JPS6020601A - Microwave circuit device - Google Patents

Abstract

PURPOSE:To execute a mechanically stable connection by constituting so that the connection to other MIC circuit can be executed without using special input and output terminals, when constituting a separate MIC circuit module of a microwave. CONSTITUTION:An MIC oscillating circuit substrate is incorporated in a metallic housing 20 having an opening 19 into which a projecting part 16 of this substrate is inserted, an MIC oscillating circuit module is constituted by covering this housing with a metallic upper cover 8, and this module is connected to other MIC mixing circuit. A ground electric conductor 24 is formed on the rear side of a dielectric substrate 23 having a recessed part 26, and an MIC mixing circuit 13 having micro-strip lines 25a-25c which become a signal input terminal, a local oscillating input terminal and a signal output terminal, respectively is formed on the surface, by which an MIC mixing circuit substrate is constituted. A micro-strip line 3c and 25b to be connected are soldered 27.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a microwave circuit device that can be used in a microwave communication device in the microwave band.

Conventional configurations and their problems In recent years, microwave band communication devices have formed IJ tube lines on dielectric substrates with a ground conductor, and mounted circuit elements such as transistors and resistors on them. Mr.
C (Microwave I C) @l route is now used. In such a microwave circuit, a method is often used in which each circuit is made independent into individual circuit modules, and then the modules are connected to assemble the entire circuit.

A conventional microwave circuit device will be described below with reference to the drawings. FIG. 1 shows a conventional example in which a MIC oscillation circuit is made into an individual circuit module.

In the figure a), a ground conductor 2 is formed on the back surface of a dielectric substrate 1, and a micros I-'J tube line 3a is formed on the front surface.

3b, the microstrip line resonator 4, and the transistor 5 constitute a MIC oscillation circuit, and the entire oscillation and power are applied to the microstrip line 3a. Note that the DC bias circuit is omitted in the figure. Figure b) shows that the MIC board shown in Figure a) is assembled into a metal casing 6, and the oscillation output is connected to the internal microspheres via pin 7.The MIC board shown in figure a) is soldered to the IJ tube line 3a at point 9 to the outside. Roll 9.

Figure d) is a top view, and C) is a metal upper lid used for shielding from the outside, which is joined to the top of Figure b) and used as an individual circuit module. Note that the oscillation output may be outputted by an N-type or SMA-type coaxial connector 9 instead of the pin 7 having a hermetic seal structure. .

Now, the individual circuit module shown in Figure 1 can be connected to another MIC.
FIG. 2 shows a structure connected to a circuit, for example, an M/C mixer circuit. FIG. 2 IL) shows all microstrip lines 12 and 12 for input signals and output signals, respectively, on a dielectric substrate 10 having a ground conductor 11 on the back side.
12b and 12C, and a portion 13 includes a mixer circuit including a diode. Figure b) is a perspective view of the oscillation circuit of the first part A and the mixer circuit of Figure 2 a) connected using the back support conductor 14, and figure 0) is a cross-sectional view taken along line A-A'. The oscillation output applied to pin 7 is soldered at 16 points and connected to the local oscillator input microst IJ tube line 12b, and is supplied to the mixer circuit 15.

However, in the above configuration, when connecting individual circuit modules, it is necessary to connect them through special input/output terminals, and when configuring the metal casing, two metal parts are required. It had the disadvantage that.

OBJECTS OF THE INVENTION It is an object of the present invention to connect to other MI
To provide a microwave circuit device which can be connected to a C circuit, can change the height of its MIC circuit board with respect to a metal casing, and does not require a separate back support conductor.

Structure of the Invention The microwave circuit device of the present invention includes a dielectric substrate having a convex portion, a ground conductor formed on the back surface, and a microwave circuit having an input/output microstrip line formed in the center of the convex portion on the front surface. The individual microwave circuit is configured such that the parts other than the convex part are covered with a metal casing, and the convex part forms a ground conductor on the back side of the dielectric substrate having the concave part, and the four parts on the front side and the other side form a ground conductor. In the center of the input/output micros) +
The microstrip line is arranged to fit into a recess of a microwave circuit board on which a microwave circuit other than the microwave circuit having one tube line is formed, and the convex part and the four microstrip lines are connected by soldering. Good, no special input/output terminals are required when connecting with other microwave circuit devices. Furthermore, the four sides of the thin metal casing, which has a hexagonal shape without a bottom, have claws bent inward by punching at the same height from the bottom, and the side faces have claws that are bent inward at the same height from the bottom. A metal casing has a structure in which a through protrusion is provided at a certain height or a notch narrower than the width of the side surface is provided from the bottom to a position slightly higher than the claw,
A microwave circuit board having a dielectric substrate having a convex portion, a ground conductor formed on the back side, and a microphone mouth wave circuit having an input/output microstrip line at the center of the convex portion formed on the front surface, is used. The microwave circuit board is arranged so as to fit into a through hole or notch provided on a side surface of the metal casing, and the surface of the microwave circuit board is placed in a pawl provided on the side surface with the surface facing the top surface of the metal casing. With a structure in which the ground conductor on the back side of the microwave circuit board and the inside of the side surface of the metal casing are connected by soldering,
By changing the angle of the claws provided on the side surface, the height of the microwave circuit board relative to the metal casing can be changed, and a separate back support conductor is not required.

DESCRIPTION OF EMBODIMENTS A first embodiment of the present invention will be described below with reference to the drawings. FIG. 3 shows a perspective view of an MMC oscillation circuit module which is an embodiment of the present invention.

A ground conductor 1 is provided on the back surface of the dielectric substrate 17 having the convex portion 16.
8, and an output micro string line 3 which passes through the entire center of the micro string line 3b and the convex portion 16 is formed on the surface.
0. A MIC oscillation circuit board is configured by providing a microstrip resonator 4 and a transistor 6,
This is assembled into a metal casing 20 having an opening 19 into which the convex portion 16 of the MMC oscillation circuit board is inserted, as shown in FIG.

A perspective view of the assembly assembled in this way is shown in Figure C).

Figure d) is a perspective view of the MIC'J vibration circuit module in which a metal upper lid 8 is covered. It is applied to the full-circuit cover microstrip line 3C.

Now, FIG. 4 shows a structure in which the MIC oscillation circuit module configured as shown in FIG. 3 d) is connected to another MIC mixer circuit. The figure &) is a perspective view of another MIC circuit board to be connected, in which a ground conductor 24 is formed on the back surface of a dielectric substrate 23 having a recess 26, and signal input terminals and signal input terminals are formed on the front surface, respectively.
A 5MIC mixer circuit board is constructed by forming a MIC mixer circuit 13 having microstrip lines 25a, 25b, and 25C'ii, which serve as local oscillator input terminals and signal output terminals. Figure b) is a perspective view of a mounting structure in which the MIC oscillation circuit module of Figure 3 d) and the llIc mixer circuit board of Figure 4 a) are connected. In the figure, the convex portion 16 having the output terminal of the MIC oscillation circuit module is connected so as to fit into the concave portion 26 of the MIC mixer circuit board to be connected, and the microstrip lines 30'' and 25b to be connected are connected. is soldered at 27 points.

14 is a support conductor. C) in the same figure is B-B in b) in the same figure.
'This is a cross-sectional view.

In the microwave circuit device of this embodiment configured as described above, when connecting to another MIC circuit, since the portion having each connection terminal has a structure in which the convex portion and the concave portion are fitted, it is possible to Connections can be made without using special input/output terminals. The mating structure also allows for a mechanically stable connection.

Next, a second embodiment of the present invention will be described with reference to the drawings. Figure 5 a) shows the MIC shown in Figure 3 a).
It is the same as the oscillation circuit board. Figure b) has a pawl 31b made by processing a thin metal plate into a hexagonal shape with one side missing and punching out a 1.312L portion and bending it inward.
It is a perspective view of a metal casing having a structure in which a through hole 28 is provided at the same height as the pawl 31b, and C) is a sectional view along line c-c'. The convex portion 16 of the MIC circuit board shown in FIG. 5a) is
It is assembled into the through hole 28 of the metal casing 3o shown in pb), and the inner part 32 of the metal casing 3o and the back ground conductor 18 of the MIC oscillation circuit board are connected by soldering at the part 33. This is a perspective view of the MIC oscillation circuit module (V34), and e) is a sectional view taken along line DD'. When the MIC circuit module configured in this manner is to be connected to another MIC circuit, it can be connected by a method similar to that described in the first embodiment.

The microwave circuit device of this embodiment configured in this manner does not particularly require a support conductor for fixing the back surface of the MIC circuit board, and the structure thereof is simplified.

Further, by changing the angle of the inwardly bent tab 31b, the height of the MIC circuit board relative to the metal casing can be changed.

Further, other embodiments of the present invention will be described with reference to the drawings. 6a), a ground conductor 37 is formed on the back surface of a dielectric substrate 36 having convex portions 35a and 35b, and an input/output microstrip line 38 is formed on the front surface at the center of the convex portions.
38b is a perspective view of an MIC circuit board on which a four-terminal MIC circuit (for example, an amplifier circuit) 39 is formed. When such a MIC circuit board is mounted in a thin metal casing 42 that has notches 402L and 40b for receiving two input/output protrusions, and has a bent tab 41 on the inside. Fig. 6b) is a perspective view of the same, and Fig. 6c) is a top view thereof. Note that the ground conductor on the back surface of the MIC circuit board is connected to the inside of the metal casing by soldering.

With this configuration, even if the MIC circuit has two or more input/output terminals, the MIC circuit board can be easily integrated by providing a notch in the metal casing for inserting two protrusions at the same time. It is possible to construct a MiC circuit module whose height can be changed by changing the angle of the claw provided inside the metal casing without requiring a support conductor on the back surface of the metal casing.

Effects of the Invention As is clear from the above description, the present invention provides a microwave conductor having a ground conductor formed on the back surface of a dielectric substrate having a convex portion, and an input/output microstrip line formed at the center of the convex portion on the front surface. configuring an individual microwave circuit with a structure in which a circuit is formed and the parts other than the convex portion are covered with a metal casing;
The convex has a concave portion, and a ground conductor is formed on the surface of the dielectric substrate, and a microwave circuit other than the microwave circuit, which has an input/output microstrip line in the center of the concave portion, is formed on the surface of the dielectric substrate. The microstrip lines are arranged so as to fit into the four parts of the circuit board, and the convex parts and the microstrip lines of the four parts are connected by soldering.
When connecting two MIC circuits, there is no need for special input/output terminals, and the fitting structure of the two substrates allows for a mechanically stable connection.

Further, the four side surfaces of the thin metal casing having a hexagonal shape lacking a bottom surface are provided with pawls bent inward by punching at the same height from the bottom surface, and the side furnace is A metal casing having a structure in which a through hole is provided at the same height as the pawl, or a notched portion having a width narrower than the width of the side surface from the bottom surface to a position slightly higher than the pawl, and a convex portion is provided. A microwave circuit board comprising a dielectric substrate with a ground conductor formed on the back side and a microwave circuit formed on the front side with an input/output microstrip line in the center of the convex part, and the convex part formed on the metal casing. The microwave circuit board is arranged so as to enter a through hole or a notch provided on a side surface, and the surface of the microwave circuit board is in contact with a pawl provided on the side surface in a direction facing the top surface of the metal casing, and the By configuring the MIC circuit module with a structure in which the ground conductor on the back side of the wave circuit board and the inner side of the side surface of the metal casing are connected by soldering, the MIC circuit module is constructed with a structure in which the ground conductor on the back side of the wave circuit board and the inside of the side surface of the metal casing are connected. This eliminates the need for a support conductor on the back side of the MIC circuit board, and has the effect that the height of the JMIC circuit board relative to the metal casing can be changed by changing the angle of the claws provided inside the metal casing. .

[Brief explanation of drawings]

Figure 1 shows a conventional MXC circuit module.
1 is a perspective view of the MIC oscillation circuit board, b is a perspective view of the MIC oscillation circuit module with output terminals built into the metal casing, C
is a perspective view of the metal upper lid, d is a top view of the MIC oscillation circuit module, FIG. 2 shows the connection structure between the conventional MIC oscillation circuit module and the MIC mixer circuit, a is a perspective view of the MMC mixer circuit board, b is a perspective view of the same connection structure, C is a sectional view thereof, FIG. 3 shows the first embodiment of the present invention, and a
is a perspective view of the MIC oscillation circuit board, b is a perspective view of the metal casing, C is a perspective view of the MIG oscillation circuit module built into the metal casing, and d is a perspective view of the MIC oscillation circuit module with a metal top lid. , FIG. 4 shows M of the first embodiment of the present invention.
The connection structure between the IC oscillation circuit module and the MIC mixer circuit board having four other parts is shown. A is a perspective view of the MIC mixer circuit board, B is a perspective view of the intermediate device structure, and C is a sectional view thereof. FIG. 5 shows a second embodiment of the present invention, in which a is a perspective view of a MIC oscillation circuit board, b is a perspective view of a metal casing,
C is a cross-sectional view thereof, d is a perspective view of a MIC oscillation circuit module built into a metal casing, e is a cross-sectional view thereof, FIG. 6 shows another embodiment of the present invention, and a is a set of input/output terminals. B is a perspective view of an MIC circuit module assembled in a metal casing, and C is a top view thereof. 1...Dielectric substrate, 2...;...Grounding conductor,
32L... Output microstrip line, 6.
...Metal housing, 7...Output terminal, 14.
...i supporting conductor, 17... dielectric substrate having a protrusion, 20... metal casing, 30.42.
...Thin metal casing, 28...Through hole, 31b, 41...Tail bent inward,
33... Soldering parts, 401L, 40b.
・・・・・・Incision part. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure b) Figure c Figure 3/Me C b, C7 Figure 5 3 Figure 6

Claims (2)

[Claims] (1) A ground conductor is formed on the back surface of a dielectric substrate having a convex portion, a microwave circuit having an input/output microstop line is formed in the center of the convex portion, and An individual microwave circuit is constructed with a structure covered by a metal casing, and the convex part forms a ground conductor on the back side of a dielectric substrate having four parts, and an input/output microstrobe 11 tube is formed on the front surface in the center of the concave part. The microstop line is arranged to fit into four parts of a microwave circuit board on which a microwave circuit other than the microwave circuit having a line is formed, and the microstop line in the convex part and the concave part are electrically connected. microwave circuit device. (2) The metal casing has a hexagonal shape with no gold on the bottom, and the four thin sides have claws bent nine inwards by punching at the same height from the bottom, and A dielectric material having a convex portion in the metal casing, which has a through hole provided at a height similar to that of the pawl or a cut portion narrower than the width of the side surface from the bottom surface to a position slightly higher than the pawl. A microwave circuit board on which a ground conductor is entirely formed on the back side and a microwave circuit having an input/output microstrip line in the center of the convex part is formed on the front side, and the convex part is on the side surface of the metal casing. The microwave circuit board is arranged so as to enter the provided through hole or notch, and the surface of the microwave circuit board is in contact with a pawl provided on the side surface in a direction opposite to the top surface of the metal casing, and the microwave circuit board is The microwave circuit device according to claim 1, characterized in that a portion where the ground conductor on the back surface contacts the inside of the side surface of the metal casing is connected by soldering.