JPS6022331A - Selection of semiconductor pellet - Google Patents
Selection of semiconductor pelletInfo
- Publication number
- JPS6022331A JPS6022331A JP58131415A JP13141583A JPS6022331A JP S6022331 A JPS6022331 A JP S6022331A JP 58131415 A JP58131415 A JP 58131415A JP 13141583 A JP13141583 A JP 13141583A JP S6022331 A JPS6022331 A JP S6022331A
- Authority
- JP
- Japan
- Prior art keywords
- pellets
- pellet
- rejectable
- flat plate
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
Abstract
Description
【発明の詳細な説明】
通常半導体素子製造においては、ウェーハエ程が終了す
ると、スクジイバ、ダイサ等を用いて。DETAILED DESCRIPTION OF THE INVENTION In general, in semiconductor device manufacturing, after the wafer processing is completed, a screwdriver, a dicer, etc. are used.
個々のペレットに分割し、それからペレットの選別を行
なっている。この場合、ペレットはテープに貼シ付いた
状態で選別を行い、不良品除去後そのまま組立工程等へ
まわされる。It is divided into individual pellets and then the pellets are sorted. In this case, the pellets are sorted while stuck to the tape, and after defective products are removed, they are directly sent to the assembly process, etc.
しかしながら、半導体デバイスの設計上前記方法を用い
ることが出来ない場合が生じる。たとえば、高出力用半
導体デバイスの様に、消費電力が大きφため素子での発
熱が多く、素子の安定動作。However, there may be cases where the above method cannot be used due to the design of the semiconductor device. For example, high power semiconductor devices consume a lot of power and generate a lot of heat in the element, making it difficult for the element to operate stably.
信頼度の面からペレットの熱抵抗を小さくシ、素子の動
作温度を下げる必要がある。このため、熱伝導の悪い半
導体ペレットの厚さを数十μｍまで薄くすることになる
が、この程度の厚さになると、ウェーハでは機械的強度
がもたずに割れやすくなるので、石英板等の平板にウェ
ーハをワックス吟で貼り付けた後に、ウェーハの薄化、
ウェーハ裏面のメタライズおよびウェーハのベレッタイ
ズ等が行なわれる。From the standpoint of reliability, it is necessary to reduce the thermal resistance of the pellet and lower the operating temperature of the device. For this reason, the thickness of the semiconductor pellet, which has poor thermal conductivity, has to be reduced to several tens of micrometers, but at this thickness, the wafer does not have mechanical strength and is easily broken, so quartz plates etc. After pasting the wafer on a flat plate with wax, thinning the wafer,
Metallization of the back surface of the wafer, wafer pelletization, etc. are performed.
ところが、この場合は、個々のペレットがワックス等で
平板に貼シ付けられてしまって−るために、そのままの
状態ではペレット選別および不良品の除去を行うことが
出来ないので、従来はワックス等を有機溶剤で溶かし、
ペレットをはらｄらにしてペレット洗浄を行−１再度ベ
レットヲ並べ直してから、外観検査等のペレット選別を
行っていた。However, in this case, since the individual pellets are pasted onto a flat plate with wax, etc., it is impossible to sort the pellets and remove defective products in that state. Dissolve with an organic solvent,
After emptying the pellets and washing the pellets, the pellets were rearranged again and the pellets were sorted by visual inspection.
この方法では、良品のペレットも不良のペレットも全数
をベレット洗浄、ペレット並べ等の工程を行うために、
ペレットの選別工数が非常にかかり、原価低減、生産量
確保の点で大きな支障になっていた。In this method, all good and bad pellets are washed, pellets are sorted, etc.
The process required a lot of man-hours to sort the pellets, which was a major hindrance to reducing costs and securing production volume.
本発明の目的は、ウェーハから分割して平板に貼り付け
た状態のままのペレットの選別、不良ペレットの除去を
行うことによシ、著しい選別工数の低減を可能にした半
導体ベレットの選別方法を提供するにある。An object of the present invention is to provide a method for sorting semiconductor pellets that makes it possible to significantly reduce the number of steps required for sorting by sorting pellets that have been separated from a wafer and pasted onto a flat plate, and removing defective pellets. It is on offer.
本発明方法は、透明平板に貼付けられた半導体の検査に
よシ見出された不良ペレット部分に前記透明平板を通し
てレーザ光全当て前記不良ベレット部分の貼シ付は剤を
局部的に加熱し溶融する工程と、前記不良ペレットヲ真
空吸引によシ前記透明平板から除去する工程とを含む構
成を有する。In the method of the present invention, a laser beam is passed through the transparent flat plate to a defective pellet portion found by inspection of a semiconductor pasted on a transparent flat plate, and the pasting agent for the defective pellet portion is locally heated and melted. and a step of removing the defective pellets from the transparent flat plate by vacuum suction.
つぎに本発明を実施例により説明する。Next, the present invention will be explained by examples.
第１図は本発明方法を説明するための、透明平板に貼グ
付けられているペレットの断面図である。FIG. 1 is a sectional view of a pellet pasted on a transparent flat plate for explaining the method of the present invention.
第１図において５石英板などの透明平板１に、透明ワッ
クスなどの貼り付は剤２を用いて貼り付けた半導体ウェ
ーハに対し、分割工程を経て個々のペレット３に分割き
れている。平板１も貼り付は剤２も透明であるから、透
明平板１全通して顕微鏡４によシ十分な外観検査を行う
。この検査結果見出された、良品基準を満足しない不良
ペレット３ａｌＣ対し、ペレッ）３ａの部分の貼り付は
剤に透明平板１全通して、レーザ光５を当てて、貼り付
は剤２を局部的に加熱軟化させ、接着強度を弱める。そ
れから、その部分に真空吸引ノズル６を近付ける仁とに
よって、不良ベレン）３ａのみをノズル６に吸引させて
透明平板１から除去する。In FIG. 1, a semiconductor wafer is pasted onto a transparent flat plate 1 such as a quartz plate using a transparent wax or the like using an agent 2, which is then divided into individual pellets 3 through a dividing process. Since both the flat plate 1 and the adhesive 2 are transparent, a thorough visual inspection is carried out using the microscope 4 through the entire transparent flat plate 1. For the defective pellets 3alC which were found as a result of this inspection and did not satisfy the quality standards, the pellets 3a were pasted by passing the agent through the entire transparent flat plate 1 and irradiating the laser beam 5, and applying the agent 2 locally. heat to soften and weaken the adhesive strength. Then, by bringing the vacuum suction nozzle 6 close to that part, only the defective belenium 3a is sucked into the nozzle 6 and removed from the transparent flat plate 1.
このような本発明方法によると、平板に貼り付けたウェ
ーハをペレットに分割したままの平板に貼シ付けられて
いるペレットを全数検査することにより、良品ペレット
のみが平板に残り、不良ベレットは全て手際よく除去す
ることができる。さらに、顕微鏡４．レーザ光５の照射
位置と吸引ノズル６の゛位置を同期して動かすことによ
り、極めて効率よく短時間にペレットの選別が□できる
という効果が得られる。According to the method of the present invention, by inspecting all the pellets stuck to the flat plate while dividing the wafer stuck to the flat plate into pellets, only good pellets remain on the flat plate and all defective pellets are removed. It can be removed easily. Furthermore, microscope 4. By moving the irradiation position of the laser beam 5 and the position of the suction nozzle 6 in synchronism, it is possible to obtain the effect that pellets can be sorted extremely efficiently and in a short time.
第１図は本発明の一実施例を説明するための透明平板と
それに貼り付けられているベレット洗浄す断面図である
。
１・・・・・・透明平板、２・・・・・・貼り付は剤、
３・・・・・・半導体ペレット、３ａ・・・・・・不良
ペレット、４・・・・・・顕微鏡、５・・・・・・レー
ザ光、６・・・・・・吸引ノズル。
代理人 弁理士 内 原 ｗｃ 、／−−づ゛日ｆ
口
Ｚ７図FIG. 1 is a sectional view of a transparent flat plate and a cleaning pellet attached thereto for explaining one embodiment of the present invention. 1... Transparent flat plate, 2... Pasting agent,
3... Semiconductor pellet, 3a... Defective pellet, 4... Microscope, 5... Laser light, 6... Suction nozzle. Agent: Patent Attorney Uchihara Wc, /--Z゛日f 口Z7Figure
Claims (1)
分割する工程と、前記透明平板を通してペレットの外観
を検査する工程と、不良ペレット部分に透明平板を通し
てレーザ光を当て該不良ペレット部分の貼り付は剤を局
部的に加熱し溶融する工程と、該不良ペレッ）１真空吸
引し除去する工程とを含むことを特徴とする半導体ベレ
ット選別方法。A process of dividing a semiconductor wafer pasted onto a transparent flat plate into pellets, a process of inspecting the appearance of the pellets through the transparent flat plate, and a process of applying a laser beam to the defective pellet portion through the transparent flat plate and pasting the defective pellet portion with an agent. 1. A semiconductor pellet sorting method comprising the steps of locally heating and melting the defective pellets, and removing the defective pellets by vacuum suction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58131415A JPS6022331A (en) | 1983-07-19 | 1983-07-19 | Selection of semiconductor pellet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58131415A JPS6022331A (en) | 1983-07-19 | 1983-07-19 | Selection of semiconductor pellet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6022331A true JPS6022331A (en) | 1985-02-04 |
Family
ID=15057429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58131415A Pending JPS6022331A (en) | 1983-07-19 | 1983-07-19 | Selection of semiconductor pellet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6022331A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6392038A (en) * | 1986-10-06 | 1988-04-22 | Matsushita Electric Ind Co Ltd | Chip feeding method |
| JPS63151815A (en) * | 1986-12-17 | 1988-06-24 | Nippon Denso Co Ltd | Apparatus for displaying displacement quantity |
| JPS6431432A (en) * | 1987-07-27 | 1989-02-01 | Nec Corp | Releasing method for chips |
-
1983
- 1983-07-19 JP JP58131415A patent/JPS6022331A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6392038A (en) * | 1986-10-06 | 1988-04-22 | Matsushita Electric Ind Co Ltd | Chip feeding method |
| JPS63151815A (en) * | 1986-12-17 | 1988-06-24 | Nippon Denso Co Ltd | Apparatus for displaying displacement quantity |
| JPS6431432A (en) * | 1987-07-27 | 1989-02-01 | Nec Corp | Releasing method for chips |
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