JPS60211894A - Method of connecting printed coil pattern - Google Patents
Method of connecting printed coil patternInfo
- Publication number
- JPS60211894A JPS60211894A JP6752284A JP6752284A JPS60211894A JP S60211894 A JPS60211894 A JP S60211894A JP 6752284 A JP6752284 A JP 6752284A JP 6752284 A JP6752284 A JP 6752284A JP S60211894 A JPS60211894 A JP S60211894A
- Authority
- JP
- Japan
- Prior art keywords
- printed coil
- coil pattern
- connection
- insulating sheet
- spiral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 26
- 239000004020 conductor Substances 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明はサブトラクティブ法或いはアディティブ法等の
いわゆる印刷回路方式によ多形成されたプリントコイル
パターンを複数層に積層し、各コイルを順次電気的に接
続する方法に関するものである。Detailed Description of the Invention (Field of Industrial Application) The present invention is based on a method in which printed coil patterns formed in multiple layers by a so-called printed circuit method such as a subtractive method or an additive method are laminated in multiple layers, and each coil is sequentially electrically applied. It is related to the method of connection.
(従来技術)
プリントコイルパターンは渦巻状の導体を形成している
ため中央端部の回路端は他の回路とは平面的に接続を取
る事は不可能で、立体的に接続を取る方法が種々提案さ
れている。従来は例えば特開昭57−186940号公
報に記載されている様に絶縁層の両側に渦巻状の導体を
形成しその中央端同士を機械的に押圧し上下導体の接触
を取った後電気溶接すると云う方法が提案されているが
、絶縁層を機械的に突き破って導体同士の接触を取ると
云う方法のために導体の接触面積にバラツキが生じ接続
抵抗がバラツク、或いは信頼性が低いと云う問題があっ
た。一方例えば特開昭57−207396号公報に記載
されている様に絶縁層の両側に渦巻状の導体を形成し、
その中央端部に孔明は加工を行った後、銅スルホールメ
ッキを行って上下導体の接続を行ないコイル間の接続を
取ると云う方法が提案されている。接続抵抗のバラツキ
、或いは信頼性の低下と云う問題はないが銅メッキを厚
く付ける必要があり、又メッキ時間も多く要するためコ
ストが高くなると云う欠点があった。(Prior art) Since the printed coil pattern forms a spiral conductor, it is impossible to connect the circuit ends at the center end with other circuits in a two-dimensional manner, so there is no way to connect them three-dimensionally. Various proposals have been made. Conventionally, as described in JP-A No. 57-186940, for example, spiral conductors were formed on both sides of an insulating layer, and their central ends were mechanically pressed together to bring the upper and lower conductors into contact, followed by electric welding. This method has been proposed, but because the method involves mechanically breaking through the insulating layer to bring the conductors into contact with each other, the contact area of the conductors varies, leading to variations in connection resistance and low reliability. There was a problem. On the other hand, as described in JP-A No. 57-207396, spiral conductors are formed on both sides of the insulating layer,
A method has been proposed in which the central end is machined and then copper through-hole plating is performed to connect the upper and lower conductors and to establish a connection between the coils. Although there are no problems such as variations in connection resistance or deterioration of reliability, there are disadvantages in that the copper plating must be thickly applied and the plating time is longer, resulting in higher costs.
(発明の目的)
本発明は信頼性があシかつコストの安い方法のなかった
プリントコイルパターンの接続方法において低コストで
信頼性のある接続方法を得んとして研究した結果、渦巻
状回路の導電体面同士を対向させ、中央端同士を接続す
るための接続孔を有する絶縁シートを介在させて、該接
続孔を通じて導電性物質で中央端同士を接続することに
より容易に接続出来るとの知見を得、更にこの知見に基
づき種々研究を進めて本発明を完成するに至ったもので
ある。(Objective of the Invention) The present invention was developed as a result of research aimed at finding a low-cost and reliable connection method for printed coil patterns for which there was no reliable and low-cost method. It was found that connection can be easily achieved by placing the two bodies facing each other and interposing an insulating sheet with a connecting hole for connecting the central ends, and connecting the central ends with a conductive material through the connecting hole. Furthermore, based on this knowledge, various studies were conducted and the present invention was completed.
(発明の構成)
本発明は絶縁層の片面に導電体で渦巻状の回路を形成し
たプリントコイルの渦巻状回路の中央端同士を接続する
方法において、渦巻状回路の導電体面同士を対向させ、
中央端同士を接続するだめの接続孔を有する絶縁シート
を介在させて、該接続孔を通して導電性物質で中央端同
士を接続することを特徴とするプリントコイルパターン
の接続方法である。(Structure of the Invention) The present invention provides a method for connecting the center ends of the spiral circuits of a printed coil in which a spiral circuit is formed with a conductor on one side of an insulating layer, in which the conductor surfaces of the spiral circuits are faced to each other,
This method of connecting printed coil patterns is characterized in that an insulating sheet having a connection hole for connecting the center ends is interposed, and the center ends are connected to each other with a conductive material through the connection hole.
本発明において用いられる導電体とは銅、アルミ、銀等
で、渦巻状の回路(2)を形成する方法としては銅或い
はアルミ箔等の金属箔を絶縁層(3)の全面にわたって
貼シ合わせたものからエツチング法で必要部分のみ残し
たサブトラクティブ法とか、或いは必要部分に銅メッキ
等を行なうアディティブ法、又銅ペースト、銀ペースト
等をスクリーン印刷して回路(2)を形成する方法があ
る。この様にして得られたプリントコイルパターン(1
)の断面図を図1に示す。接続孔を有する絶縁シート(
4)とはポリエステルフィルム、ポリイミドフィルム、
ポリアミドイミドフィルム等のプラスチックフィルム(
6)或いはこれらのフィルム(6)の両側にアクリル樹
脂系の粘着剤(5)、エポキシ樹脂、フェノール/ブチ
ラール樹脂、フェノール/ NBR樹脂等の接着剤(5
)を塗布したものが用いられる。プラスチックフィルム
(6)の両面に接着剤(5)を塗布したものの断面図を
図2に、接続孔(7)を孔明した絶縁シート(4)の断
面図を図3に示す。プリントコイルパターンを接続する
際には、まずプリントコイルパターンの被接続箇所の中
央端(9)の片方もしくは両方に導電性物質(8)を載
置或いは塗布する。導電性物質とは板状、粒状の半田、
半田ペースト、録ペースト、銅ペースト等を言う。図4
にはプリントコイルパターン被接続箇所の中央端(9)
片側に導電体物質(8)を載置した例を示す。図4の導
電体物質(8)を載置したプリントコイルパターン(1
)の上に接続箇所を孔あけした絶縁シート(4)を接続
箇所を位置合せして重ね置く(図5)、その後もう一方
のプリントコイルパターン(1)の被接続箇所の中央端
(9(が前述の被接続箇所の中央端(9)と対向する様
に位置合せし重ね置く1 (図6)、載置或い1塗布し
た導電体物質をリフローし一上下回路間の導通を図る方
法としては熱盤上で加熱し溶融する方法或いは遠赤外線
の炉中を通し加熱溶融する方法、或いは高周波加熱する
方法等がある。The conductor used in the present invention is copper, aluminum, silver, etc., and the method for forming the spiral circuit (2) is to paste metal foil such as copper or aluminum foil over the entire surface of the insulating layer (3). There is a subtractive method in which only the necessary parts are left by etching, an additive method in which copper plating is applied to the necessary parts, and a method in which the circuit (2) is formed by screen printing copper paste, silver paste, etc. . The printed coil pattern obtained in this way (1
) is shown in Figure 1. Insulating sheet with connection holes (
4) Polyester film, polyimide film,
Plastic films such as polyamide-imide films (
6) Alternatively, apply an adhesive (5) such as acrylic resin adhesive (5), epoxy resin, phenol/butyral resin, phenol/NBR resin, etc. to both sides of these films (6).
) is used. FIG. 2 shows a cross-sectional view of a plastic film (6) coated with adhesive (5) on both sides, and FIG. 3 shows a cross-sectional view of an insulating sheet (4) with connecting holes (7) formed therein. When connecting printed coil patterns, first, a conductive substance (8) is placed or coated on one or both of the central ends (9) of the printed coil patterns to be connected. Conductive substances include plate-shaped, granular solder,
Refers to solder paste, recording paste, copper paste, etc. Figure 4
At the center end of the printed coil pattern connection point (9)
An example is shown in which a conductive material (8) is placed on one side. The printed coil pattern (1) on which the conductive material (8) of Figure 4 is placed
), align the connection points and place the insulating sheet (4) with holes for the connection points on top of it (Figure 5), then place the center end of the connection point of the other printed coil pattern (1) (9 A method of aligning and overlapping 1 (Fig. 6) so that it faces the center end (9) of the connection point described above, and reflowing the conductive material that has been placed or applied 1 to establish continuity between the upper and lower circuits. Examples include a method of heating and melting on a hot plate, a method of heating and melting through a far infrared rays furnace, and a method of high frequency heating.
(発明の効果)
本発明方法に従うとスルホールメッキ法の様に銅メッキ
を原付けする様な工程が長く、工数を多大に要する方法
に比較するとはるかに簡便で低コストで出来るものであ
る。又接続抵抗も0.03〜005Ωイp、と低く、−
60℃10分←100℃10分の温度ショックサイクル
テストを50サイクル行った後も接続抵抗の劣化は認め
られなかった。(Effects of the Invention) According to the method of the present invention, it is much simpler and can be done at a lower cost than the through-hole plating method, which requires a long process of applying copper plating and requires a large number of man-hours. Also, the connection resistance is low at 0.03~005Ω, -
No deterioration of the connection resistance was observed even after 50 cycles of a temperature shock cycle test of 60°C 10 minutes←100°C 10 minutes.
図1はプリントコイルパターンの断面図、図2は絶縁シ
ートの断面図、
図3は接続孔を孔明けした絶縁シートの断面図、
図4はプリントコイルパターンの被接続箇所に導電体を
載置した図、
図5は図4の接続箇所に孔あけした絶縁シートを位置合
せして重ね合せた図、
図6は被接続箇所を対向させ絶縁シートを介在させて位
置合せした図である。
1はプリントコイルパターン、4は絶縁シート、7は接
続孔、8は導電性物質、9はコイルの中央端OFigure 1 is a cross-sectional view of a printed coil pattern, Figure 2 is a cross-sectional view of an insulating sheet, Figure 3 is a cross-sectional view of an insulating sheet with connection holes, and Figure 4 is a conductor placed at the connection point of the printed coil pattern. FIG. 5 is a diagram in which the insulating sheets with holes drilled in the connection locations shown in FIG. 4 are aligned and superimposed, and FIG. 6 is a diagram in which the locations to be connected are opposed and aligned with the insulating sheet interposed. 1 is a printed coil pattern, 4 is an insulating sheet, 7 is a connection hole, 8 is a conductive material, 9 is a central end O of the coil
Claims (1)
トコイルの渦巻状回路の中央端同士を接続する方法にお
いて、渦巻状回路の導電体面同士を対向させ、中央端同
士を接続するための接続孔を有する絶縁シートを介在さ
せて、該接続孔を通じて導電性物質で中央端同士を接続
することを特徴とするプリントコイルパターンの接続方
法。In the method of connecting the center ends of the spiral circuit of a printed coil in which a spiral circuit is formed with a conductor on one side of an insulating layer, the conductor surfaces of the spiral circuit are faced to each other and the center ends are connected. 1. A method for connecting printed coil patterns, which comprises interposing an insulating sheet having a connection hole, and connecting the central ends with a conductive material through the connection hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6752284A JPS60211894A (en) | 1984-04-06 | 1984-04-06 | Method of connecting printed coil pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6752284A JPS60211894A (en) | 1984-04-06 | 1984-04-06 | Method of connecting printed coil pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60211894A true JPS60211894A (en) | 1985-10-24 |
Family
ID=13347387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6752284A Pending JPS60211894A (en) | 1984-04-06 | 1984-04-06 | Method of connecting printed coil pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60211894A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5246475A (en) * | 1975-10-09 | 1977-04-13 | Matsushita Electric Industrial Co Ltd | Printed substrate unit |
| JPS613119A (en) * | 1984-06-16 | 1986-01-09 | Canon Inc | display device |
-
1984
- 1984-04-06 JP JP6752284A patent/JPS60211894A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5246475A (en) * | 1975-10-09 | 1977-04-13 | Matsushita Electric Industrial Co Ltd | Printed substrate unit |
| JPS613119A (en) * | 1984-06-16 | 1986-01-09 | Canon Inc | display device |
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