mm x thickness = 15mm. JP-A-58-' discloses a method of forming a formed whetstone base by shrink-fitting the whetstone base, and then heating the whetstone base with a reaction mixture gas and using plasma discharge by microwave as a means of activating the whetstone base. It was charged into an artificial diamond precipitation generating apparatus as described in Japanese Patent No. 110494.

Reaction vessel: quartz tube with a diameter of 120 mm, reaction mixture gas composition in two volume ratio, C'H4/H2/Ar = 1/10
0/10).

Atmospheric pressure in the reaction vessel: 1 torr, microwave: 2.45 GH2.

Reaction treatment time = 24 hours.

By processing under the following conditions, artificial diamond grains having an average grain size of 6 μm'z were precipitated and formed at a distribution area ratio of 50 on the dispersed phase on the polishing surface of the grindstone body.

Next, the resulting diamond polishing wheel of the present invention and its surface were further coated with an average layer thickness of 3 under normal conditions.
Using the surface-coated diamond polishing wheel of the present invention in which a metal surface layer is formed by electroplating Cu of μm, it has a composition of Co212 weight ratio, WC: residue, and is profiled to have a radius of 4 and 8. When a recess of mm was formed and the recess of the cemented carbide material was final polished, the result was 11 mm.
It took 0 seconds.

This required time was equivalent to that of a conventional resin-bonded diamond polishing whetstone.

As described above, in the diamond polishing wheel of the present invention, the diamond grains constituting the diamond grains are bonded with strong adhesion, and the grain size is also determined by the dispersed phase in the sintered alloy.
Because they are distributed within an extremely narrow range, they exhibit excellent polishing performance over an extremely long period of time.Furthermore, the diamond grains can be formed using the normal artificial diamond precipitation method, making it possible to produce well-sized artificial diamond grains. It has industrially useful properties such as low manufacturing cost and low manufacturing cost.

Applicant: Mitsubishi Metals Corporation Agent Tomi 1) Kazuo and 1 other person

Claims (2)

[Claims] (1) The entire substrate or at least the polishing surface portion of the substrate is composed of a sintered alloy having a structure in which one or more of W, Mo, and Nb and alloys thereof are present as one dispersed phase, and the substrate A diamond polishing wheel made of precipitated artificial diamond grains, characterized in that it has a structure in which artificial diamond grains formed by an artificial diamond precipitation method adhere to the dispersed phase on the polishing surface. (2) The entire base or at least the polishing surface portion of the base is composed of a sintered alloy having a structure in which one or more of W, Mo, and Nb, and their alloys are present as one dispersed phase, and the base It has a structure in which artificial diamond grains formed by an artificial diamond precipitation method are closely attached to the dispersed phase on the polishing surface, and further has a metal surface layer formed by vapor deposition or plating on the surface. A diamond polishing wheel composed of precipitated artificial diamond grains.