JPS602385B2 - Sputtering deposition method for synthetic resin products - Google Patents
Sputtering deposition method for synthetic resin productsInfo
- Publication number
- JPS602385B2 JPS602385B2 JP5493677A JP5493677A JPS602385B2 JP S602385 B2 JPS602385 B2 JP S602385B2 JP 5493677 A JP5493677 A JP 5493677A JP 5493677 A JP5493677 A JP 5493677A JP S602385 B2 JPS602385 B2 JP S602385B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- synthetic resin
- layer
- metal powder
- deposition method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003002 synthetic resin Polymers 0.000 title claims description 16
- 239000000057 synthetic resin Substances 0.000 title claims description 16
- 238000004544 sputter deposition Methods 0.000 title claims description 15
- 238000000151 deposition Methods 0.000 title description 6
- 229910052751 metal Inorganic materials 0.000 claims description 44
- 239000002184 metal Substances 0.000 claims description 44
- 239000000843 powder Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 22
- 238000007740 vapor deposition Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 239000010410 layer Substances 0.000 description 39
- 230000008021 deposition Effects 0.000 description 3
- 238000001883 metal evaporation Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
Description
【発明の詳細な説明】
本発明は、合成樹脂製品へのスパッタリング蒸着方法に
関するもので、さらに詳言すれば、合成樹脂製品表面へ
のスパッタリング黍着により成形された金属蒸着層の密
着力をより強力にすることを目的としたものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a sputtering deposition method for synthetic resin products, and more specifically, the present invention relates to a method for sputtering deposition onto synthetic resin products, and more specifically, it improves the adhesion of a metal deposition layer formed by sputtering onto the surface of a synthetic resin product. It is intended to be powerful.
合成樹脂製品の表面に装飾その他の目的で金属膜を一体
に被覆成形する手段が多数あるが、これらの手段のうち
、スパッタリング蒸着法は、真空蒸着法に比べて蒸着層
形成までの時間が長いことを除いては、手軽に実施でき
ること、そして蒸着層の合成樹脂母体への密着力が強い
こと等の利点がある。There are many methods for integrally coating the surface of a synthetic resin product with a metal film for decoration or other purposes, but among these methods, sputtering deposition takes a longer time to form a deposited layer than vacuum deposition. Other than this, there are advantages such as ease of implementation and strong adhesion of the vapor deposited layer to the synthetic resin matrix.
しかしながら、この種の金属蒸着層に一般的に言えるこ
とであるが、例えスパッタリング蒸着法による金属黍着
層であっても、合成樹脂母体とこの金属蒸着層との間の
密着力にはまだまだ不満があり、現実に多くの剥離によ
る不都合が発生している。However, as is generally the case with this type of metal evaporation layer, even if the metal evaporation layer is made by sputtering, the adhesion between the synthetic resin matrix and this metal evaporation layer is still unsatisfactory. In reality, many inconveniences due to peeling occur.
本発明は、上記した従来のスパッタリング蒸着法におけ
る合成樹脂製品表面への金属蒸着層の密着力の弱対こ関
する不満を解消すべ〈創案されたもので、以下本発明を
、その一実施例を示す図面を参照しながら説明する。The present invention was created to solve the above-mentioned dissatisfaction with the weak adhesion of a metal vapor deposited layer to the surface of a synthetic resin product in the conventional sputtering vapor deposition method. This will be explained with reference to the drawings shown.
本発明によるスパッタリング蒸着方法は、母材ｌａであ
る合成樹脂材料中に適量の金属粉ｌｂを混入して成形さ
れた基体層１の表面に、スパッタリング蒸着法により金
属蒸着層２を積層成形するのである。In the sputtering vapor deposition method according to the present invention, a metal vapor deposited layer 2 is laminated by a sputtering vapor deposition method on the surface of a base layer 1 formed by mixing an appropriate amount of metal powder lb into a synthetic resin material which is a base material la. be.
母材ｌａ中に金属粉ｌｂを混入して成形される基体層１
は、その形状および厚みが限定されるものではなく、ど
のような形状および値であっても良い。Base layer 1 formed by mixing metal powder lb into base material la
is not limited in its shape and thickness, and may have any shape and value.
基体層１は、適当な合成樹脂材料である母材ｌａと、こ
の母材ｌａ内に適量混入される金属粉ｌｂとから構成さ
れている。The base layer 1 is composed of a base material la that is a suitable synthetic resin material, and a suitable amount of metal powder lb mixed into the base material la.
金属粉ｌｂとしては種々のものがあり、例えば、金、銀
、銅、鉄、ニッケル、アルミ、クロム等の金属粉および
ステンレス、黄鋼等の合金粉等があるが、この金属粉ｌ
ｂの種類選定は、成形される合成樹脂製品の使用目的、
使用環境、そしてスパッタリング蒸着を施す目的に応じ
て行なう必要がある。There are various kinds of metal powders, such as metal powders such as gold, silver, copper, iron, nickel, aluminum, and chromium, and alloy powders such as stainless steel and yellow steel.
The selection of type b is based on the purpose of use of the synthetic resin product to be molded,
It is necessary to carry out the process according to the usage environment and the purpose of sputtering deposition.
この金属粉ｌｂは、母材ｌａが所定形状に成形される以
前に溶融状態にある母材ｌａ成形用の合成樹脂材料中に
適量混入され、充分に瀦拝・混練した後母材ｌａと一体
に所定形状に成形される。This metal powder lb is mixed in an appropriate amount into the synthetic resin material for molding the base material la which is in a molten state before the base material la is molded into a predetermined shape, and after being sufficiently worshiped and kneaded, it is integrated with the base material la. It is molded into a predetermined shape.
それゆえ、この金属粉ｌｂは母材ｌａ内および母材ｌａ
表面に分散位置することになる。母材ｌａ内に混入され
る金属粉ｌｂの量としては、特に限定されるものではな
いが、基体層１表面に位置する金属蒸着層２の金属粉ｌ
ｂとの接触面積をできる限り増大させる意味からはその
量を充分に多くしてあげることが望ましいが、基体層１
に要求される機械的強度、成形された製品の価格、要求
される基体層１と金属蒸着層２との密着の強さ程度等に
よって選定する必要がある。Therefore, this metal powder lb is contained in the base material la and in the base material la.
They will be located dispersed on the surface. The amount of metal powder lb mixed into the base material la is not particularly limited;
Although it is desirable to increase the amount sufficiently in order to increase the contact area with base layer 1 as much as possible,
It is necessary to select the material according to the mechanical strength required for the molded product, the price of the molded product, the required degree of adhesion between the base layer 1 and the metal vapor deposited layer 2, etc.
このように基体層１は母材ｌａ内に金属粉ｌｂを混入し
た状態で成形されたものであるから、基体層１の表面に
はいちめんに金属粉ｌｂが位置することになる。それゆ
え、このいちめんに金属粉ｌｂが位置した基体層１の表
面にスパッタリング蒸着法により蒸着された金属蒸着層
２は、この基体層１表面に位置した金属粉ｌｂと一体に
接合することになる。Since the base layer 1 is thus formed with the metal powder lb mixed into the base material la, the metal powder lb is located all over the surface of the base layer 1. Therefore, the metal vapor deposited layer 2 deposited by sputtering vapor deposition on the surface of the base layer 1 on which the metal powder lb is located is integrally bonded to the metal powder lb located on the surface of the base layer 1. Become.
所が、基体層１の表面に位臆しているとはいえ、金属粉
ｌｂは母材ｌａ内にあるものであるから、この金属粉ｌ
ｂが基体層１から離脱することがなく、このため基体層
１表面に蒸着された金属蒸着届２は極めて強力に密着す
ることになる。However, although the metal powder lb is located on the surface of the base layer 1, since the metal powder lb is present in the base material la, this metal powder lb
b does not separate from the base layer 1, and therefore the metal vapor deposition layer 2 deposited on the surface of the base layer 1 is extremely tightly adhered.
この基体層１の表面に位置した金属粉ｌｂと蒸着層２と
の関係は、第２図の一部拡大図から明らかな如く、母材
ｌａ内に混入された金属粉ｌｂがその一部を基体層１表
面上に突出させ、このため蒸着層２と基体層１の表面全
域に位置した金属粉ｌｂとが直接接触することになり、
この際この直接接触する金属粉ｌｂと蒸着層２とは溶着
に近い状態で一体に結合するのである。所で、金属粉ｌ
ｂに使用される金属の種類と金属蒸着層２形成に使用さ
れる金属の種類とは必ずしも限定されるものではないが
、金属粉ｌｂと金属蒸着層２とにより強力な密着を望む
場合には、この金属粉ｌｂと金属葵着層２とを同一の金
属材料とするのが良い。以上の説明から明らかな如く、
本発明は、基体層１内に位置する金属粉ｌｂとスパッタ
リング蒸着された金属蒸着届２とが一体に接合するので
金属蒸着届が他の蒸着法に比べて強力に合成樹脂製品の
表面に密着するスパッタリング蒸着法による金属蒸着層
２の基体層１への密着力をさらに強大にすることができ
、また基体層１は、単に母材ｌａの成形材料である合成
樹脂材料中に金属粉ｌｂを適量混入して成形すれば良い
ので、その成形が極めて簡単である等製品強度上および
製作上多くの優れた効果を有するものである。As is clear from the partially enlarged view of FIG. 2, the relationship between the metal powder lb located on the surface of the base layer 1 and the vapor deposition layer 2 is such that the metal powder lb mixed into the base material la partially The metal powder lb is made to protrude above the surface of the base layer 1, so that the vapor deposition layer 2 and the metal powder lb located over the entire surface of the base layer 1 come into direct contact with each other.
At this time, the metal powder lb and the vapor deposited layer 2, which are in direct contact with each other, are bonded together in a state close to welding. By the way, metal powder
The type of metal used for b and the type of metal used for forming the metal vapor deposited layer 2 are not necessarily limited, but if stronger adhesion between the metal powder lb and the metal vapor deposited layer 2 is desired, It is preferable that the metal powder lb and the metal adhesive layer 2 are made of the same metal material. As is clear from the above explanation,
In the present invention, the metal powder lb located in the base layer 1 and the metal vapor deposition layer 2 deposited by sputtering are integrally joined, so that the metal vapor deposition layer adheres to the surface of the synthetic resin product more strongly than in other vapor deposition methods. The adhesion of the metal vapor deposited layer 2 to the base layer 1 by the sputtering deposition method can be further strengthened, and the base layer 1 can be formed simply by adding metal powder lb into the synthetic resin material that is the molding material of the base material la. Since it is only necessary to mix an appropriate amount and mold it, it has many excellent effects in terms of product strength and manufacturing, such as extremely simple molding.
第１図は、本発明方法により成形された製品の構造例を
示す縦断面図である。
第２図は、第１図中丸印した部分の拡大図である。符号
の説明、１：基体層、ｌａ；母材、ｌｂ；金属粉、２；
金属蒸着層。
ノガ ／２軒
券２靴FIG. 1 is a longitudinal sectional view showing an example of the structure of a product molded by the method of the present invention. FIG. 2 is an enlarged view of the portion circled in FIG. 1. Explanation of symbols: 1: Base layer, la: Base material, lb: Metal powder, 2;
Metal evaporated layer. Noga / 2 tickets, 2 shoes
Claims (1)
を混入して成形された基体層１の表面に、スパツタリン
グ蒸着法により金属蒸着層２を積層成形する合成樹脂製
品へのスパツタリング蒸着方法。1 Appropriate amount of metal powder 1b in the synthetic resin material that is the base material 1a
A sputtering vapor deposition method for synthetic resin products, in which a metal vapor deposited layer 2 is laminated and molded by a sputtering vapor deposition method on the surface of a base layer 1 formed by mixing the metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5493677A JPS602385B2 (en) | 1977-05-13 | 1977-05-13 | Sputtering deposition method for synthetic resin products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5493677A JPS602385B2 (en) | 1977-05-13 | 1977-05-13 | Sputtering deposition method for synthetic resin products |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53139677A JPS53139677A (en) | 1978-12-06 |
| JPS602385B2 true JPS602385B2 (en) | 1985-01-21 |
Family
ID=12984507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5493677A Expired JPS602385B2 (en) | 1977-05-13 | 1977-05-13 | Sputtering deposition method for synthetic resin products |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS602385B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01210342A (en) * | 1988-02-19 | 1989-08-23 | Koito Mfg Co Ltd | Method for manufacturing multicolor rim containing metallic color |
-
1977
- 1977-05-13 JP JP5493677A patent/JPS602385B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53139677A (en) | 1978-12-06 |
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