JPS60211902A - Laser trimming device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a laser processing device, and particularly to a laser IJ trimming device that can perform laser trimming with high efficiency.

[Background of the invention]

2. Description of the Related Art Conventionally, there has been known a laser trimming device as shown in FIG. 1, which adjusts the resistance value by forming an iso pattern on a resistor printed on a substrate using a laser beam. That is, numeral 1 is a laser oscillator, which is equipped with two Q-switches to obtain a single pulse with a narrow pulse width and a large peak value.

A reflecting mirror 4 tilted at 45 degrees is disposed on the optical path so as to irradiate the workpiece 6 on the main body station 7 placed perpendicularly to the laser oscillator 1 with the laser beam 3 from the laser oscillator 1. I'll tell you.

The laser beam 3 reflected by this reflecting mirror 4 is transmitted to a scanning optical section 5.
The light is incident on the object B, and is focused and scanned here to match the processing position of the workpiece B.

The measurement control section 9 controls the stopping of the oscillation tube of the laser oscillator 1, the scanning of the laser beam by the scanning optical section 5, the measurement of the resistance value of the workpiece 6, and the like. Note that 8 is a control line.

Function trimming using such a laser trimmer device operates the entire circuit of a thick film module, which is a target product for laser processing, and causes the circuit characteristic t to match a desired target value.

However, in actual trimming, the time it takes for the circuit to stabilize after circuit switching and the measurement time after trimming take up a large proportion of the time, accounting for more than half of the total working time. For this reason, the laser oscillation time of the trimmer device is short, and the laser oscillation efficiency is extremely low.

The processing state of such a conventional laser trimming device is as shown in FIG. 3 when expressed in terms of a timing chart. Note that the horizontal axis represents the passage of time, and the vertical axis represents the amount of laser light irradiation. Therefore, it is clear from this figure that
The rectangular area where the trimming process is actually performed is extremely small.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a laser trimming device that increases laser oscillation efficiency and enables efficient laser trimming work.

[Summary of the invention]

In order to achieve the above object, in the present invention, a laser beam oscillated from a laser oscillator is received by a deflector,
The deflector is used to deflect multiple optical paths, and on each optical path, a scan optical section that focuses and scans the laser beam and a station section that places the workpiece are installed. A laser trimming device is provided in which an optical section and a station section are controlled by a measurement control section.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described with reference to all the drawings. Note that the same reference numerals are given to the middle portions of the drawings. FIG. 2 is a configuration diagram showing an example of a laser trimming device according to the present invention.

Reference numeral 1 designates a laser oscillator, which is equipped with a Q switch 2f to obtain a single pulsed laser beam having a narrow pulse width and a large peak value.

As a method for the Q switch 2, for example, an electro-optical element is placed in a resonator, and the direction of polarization is completely controlled by applying a voltage from the outside. Laser oscillator 1
The laser beam 3 irradiated from is incident on the deflector 10,
be done. The deflector 10 switches and deflects the laser beam 3 so as to obtain a plurality of optical paths. In this embodiment, two optical paths are selected. First, the laser beam 31 that has passed through the first optical path is bent at a right angle by a reflecting mirror 41 arranged on the optical path at an angle of 45 degrees.

This is because the resistor 61, which is the workpiece, is placed in a direction perpendicular to the laser oscillator 1.

The laser beam 31 whose optical path has been bent by the reflecting mirror 41 enters a scanning optical section 51 disposed in front of the optical path.

The scanning optical section 51 is for condensing the laser beam 31i and further scanning so as to be suitable for trimming work. All the workpieces are placed at positions where they can be optimally irradiated with this focused laser beam 31. The laser beam 31° is then scanned by the scanning optical section 51 to form a desired groove on the resistor 61 printed on the substrate 71. During this trimming work, the resistance value of the resistor 61 is sequentially measured by the measurement control section 9, and the scanning of the scanning optical section 51 is similarly controlled by the measurement control section 9 according to the data. 8 is a control line.

Next, the entire case where the laser beam 3 is deflected to the second optical path by the deflector 10 will be explained.

Laser light 32 whose optical path is deflected by the deflector 10
is bent at right angles by two reflecting mirrors 42 and 43 arranged on the optical path. The inclination of the first reflecting mirror 42 is set so that the laser beam travels parallel to the direction of the shield irradiated from the laser oscillator 1, and the second reflecting mirror 43 is provided at an angle of 45°. The laser beam 32 is bent at a right angle. As in the case where the laser beam 31 travels along the first optical path, the laser beam 62 whose optical path is completely bent by the reflecting mirrors 42 and 46 enters the scanning optical section 52 disposed in front of the optical path.

The laser beam 32 is focused by a scanning optical section 52 and scanned. This scanning optical section 52 may be the same as 51. A resistor 62, which is a workpiece, is placed at a position where this focused laser light 32 is optimally irradiated. Then, the laser beam 32 is scanned by the scanning optical section 52, and the substrate 72 is scanned.
Form the desired grooves on the printed resistor 62. In addition, as in the case of the first optical path, the control of the scanning optical section 52, the oscillation/stop control of the laser oscillator 1, and the resistor 62
The measurement of the resistance value is carried out by the measurement control section 9, respectively.

Trimming processing using the laser trimming device configured as described above is performed as follows.

First, the measurement control unit 9 positions the resistor 61 for desired processing, and then the light focusing and scanning of the scan optical unit 51 is checked in accordance with the processing position. Then,
The measurement control unit 9 controls the deflector 10 to deflect the light to the first optical path. When this series of preparatory work before the start of processing is completed, the measurement control unit oscillates one nine-piece laser oscillator,
Irradiate the laser beam 3. While the grooves are being formed to obtain the desired resistance value, the measurement control section 9 checks the positioning of the resistor 62 on the second optical path and the condensing scan of the scanning optical section 52. Trimming is performed while the resistance value of the resistor 61 is successively measured by the measurement control section 9. When one process is completed, the measurement control unit 9 immediately controls the deflector 10,
The laser beam 3 is deflected to a second optical path. Then, laser trimming of the resistor 62 is performed in the same manner.

During this time, the measurement control unit 9 again performs the positioning of the resistor 610 on the first optical path for subsequent processing.

These operations are repeated until all of the resistors 61 and 62 printed on the substrates 71 and 72 have been processed. Note that the above-described series of preparatory operations before the start of processing do not necessarily have to be performed in a fixed order, and can be changed depending on the content of trimming.

What is the processing status of the laser trimming device according to the present invention? FIG. 4 shows a timing chart. Note that, similarly to FIG. 3, the horizontal axis represents the passage of time, and the vertical axis represents the amount of laser light irradiation. In addition, ST1 describes the processing state when the laser beam is deflected to the first optical path, and ST2
shows the processing state when the laser beam is deflected to the second optical path. As is clear from this, there is very little loss time during the entire working time when the laser beam is not irradiated.Laser oscillation? It can be done efficiently. Board 71
Alternatively, if the time it takes for the circuit characteristics to stabilize when all the circuits on the board 72 are operated, the time it takes to measure the circuit characteristics, or the time it takes to focus and scan the laser beam at a predetermined position, the laser beam The time during which laser oscillation is stopped can be reduced to zero by increasing the number of optical path deflections and correspondingly increasing the number of scanning optical sections and station sections. The deflector 10 may be a galvanometer-type optical scanner or one that mechanically rotates a mirror to deflect the deflector, but if it is compatible with an ultra-high-speed single pulse, an electro-optical switch having the Pockels effect may be used. It is preferable to adopt it.

〔Effect of the invention〕

According to the present invention, the laser beam oscillated from one laser oscillator can be laser trimmed at multiple locations via multiple scanning optical sections using an arbitrary time division control method, so that the laser oscillation time can be adjusted. It is possible to set it to the maximum.

Therefore, it is possible to significantly improve the laser oscillation efficiency. Furthermore, since the laser trimming device according to the present invention can perform processing at multiple locations, compared to conventional laser trimming devices, the processing capacity is dramatically increased, and the investment efficiency for expensive equipment is extremely high. can be taken as a thing.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram showing the basic configuration of a conventional laser trimming device, and FIG. 2 is a diagram showing a laser according to an embodiment of the present invention.
Basic configuration of J-ming device? The configuration diagram shown in Fig. 3 is a conventional laser) Processing status of IJ mining equipment? FIG. 4 is a timing chart showing the processing state of a laser trimming apparatus according to an embodiment of the present invention. 1...Laser oscillator 2...Q switch 3...Laser light 4.41.42.43...Reflector 5, 51.
52...Scanning optical section 6, 61.62...Workpiece 7...Methsion section 9...Measurement control section ■1 Fig. 27 No. 37 No. 4

Claims (1)

[Claims] A laser oscillator and the laser light emitted from this laser oscillator? A deflector that deflects into two or more optical paths, two or more scanning optical sections that respectively correspond to the Q optical path and focus and scan the laser beam deflected by the deflector over the entire workpiece, and a workpiece that is loaded. 7. A laser trimming device comprising a station section for controlling the resistance value of a workpiece, and a measurement control section for controlling oscillation and stopping of the laser oscillator and scanning control of the scanning optical section according to the resistance value of the workpiece.